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公开(公告)号:US20050176173A1
公开(公告)日:2005-08-11
申请号:US11102737
申请日:2005-04-11
IPC分类号: H01L21/66 , H01L21/98 , H01L23/538 , H05K3/22 , H01L21/44
CPC分类号: H01L25/50 , H01L22/20 , H01L23/5382 , H01L24/48 , H01L24/49 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/4911 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H05K3/222 , H05K2201/10287 , H05K2203/162 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2924/00012
摘要: A chip-on-board module has a multilayer interconnection board having die mount sections; dies mounted on respective die mount sections such that a single die is mounted on each die mount section or two or more dies are being stacked and mounted there; bonding pads provided on the multilayer and connected to single dies or uppermost dies; contact pads provided on the multilayer board and connected to corresponding bonding pads; jumper pads provided in proximity to the contact pads and connected to edge terminals of the multilayer board, circuit elements mounted on the multilayer interconnection board, or through holes formed so as to extend across layers of the multilayer board; and molding resin for molding the dies and the pads. The uppermost dies of the respective die mount sections where dies are stacked in two or more layers have passed an electric property test.
摘要翻译: 板上芯片模块具有具有管芯安装部分的多层互连板; 模具安装在相应的模具安装部分上,使得单个模具安装在每个模具安装部分上,或者两个或更多个模具被堆叠并安装在那里; 连接在多层并连接到单个模具或最上面的模具上的焊盘; 接触焊盘,设置在多层板上并连接到相应的焊盘; 跨接垫设置在接触垫附近并连接到多层板的边缘端子,安装在多层互连板上的电路元件或形成为跨越多层板的层的通孔; 以及用于模制模具和垫的模制树脂。 将模具堆叠成两层以上的各模具安装部的最上侧的模具通过电性试验。