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    Solderless electrical connection for testing head gimbal assemblies
    3.
    发明授权
    Solderless electrical connection for testing head gimbal assemblies 有权
    用于测试头万向架组件的无焊接电气连接

    公开(公告)号：US07509224B2

    公开(公告)日：2009-03-24

    申请号：US11700274

    申请日：2007-01-31

    Applicant: Justin Lee Holwell ,  Mujahid Akbar Khan ,  Andrew Michael Blair ,  Brett Robert Herdendorf ,  Steven Ernest Wheeler

    Inventor： Justin Lee Holwell ,  Mujahid Akbar Khan ,  Andrew Michael Blair ,  Brett Robert Herdendorf ,  Steven Ernest Wheeler

    IPC: G01D3/00 ,  G01M19/00 ,  G01P21/00

    CPC classification number: G11B5/4826 ,  G11B5/455 ,  G11B5/4555 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903

    Abstract: A method for making an electrical connection between a head gimbal assembly and a tester. The method includes providing a solderless connector including a housing with bores extending from a first side of the housing to a second opposed side of the housing, and conductors within the bores of the housing. The conductors have a first end protruding from the first side of the housing and a second end protruding from the second side of the housing. The solderless connector is positioned so the first end of the conductor engages the conductive pad of the tester, and a clamp is applied to the first side of the electrical contact on the head gimbal assembly to urge the second side of the electrical contact against the second end of the conductor on the solderless connector.

    Abstract translation: 一种用于在头部万向节组件和测试器之间进行电连接的方法。 该方法包括提供一种无焊接连接器，其包括具有从壳体的第一侧延伸到壳体的第二相对侧的孔的壳体和壳体的孔内的导体。 导体具有从壳体的第一侧突出的第一端和从壳体的第二侧突出的第二端。 无焊接连接器被定位成使得导体的第一端与测试器的导电焊盘接合，并且夹具被施加到头部万向节组件上的电接触的第一侧上，以将电接触的第二侧推向第二 无焊接连接器上的导体末端。

    Vibration reduction for head gimbal assembly testing
    4.
    发明申请
    Vibration reduction for head gimbal assembly testing 有权
    头万向节装配测试的减振

    公开(公告)号：US20080060445A1

    公开(公告)日：2008-03-13

    申请号：US11517828

    申请日：2006-09-08

    Applicant: Klaus Obergfell ,  Steven Ernest Wheeler ,  Charles Newell Miller ,  Brett Robert Herdendorf ,  Ronald Eldon Anderson ,  Shawn Eric Fosness

    Inventor： Klaus Obergfell ,  Steven Ernest Wheeler ,  Charles Newell Miller ,  Brett Robert Herdendorf ,  Ronald Eldon Anderson ,  Shawn Eric Fosness

    IPC: G01N3/02

    CPC classification number: G11B5/455 ,  G11B5/4555 ,  G11B33/08

    Abstract: An assembly for testing a head gimbal assembly (HGA) comprises a support platform configured to hold a base plate of the HGA. A base plate of the HGA is mounted on the support platform. The assembly further comprises a channel with an opening adjacent to a tail of the HGA and a vacuum source connected the channel. The vacuum source creates a negative pressure in the channel to secure the tail of the HGA to the opening of the channel. Embodiments of the invention may be useful to inhibit vibration in the tail of an HGA, which may also reduce vibration in the head of the HGA. Reducing vibration in the head of the HGA may increase the accuracy and precision of tests performed on the HGA using the assembly.

    Abstract translation: 用于测试头万向架组件（HGA）的组件包括被配置为保持HGA的底板的支撑平台。 HGA的底板安装在支撑平台上。 组件还包括具有与HGA的尾部相邻的开口的通道和连接到通道的真空源。 真空源在通道中产生负压，以将HGA的尾部固定到通道的开口。 本发明的实施例可用于抑制HGA尾部的振动，这还可以减小HGA头部的振动。 降低HGA头部的振动可能会增加使用组件对HGA进行的测试的精度和精度。

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