公开(公告)号：US20080240201A1

公开(公告)日：2008-10-02

申请号：US12056745

申请日：2008-03-27

申请人： Hirofumi KOIKE ,  Akikazu MATSUMOTO ,  Wataru YAGI ,  Takefumi ISOGAI ,  Yoshiharu HIROSE ,  Hiroaki KADOURA ,  Juntaro SEKI ,  Hisaaki TAKAO

发明人： Hirofumi KOIKE ,  Akikazu MATSUMOTO ,  Wataru YAGI ,  Takefumi ISOGAI ,  Yoshiharu HIROSE ,  Hiroaki KADOURA ,  Juntaro SEKI ,  Hisaaki TAKAO

IPC分类号： G01N25/72

CPC分类号： G01N25/72 ,  H05K3/341 ,  H05K2203/1105 ,  H05K2203/162 ,  Y02P70/613

摘要： A method for evaluating a solder joint portion by means of which a part and a substrate are joined to each other includes a preparation process for preparing the substrate including the solder joint portion, a thermal shock process for applying thermal shock to the solder joint portion multiple times, and an evaluation process for obtaining a change of a crystal grain size in the solder joint portion caused by the application of the thermal shock so as to evaluate a lifespan of the solder joint portion based on the change of the crystal grain size obtained.

摘要翻译： 用于评估焊接部分的方法，其中部件和基板彼此接合，包括用于制备包括焊料接合部分的基板的准备工艺，对焊接部分多次施加热冲击的热冲击工艺 以及用于获得通过施加热冲击而引起的焊料接合部分中的晶粒尺寸变化的评估过程，以便基于获得的晶粒尺寸的变化来评估焊接部分的寿命。

公开(公告)号：US07658538B2

公开(公告)日：2010-02-09

申请号：US12056745

申请日：2008-03-27

申请人： Hirofumi Koike ,  Akikazu Matsumoto ,  Wataru Yagi ,  Takefumi Isogai ,  Yoshiharu Hirose ,  Hiroaki Kadoura ,  Juntaro Seki ,  Hisaaki Takao

发明人： Hirofumi Koike ,  Akikazu Matsumoto ,  Wataru Yagi ,  Takefumi Isogai ,  Yoshiharu Hirose ,  Hiroaki Kadoura ,  Juntaro Seki ,  Hisaaki Takao

IPC分类号： G01N25/72

CPC分类号： G01N25/72 ,  H05K3/341 ,  H05K2203/1105 ,  H05K2203/162 ,  Y02P70/613

摘要： A method for evaluating a solder joint portion by means of which a part and a substrate are joined to each other includes a preparation process for preparing the substrate including the solder joint portion, a thermal shock process for applying thermal shock to the solder joint portion multiple times, and an evaluation process for obtaining a change of a crystal grain size in the solder joint portion caused by the application of the thermal shock so as to evaluate a lifespan of the solder joint portion based on the change of the crystal grain size obtained.

摘要翻译： 用于评估焊接部分的方法，其中部件和基板彼此接合，包括用于制备包括焊料接合部分的基板的准备工艺，对焊接部分多次施加热冲击的热冲击工艺 以及用于获得通过施加热冲击而引起的焊料接合部分中的晶粒尺寸变化的评估过程，以便基于获得的晶粒尺寸的变化来评估焊接部分的寿命。

公开(公告)号：US6149734A

公开(公告)日：2000-11-21

申请号：US200766

申请日：1998-11-27

申请人： Takefumi Isogai ,  Ryuichi Uchino ,  Masahiko Sato ,  Yoshio Kono

发明人： Takefumi Isogai ,  Ryuichi Uchino ,  Masahiko Sato ,  Yoshio Kono

IPC分类号： C21D1/06 ,  C21D1/18 ,  C21D1/78 ,  C21D6/00 ,  C23C8/22 ,  C23C8/28 ,  C23C8/32 ,  C23C8/34 ,  C23C8/46 ,  C23C8/66

CPC分类号： C23C8/22 ,  C21D1/78 ,  C23C8/32 ,  C21D1/18

摘要： A method for the heat treatment of steel, comprising carburization hardening said steel, to form carburized steel, followed by a second hardening, reduces the grain size of steel while precipitating carbonitrides inside the grains of steel, thereby increasing the strength of the heat-treated steel. The carburization hardening comprises heating the steel to a first austenitic temperature range in an atmosphere comprising a carburizing gas and optionally ammonia, cooling the steel to a martensitic temperature range, and quenching the steel, and the second hardening comprises heating the carburized steel to a second austenitic temperature range in an atmosphere comprising a carburizing gas and ammonia, and quenching the steel.

摘要翻译： 一种钢的热处理方法，包括对所述钢进行渗碳硬化，形成渗碳钢，然后进行第二次硬化，同时在钢的晶粒内析出碳氮化物，同时降低钢的晶粒尺寸，从而提高热处理的强度 钢。 渗碳硬化包括在包括渗碳气体和任选的氨的气氛中将钢加热到第一奥氏体温度范围，将钢冷却至马氏体温度范围，并淬火钢，第二硬化包括将渗碳钢加热至第二次 在包含渗碳气体和氨的气氛中的奥氏体温度范围，并淬火钢。