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公开(公告)号:US07573283B2
公开(公告)日:2009-08-11
申请号:US11765019
申请日:2007-06-19
申请人: Axel Schmidt , Frank Fehrmann , Ulf Hackius , Stojan Kanev , Steffen Laube , Jorg Kiesewetter
发明人: Axel Schmidt , Frank Fehrmann , Ulf Hackius , Stojan Kanev , Steffen Laube , Jorg Kiesewetter
IPC分类号: G01R31/06
CPC分类号: G01R31/2891
摘要: A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.
摘要翻译: 公开了一种用于测量探针台中的晶片和其它半导体部件的方法,其用于电子部件的检查和测试。 被测器件由卡盘和至少一个电探头通过探针支架和被测器件保持,并且探针通过具有电驱动器的定位装置相对于彼此选择性地定位,并且被测器件被接触。 定位装置的驱动器保持在准备状态,直到建立接触并且在建立接触之后和在测试装置的测量之前被关闭。
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公开(公告)号:US20080315903A1
公开(公告)日:2008-12-25
申请号:US11765019
申请日:2007-06-19
申请人: Axel SCHMIDT , Frank FEHRMANN , Ulf HACKIUS , Stojan KANEV , Steffen LAUBE , Jorg KIESEWETTER
发明人: Axel SCHMIDT , Frank FEHRMANN , Ulf HACKIUS , Stojan KANEV , Steffen LAUBE , Jorg KIESEWETTER
CPC分类号: G01R31/2891
摘要: A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.
摘要翻译: 公开了一种用于测量探针台中的晶片和其它半导体部件的方法,其用于电子部件的检查和测试。 被测器件由卡盘和至少一个电探头通过探针支架和被测器件保持,并且探针通过具有电驱动器的定位装置相对于彼此选择性地定位,并且被测器件被接触。 定位装置的驱动器保持在准备状态,直到建立接触并且在建立接触之后和在测试装置的测量之前被关闭。
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