-
公开(公告)号:US20130026616A1
公开(公告)日:2013-01-31
申请号:US13557834
申请日:2012-07-25
申请人: Suk Ho LEE , Jae Cheon DOH , Young Hoon KWAK , Tae Hoon KIM , Tao Jyun KIM , Young Ki LEE
发明人: Suk Ho LEE , Jae Cheon DOH , Young Hoon KWAK , Tae Hoon KIM , Tao Jyun KIM , Young Ki LEE
IPC分类号: H01L23/495 , H01L21/60
CPC分类号: H01L23/4334 , H01L23/3107 , H01L23/49575 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/105 , H01L25/18 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2225/1017 , H01L2225/1047 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/1515 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00015
摘要: The present invention relates to a power device package module and a manufacturing method thereof. In one aspect of the present invention, a power device package module includes: a control unit a first lead frame, a control chip and a first coupling portion that are mounted on a first substrate, wherein the first lead frame and the first coupling portion are electrically connected to the control chip, and individually molded; and a power unit including a second lead frame, a power chip and a second coupling portion that are mounted on a second substrate, wherein the second lead frame and the second coupling portion are electrically connected to the power chip, and individually molded, wherein the individually molded control unit and power unit are coupled by the first coupling portion and the second coupling portion.
摘要翻译: 功率器件封装模块及其制造方法技术领域本发明涉及功率器件封装模块及其制造方法。 在本发明的一个方面,功率器件封装模块包括:控制单元,安装在第一衬底上的第一引线框架,控制芯片和第一耦合部分,其中第一引线框架和第一耦合部分是 电连接到控制芯片,并单独模制; 以及功率单元,其包括安装在第二基板上的第二引线框架,功率芯片和第二耦合部分,其中所述第二引线框架和所述第二耦合部分电连接到所述功率芯片,并且分别模制,其中 单独模制的控制单元和动力单元通过第一联接部分和第二联接部分联接。