Method for measurement of a device under test
    1.
    发明授权
    Method for measurement of a device under test 有权
    被测设备的测量方法

    公开(公告)号:US07573283B2

    公开(公告)日:2009-08-11

    申请号:US11765019

    申请日:2007-06-19

    IPC分类号: G01R31/06

    CPC分类号: G01R31/2891

    摘要: A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.

    摘要翻译: 公开了一种用于测量探针台中的晶片和其它半导体部件的方法,其用于电子部件的检查和测试。 被测器件由卡盘和至少一个电探头通过探针支架和被测器件保持,并且探针通过具有电驱动器的定位装置相对于彼此选择性地定位,并且被测器件被接触。 定位装置的驱动器保持在准备状态,直到建立接触并且在建立接触之后和在测试装置的测量之前被关闭。

    Method and prober for contacting a contact area with a contact tip
    2.
    发明申请
    Method and prober for contacting a contact area with a contact tip 有权
    用于将接触区域与接触尖端接触的方法和探测器

    公开(公告)号:US20050007135A1

    公开(公告)日:2005-01-13

    申请号:US10879622

    申请日:2004-06-29

    IPC分类号: G01R31/28 G01R31/02

    CPC分类号: G01R31/2886

    摘要: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.

    摘要翻译: 接触区域与探针中的接触针尖(接触尖端)接触的方法以及这种探测器的布置的方法基于确保可靠接触和直接观察触点之间的接触的建立的目的 接触小尺寸接触垫时的接触面和接触面积。 探测器基本上包括具有移动装置的基架,该移动装置包括用于接收半导体晶片的夹持夹具以及与半导体晶片的自由表面相对布置的接触针。 接触尖端的接触最初需要半导体晶片的水平定位,使得接触面和接触尖端彼此之间并且彼此间隔一定距离,随后沿接触尖端的方向垂直移动, 直到接触尖端与接触区域的接触被建立。 该目的是通过半导体晶片的垂直移动直到达到最终位置在水平观察方向上直接观察为目的,为此目的,观察装置以这样的方式布置,使得观察轴以间隔 在自由晶片表面上方。

    METHOD FOR TESTING ELECTRONIC COMPONENTS OF A REPETITIVE PATTERN UNDER DEFINED THERMAL CONDITIONS
    3.
    发明申请
    METHOD FOR TESTING ELECTRONIC COMPONENTS OF A REPETITIVE PATTERN UNDER DEFINED THERMAL CONDITIONS 有权
    根据定义的热条件测试重复图案的电子元件的方法

    公开(公告)号:US20110221461A1

    公开(公告)日:2011-09-15

    申请号:US13119916

    申请日:2009-09-01

    IPC分类号: G01R31/00

    摘要: The invention relates to a method for testing several electronic components (1) of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck (10) for holding the components (1) and special holding devices (15) for holding individual probes (12). For testing, the components (1) are adjusted to a defined temperature, the (12) and a first electronic component (1) are positioned relative to each other by means of at least one positioning device, contact pads (3) of the electronic component (1) are subsequently contacted by the probes (12) so that the component (1) can be tested and then the positioning and the contacting can be repeated for testing another component (1) of the repetitive pattern. In order to shorten the test time for measurements at changing temperatures while ensuring reliable contacting of the components by using individual probes, a component (1) is positioned and contacted by a first positioning step which jointly affects all probes (12) first being carried out in an intermediate position, in the result of which the component (1) lies at a defined distance under the probe tips (13), the position of each individual probe tip (13) being subsequently corrected by means of separate manipulators to the position of the corresponding contact pad (3) to be contacted with the particular probe tip (13) so that each probe tip (13) lies above a contact pad (3), and the probe tips (13) further subsequently being brought into contact with the contact pads (3) of the component (1) by means of an advancing movement.

    摘要翻译: 本发明涉及一种用于在探测器中在限定的热条件下测试多个重复图案的电子部件(1)的方法,其包括用于保持部件(1)的卡盘(10)和用于保持个人的特殊保持装置(15) 探针(12)。 为了测试,组件(1)被调节到限定的温度,(12)和第一电子部件(1)通过至少一个定位装置相对于彼此定位,电子的接触垫(3) 组件(1)随后被探针(12)接触,使得可以测试组件(1),然后重复定位和接触以测试重复图案的另一组件(1)。 为了缩短在变化的温度下进行测量的测试时间,同时通过使用单个探针确保部件的可靠接触,组件(1)通过第一定位步骤定位和接触,第一定位步骤共同影响首先执行的所有探头(12) 在中间位置,其结果是部件(1)位于探针尖端(13)下方的限定距离处,每个单独的探针尖端(13)的位置随后通过单独的操纵器被校正到 相应的接触垫(3)与特定探针尖端(13)接触,使得每个探针尖端(13)位于接触垫(3)上方,并且探针尖端(13)进一步随后与 通过前进运动,组件(1)的接触垫(3)。

    Method and device for contacting a row of contact areas with probe tips
    4.
    发明授权
    Method and device for contacting a row of contact areas with probe tips 有权
    用于将一排接触区域与探针接头接触的方法和装置

    公开(公告)号:US09110131B2

    公开(公告)日:2015-08-18

    申请号:US13640432

    申请日:2010-04-13

    IPC分类号: G01R1/067 G01R31/28

    CPC分类号: G01R31/2891

    摘要: The invention generally relates to a method and device for contacting contact areas (22) with probe tips (18) in a tester. The contact areas (22), which are arranged on a substrate (6), and the probe tips (18) are positioned relative to each other and then brought in contact with each other by an advancing motion. In order to detect a secure contact for each of the probe tips (18), the contacting between the probe tips (18) and the contact areas (22) is observed from at least two observation directions (34), which include an observation angle α in a range of 0 to 180°.

    摘要翻译: 本发明总体上涉及用于使接触区域(22)与测试仪中的探针尖端(18)接触的方法和装置。 布置在基板(6)上的接触区域(22)和探针尖端(18)相对于彼此定位,然后通过前进运动彼此接触。 为了检测每个探针尖端(18)的牢固接触,从至少两个观察方向(34)观察探针尖端(18)和接触区域(22)之间的接触,其中包括观察角 α在0〜180度的范围内。

    Method for testing electronic components of a repetitive pattern under defined thermal conditions
    5.
    发明授权
    Method for testing electronic components of a repetitive pattern under defined thermal conditions 有权
    在确定的热条件下测试重复图案的电子部件的方法

    公开(公告)号:US08368413B2

    公开(公告)日:2013-02-05

    申请号:US13119916

    申请日:2009-09-01

    IPC分类号: G01R31/00

    摘要: The invention relates to a method for testing several electronic components (1) of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck (10) for holding the components (1) and special holding devices (15) for holding individual probes (12). For testing, the components (1) are adjusted to a defined temperature, the probes (12) and a first electronic component (1) are positioned relative to each other by means of at least one positioning device, contact pads (3) of the electronic component (1) are subsequently contacted by the probes (12) so that the component (1) can be tested and then the positioning and the contacting can be repeated for testing another component (1) of the repetitive pattern. In order to shorten the test time for measurements at changing temperatures while ensuring reliable contacting of the components by using individual probes, a component (1) is positioned and contacted by a first positioning step which jointly affects all probes (12) first being carried out in an intermediate position, in the result of which the component (1) lies at a defined distance under the probe tips (13), the position of each individual probe tip (13) being subsequently corrected by means of separate manipulators to the position of the corresponding contact pad (3) to be contacted with the particular probe tip (13) so that each probe tip (13) lies above a contact pad (3), and the probe tips (13) further subsequently being brought into contact with the contact pads (3) of the component (1) by means of an advancing movement.

    摘要翻译: 本发明涉及一种用于在探测器中在限定的热条件下测试多个重复图案的电子部件(1)的方法,其包括用于保持部件(1)的卡盘(10)和用于保持个人的特殊保持装置(15) 探针(12)。 为了测试,将组件(1)调节到限定的温度,探针(12)和第一电子部件(1)通过至少一个定位装置相对于彼此定位,所述接触垫(3) 电子部件(1)随后被探针(12)接触,使得可以测试部件(1),然后可以重复定位和接触以测试重复图案的另一部件(1)。 为了缩短在变化的温度下进行测量的测试时间,同时通过使用单个探针确保部件的可靠接触,组件(1)通过第一定位步骤定位和接触,第一定位步骤共同影响首先执行的所有探头(12) 在中间位置,其结果是部件(1)位于探针尖端(13)下方的限定距离处,每个单独的探针尖端(13)的位置随后通过单独的操纵器被校正到 相应的接触垫(3)与特定探针尖端(13)接触,使得每个探针尖端(13)位于接触垫(3)上方,并且探针尖端(13)进一步随后与 通过前进运动,组件(1)的接触垫(3)。

    METHOD AND DEVICE FOR CONTACTING A ROW OF CONTACT AREAS WITH PROBE TIPS
    6.
    发明申请
    METHOD AND DEVICE FOR CONTACTING A ROW OF CONTACT AREAS WITH PROBE TIPS 有权
    用于与接触区域接触的方法和设备与探测器提示

    公开(公告)号:US20130027070A1

    公开(公告)日:2013-01-31

    申请号:US13640432

    申请日:2010-04-13

    IPC分类号: G01R1/067

    CPC分类号: G01R31/2891

    摘要: The invention generally relates to a method and device for contacting contact areas (22) with probe tips (18) in a tester. The contact areas (22), which are arranged on a substrate (6), and the probe tips (18) are positioned relative to each other and then brought in contact with each other by an advancing motion. In order to detect a secure contact for each of the probe tips (18), the contacting between the probe tips (18) and the contact areas (22) is observed from at least two observation directions (34), which include an observation angle α in a range of 0 to 180°.

    摘要翻译: 本发明总体上涉及用于使接触区域(22)与测试仪中的探针尖端(18)接触的方法和装置。 布置在基板(6)上的接触区域(22)和探针尖端(18)相对于彼此定位,然后通过前进运动彼此接触。 为了检测每个探针尖端(18)的牢固接触,从至少两个观察方向(34)观察探针尖端(18)和接触区域(22)之间的接触,其中包括观察角 α在0〜180度的范围内。

    Method and prober for contacting a contact area with a contact tip
    7.
    发明授权
    Method and prober for contacting a contact area with a contact tip 有权
    用于将接触区域与接触尖端接触的方法和探测器

    公开(公告)号:US07057408B2

    公开(公告)日:2006-06-06

    申请号:US10879622

    申请日:2004-06-29

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2886

    摘要: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.

    摘要翻译: 接触区域与探针中的接触针尖(接触尖端)接触的方法以及这种探测器的布置的方法基于确保可靠接触和直接观察触点之间的接触的建立的目的 接触小尺寸接触垫时的接触面和接触面积。 探测器基本上包括具有移动装置的基架,该移动装置包括用于接收半导体晶片的夹持夹具以及与半导体晶片的自由表面相对布置的接触针。 接触尖端的接触最初需要半导体晶片的水平定位,使得接触面和接触尖端彼此之间并且彼此间隔一定距离,随后沿接触尖端的方向垂直移动, 直到接触尖端与接触区域的接触被建立。 该目的是通过半导体晶片的垂直移动直到达到最终位置在水平观察方向上直接观察为目的,为此目的,观察装置以这样的方式布置,使得观察轴以间隔 在自由晶片表面上方。