公开(公告)号：US20150185159A1

公开(公告)日：2015-07-02

申请号：US14595784

申请日：2015-01-13

Applicant: Konomu Hirao ,  TTM Co., Ltd. ,  SYSTEMROAD Co., Ltd.

Inventor： Takahiko Morita ,  Konomu Hirao

IPC: G01N21/78 ,  G06K9/00

CPC classification number: G01N21/78 ,  B01L3/50273 ,  B01L2300/041 ,  B01L2300/046 ,  B01L2300/0816 ,  B01L2300/0864 ,  B01L2300/0887 ,  B01L2400/0481 ,  G01N21/8483 ,  G06K9/00134 ,  G06K9/2018 ,  G06K9/209 ,  G06T7/0012 ,  G06T2207/30072

Abstract: An analysis system is configured by combining a mobile terminal equipped with a camera, and an auxiliary apparatus for analysis. The auxiliary apparatus includes a placing section on which the mobile terminal is placed. A chip mounting section and a light source are provided below the placing section. The placing section includes a light passing section for making transmitted light or reflected light in a coloring reaction portion, emitted from the light, incident on the camera. The camera is used as a light receiving section. A data processing section included in the mobile terminal is used as a concentration calculating processing section and, when the light in the coloring reaction portion passes through the light passing section and is made incident on the camera, is capable of executing the concentration calculation processing on the basis of data on a picked-up image signal output from the camera.

Abstract translation: 分析系统通过组合配备有照相机的移动终端和用于分析的辅助设备来配置。 辅助设备包括放置移动终端的放置部分。 芯片安装部和光源设置在放置部的下方。 放置部分包括一个光通过部分，用于使从光发射的着色反应部分中的透射光或反射光入射到照相机上。 相机用作光接收部分。 使用移动终端中包括的数据处理部分作为浓度计算处理部分，并且当着色反应部分中的光通过光通过部分并入射到相机上时，能够执行浓度计算处理 从相机输出的拾取图像信号的数据的基础。

公开(公告)号：US09864419B2

公开(公告)日：2018-01-09

申请号：US14614296

申请日：2015-02-04

Applicant: Samsung Electronics Co., Ltd. ,  TTM, Co. Ltd.

Inventor： Bongjae Rhee ,  Chunghyo Jung ,  Eugene Choi

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1626 ,  G06F1/1656

Abstract: A handheld device including a circuit board including at least one electronic component, a heat pipe disposed on the electronic component to absorb heat generated from the electronic component and to release the absorbed heat in a direction opposite to the electronic component, and a heat sinking material configured to bond the circuit board and the heat pipe to each other. The heat pipe includes an evaporation section disposed on the main processor to absorb heat generated from the main processor, a connection section disposed on a side region of the main board to transfer the absorbed heat in a direction opposite to the main processor, and a condensation section configured to release the transferred heat.

公开(公告)号：US20160029511A1

公开(公告)日：2016-01-28

申请号：US14809094

申请日：2015-07-24

Applicant: Samsung Electronics Co., Ltd ,  TTM Co., Ltd

Inventor： Chung-Hyo Jung ,  Eu-Gene Choi ,  Bong-Jae Rhee

IPC: H05K7/20 ,  F28F23/00 ,  F28F21/00

CPC classification number: F28F23/00 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/427 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat transfer apparatus is provided. The heat transfer apparatus includes a first thermal conductor. The heat transfer apparatus also includes a second thermal conductor. The heat transfer apparatus further includes an interface member configured to transfer heat between the first thermal conductor and the second thermal conductor. A portion of the interface member contains a thermoplastic material reacting via an application of the heat.

Abstract translation: 提供传热装置。 传热装置包括第一热导体。 传热装置还包括第二热导体。 传热装置还包括被配置为在第一热导体和第二热导体之间传递热量的界面构件。 界面部件的一部分包含通过施加热量而反应的热塑性材料。

公开(公告)号：US20150220122A1

公开(公告)日：2015-08-06

申请号：US14614296

申请日：2015-02-04

Applicant: Samsung Electronics Co., Ltd. ,  TTM, Co. Ltd.

Inventor： Bongjae Rhee ,  Chunghyo Jung ,  Eugene Choi

IPC: G06F1/20

CPC classification number: G06F1/203 ,  G06F1/1626 ,  G06F1/1656

Abstract: A handheld device including a circuit board including at least one electronic component, a heat pipe disposed on the electronic component to absorb heat generated from the electronic component and to release the absorbed heat in a direction opposite to the electronic component, and a heat sinking material configured to bond the circuit board and the heat pipe to each other. The heat pipe includes an evaporation section disposed on the main processor to absorb heat generated from the main processor, a connection section disposed on a side region of the main board to transfer the absorbed heat in a direction opposite to the main processor, and a condensation section configured to release the transferred heat.

Abstract translation: 一种手持式装置，包括包括至少一个电子部件的电路板，设置在所述电子部件上的热管，用于吸收从所述电子部件产生的热量并且在与所述电子部件相反的方向上释放所吸收的热量;以及散热材料 被配置为将电路板和热管彼此粘合。 热管包括设置在主处理器上以吸收从主处理器产生的热量的蒸发部分，设置在主板的侧面区域上的连接部分，以沿与主处理器相反的方向传递吸收的热量，以及冷凝 部分配置为释放传递的热量。