Vapor-deposition mask, method for manufacturing vapor-deposition mask, and method for manufacturing display device

    公开(公告)号:US12295245B2

    公开(公告)日:2025-05-06

    申请号:US17706541

    申请日:2022-03-28

    Applicant: TOPPAN INC.

    Inventor: Takayuki Morita

    Abstract: A vapor deposition mask made of metal includes: a front surface configured to oppose a vapor deposition source; and mask holes each including a hole portion having a shape of an inverted frustum. The hole portion of each of the mask holes includes: a small opening including a polygonal edge as seen from a view opposing the front surface of the vapor deposition mask, the edge including corners and linear portions each located between adjacent ones of the corners; and a large opening located on the front surface, the large opening including an edge as seen from the view opposing the front surface of the vapor deposition mask, the edge being shaped such that the corners of the edge of the small opening project outward from the edge of the small opening. The large opening surrounds the small opening as seen from the view opposing the front surface.

    Decorative sheet
    2.
    发明授权

    公开(公告)号:US12263660B2

    公开(公告)日:2025-04-01

    申请号:US18071783

    申请日:2022-11-30

    Applicant: TOPPAN INC.

    Abstract: A decorative sheet includes at least a topcoat layer disposed to face a substrate layer in a first direction, the front surface of the topcoat layer having a wavy roughness profile measured with a cutoff wavelength λs of 8 μm and a cutoff wavelength λc of 2.5 mm according to JIS B0601:2001 in a second direction perpendicular to the first direction, a selected evaluation portion of the wavy roughness profile comprising a plurality of profile elements, an evaluation length of the selected evaluation portion of the wavy roughness profile having 10 mm, the selected evaluation portion of the wavy roughness profile being designed to have an arithmetic mean deviation Ra of 10 μm or less; and to have a mean width of the profile elements and a ten point height, the mean width and the ten point height satisfying the following expression: 5≤RSm/RzJIS≤40 . . . (1), where RSm represents the mean width, and RzJIS represents the ten point height.

    Photoelectric conversion device, imaging device, and imaging system

    公开(公告)号:US12255216B2

    公开(公告)日:2025-03-18

    申请号:US17682195

    申请日:2022-02-28

    Applicant: TOPPAN Inc.

    Abstract: A photoelectric conversion device including a substrate including a charge generation region, a dielectric layer formed on the substrate, and a phase adjustment layer formed on the dielectric layer and having an upper surface and a lower surface. In a cross-sectional view of the photoelectric conversion device, a first plane extends parallel to the substrate in contact with the upper surface of the phase adjustment layer, a second plane is the lower surface of the phase adjustment layer, and the phase adjustment layer is formed such that the reflected light which has entered the first plane perpendicularly to the photoelectric conversion device and travels from the first plane to the second plane has an optical path length that varies depending on a position where the reflected light is incident on the first plane.

    Laminate
    4.
    发明授权
    Laminate 有权

    公开(公告)号:US12226980B2

    公开(公告)日:2025-02-18

    申请号:US17841027

    申请日:2022-06-15

    Applicant: TOPPAN INC.

    Abstract: A laminate for forming a packaging bag, in sequence: a substrate layer; an adhesive layer; and a sealant layer, wherein the sealant layer includes a first polyester film having a crystallinity of 20 to 50% based on a first absorbance at a first wavenumber of 1409 cm−1, a second absorbance at a second wavenumber of 1370 cm−1, a third absorbance at a third wavenumber of 1340 cm−1, a first constant, and a second constant, the first to third absorbances and the first and second constants being determined based on FT-IR analysis, which uses a reflection method, on at least the first polyester film, the crystallinity of the first polyester film being expressed in accordance with the following formulas (1) and (2): I1409=p1×I1340+p2×I1370 . . . (Formula 1) and C=p1×(I1340/I1409)×100 . . . (Formula 2).

    IC card and method for manufacturing IC card

    公开(公告)号:US12217112B2

    公开(公告)日:2025-02-04

    申请号:US18134959

    申请日:2023-04-14

    Applicant: TOPPAN INC.

    Abstract: An IC card provided with an IC chip, and configured to enable at least one of contact communication and contactless communication, the IC card including an ultrasonic fingerprint sensor connected to the IC chip and a storage unit in which fingerprint data for matching is stored. An outer surface of the IC card is formed of synthetic resin, and the ultrasonic fingerprint sensor is covered with the synthetic resin.

    Packaging bag and packaging body
    8.
    发明授权

    公开(公告)号:US12172819B2

    公开(公告)日:2024-12-24

    申请号:US18040188

    申请日:2021-07-30

    Abstract: A packaging bag includes a cutting guide band extending along a transverse direction. The cutting guide band includes, a first guide band having first cut lines that are inclined at a predetermined angle with respect to the transverse direction; a second guide band having second cut lines that are inclined at a predetermined angle in a direction opposite a direction of the first cut lines with respect to the transverse direction; and a third guide band having third cut lines that are inclined at a predetermined angle in the same direction as the direction of the first cut lines with respect to the transverse direction. The cutting guide band has a fourth cut line between the first guide band and the second guide band and/or between the second guide band and the third guide band, the fourth cut line being perforated and extending along the transverse direction.

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