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    Solderless electrical connection for testing head gimbal assemblies
    2.
    发明授权
    Solderless electrical connection for testing head gimbal assemblies 有权
    用于测试头万向架组件的无焊接电气连接

    公开(公告)号：US07509224B2

    公开(公告)日：2009-03-24

    申请号：US11700274

    申请日：2007-01-31

    申请人： Justin Lee Holwell ,  Mujahid Akbar Khan ,  Andrew Michael Blair ,  Brett Robert Herdendorf ,  Steven Ernest Wheeler

    发明人： Justin Lee Holwell ,  Mujahid Akbar Khan ,  Andrew Michael Blair ,  Brett Robert Herdendorf ,  Steven Ernest Wheeler

    IPC分类号： G01D3/00 ,  G01M19/00 ,  G01P21/00

    CPC分类号： G11B5/4826 ,  G11B5/455 ,  G11B5/4555 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903

    摘要： A method for making an electrical connection between a head gimbal assembly and a tester. The method includes providing a solderless connector including a housing with bores extending from a first side of the housing to a second opposed side of the housing, and conductors within the bores of the housing. The conductors have a first end protruding from the first side of the housing and a second end protruding from the second side of the housing. The solderless connector is positioned so the first end of the conductor engages the conductive pad of the tester, and a clamp is applied to the first side of the electrical contact on the head gimbal assembly to urge the second side of the electrical contact against the second end of the conductor on the solderless connector.

    摘要翻译： 一种用于在头部万向节组件和测试器之间进行电连接的方法。 该方法包括提供一种无焊接连接器，其包括具有从壳体的第一侧延伸到壳体的第二相对侧的孔的壳体和壳体的孔内的导体。 导体具有从壳体的第一侧突出的第一端和从壳体的第二侧突出的第二端。 无焊接连接器被定位成使得导体的第一端与测试器的导电焊盘接合，并且夹具被施加到头部万向节组件上的电接触的第一侧上，以将电接触的第二侧推向第二 无焊接连接器上的导体末端。