公开(公告)号：US5119390A

公开(公告)日：1992-06-02

申请号：US563057

申请日：1990-08-06

申请人： Taro Ohmori

发明人： Taro Ohmori

IPC分类号： H01L21/30 ,  G03F7/20 ,  H01S3/10 ,  H01S3/134 ,  H01S3/225

CPC分类号： G03F7/70058 ,  H01S3/10

摘要： An irradiation control system includes a radiation energy source for producing radiation energy in the form of pulses; a path defined for the radiation energy, between the radiation energy source and a surface to be irradiated with the radiation energy from the radiation energy source; an energy changing member provided in relation to the path and being effective to change the proportion of the radiation energy, irradiating the surface, to the radiation energy produced by the radiation energy source; a detecting device for detecting the irradiation of the surface with a predetermined amount of radiation energy; a driving device for changing the state of the energy changing member at least during a period from start of irradiation of the surface with the radiation energy to the detection of irradiation of the surface with the predetermined amount of radiation energy through the detecting device; and a control device for controlling the timing of production of radiation energy by the radiation energy source, in relation to the state of the energy changing member.

摘要翻译： 照射控制系统包括用于产生脉冲形式的辐射能量的辐射能源; 在辐射能量源与辐射能源辐射能量的表面之间定义的辐射能量的路径; 相对于路径设置的能量改变构件，并且有效地将照射表面的辐射能量的比例改变为由辐射能量源产生的辐射能量; 用于以预定量的辐射能量检测所述表面的照射的检测装置; 驱动装置，用于至少在从所述辐射能量的所述表面的照射开始到通过所述检测装置以预定量的辐射能量检测所述表面的照射的期间之间改变所述能量变化部件的状态; 以及控制装置，用于相对于能量改变构件的状态来控制由辐射能量源产生的辐射能量的定时。

公开(公告)号：US4934064A

公开(公告)日：1990-06-19

申请号：US240003

申请日：1988-09-02

申请人： Nobuhito Yamaguchi ,  Mitsuya Sato ,  Takao Ukaji ,  Taro Ohmori ,  Eiichi Murakami

发明人： Nobuhito Yamaguchi ,  Mitsuya Sato ,  Takao Ukaji ,  Taro Ohmori ,  Eiichi Murakami

IPC分类号： G01R31/02 ,  G01R1/073 ,  H01L21/00 ,  H01L21/66 ,  H01L21/68

CPC分类号： H01L21/67259 ,  G01R1/07314 ,  H01L21/681

摘要： A wafer prober for contacting probe needles of a probe card to bonding pads of a chip formed on a wafer, for allowing examination of characteristics of the chip, is disclosed. The wafer prober includes a wafer holder for holding a wafer and moving the same in X and Y directions. By the wafer holder, the wafer can be moved from an alignment information detecting station whereat alignment information can be detected by use of a TV camera, to an examining station whereat the probe needles of the probe card are used for the examination. The position of the wafer in a Z direction at the time when the alignment information is detected by the TV camera, can be made substantially coincident with the position of the wafer in the Z direction at the time when the probe needles contact the bonding pads. By this, an error caused by the movement of the wafer holder in the Z direction does not affect against the alignment accuracy of the wafer in the X and Y directions, such that the probe needles can correctly contact the bonding pads.

摘要翻译： 公开了一种用于将探针卡的探针接触到晶片上形成的芯片的焊盘的晶片探针，用于允许检查芯片的特性。 晶片探测器包括用于保持晶片并将其在X和Y方向上移动的晶片保持器。 通过晶片保持器，晶片可以从对准信息检测站移动，其中可以通过使用TV摄像机检测对准信息到探测卡的探针用于检查的检查站。 可以使得当电视摄像机检测到对准信息时的Z方向上的晶片的位置与探针接触焊盘时Z方向上的晶片位置基本一致。 由此，晶片保持器在Z方向的移动引起的误差不会影响晶片在X和Y方向上的对准精度，使得探针能够正确地接触焊盘。

公开(公告)号：US4929893A

公开(公告)日：1990-05-29

申请号：US252997

申请日：1988-10-04

申请人： Mitsuya Sato ,  Takao Ukaji ,  Nobuhito Yamaguchi ,  Taro Ohmori ,  Eiichi Murakami

发明人： Mitsuya Sato ,  Takao Ukaji ,  Nobuhito Yamaguchi ,  Taro Ohmori ,  Eiichi Murakami

IPC分类号： G01R31/28

CPC分类号： G01R31/2886

摘要： A wafer prober usable with a probe card for examination of chips formed on a wafer is disclosed. The wafer prober has a function for automatically aligning bonding pads of each chip with probe needles of the probe card. The prober includes a contact plate movable in X and Y directions with a wafer chuck. The contact blade is pressed against at least one of the tips of the probe needles, and the thus contacted needle tip is observed by a TV camera from the underneath of the contact plate. The video signal obtained thereby is used for the alignment between the bonding pads and the probe needles. Also, the TV camera is moved in the X and Y directions with the wafer chuck to allow that one and the same reference mark is observed by this TV camera and by another TV camera provided for image-taking the bonding pads. With the proposed structure, the bonding pads and the probe needles can be aligned automatically and accurately.

摘要翻译： 公开了一种可用于检查形成在晶片上的芯片的探针卡的晶片探测器。 晶片探测器具有将每个芯片的焊盘自动对准探针卡的探针的功能。 探测器包括可在X和Y方向上与晶片卡盘一起移动的接触板。 接触片被压靠在探针的至少一个尖端上，并且通过电视摄像机从接触板的下面观察到这样接触的针尖。 由此获得的视频信号用于接合焊盘和探针之间的对准。 此外，电视摄像机在X和Y方向上与晶片卡盘一起移动，以允许通过该TV摄像机和用于对接合焊盘进行摄像的另一台TV摄像机观察同一参考标记。 利用所提出的结构，可以自动且准确地对准接合焊盘和探针。

公开(公告)号：US4786816A

公开(公告)日：1988-11-22

申请号：US140864

申请日：1987-12-29

申请人： Taro Ohmori ,  Hiroaki Kameyama

发明人： Taro Ohmori ,  Hiroaki Kameyama

IPC分类号： H01L21/00 ,  H01L21/68 ,  G01N21/86 ,  G01V9/04

CPC分类号： H01L21/67265 ,  H01L21/681

摘要： A wafer detecting device usable with a carrier has a plurality of wafer carrying portions disposed in stories for carrying wafers thereon. The device comprises a light emitting portion for emitting a light beams so that it passes through the carrier from one side thereof to the other side thereof and in a direction substantially parallel to a plane in which a wafer is carried on a wafer carrying portion of the carrier. A light receiving portion is disposed at the other side of the carrier for detecting presence/absence of the light passed through the carrier. The light emitting portion is arranged to emit the light over a dimensional range covering all the wafer carrying portions with respect to a direction in which the wafer carrying portions are disposed in stories, and the light receiving portion is fixed relative to the carrier and has a light receiving surface having an effective dimensional range greater than the dimensional range covering all the wafer carrying portions with respect to the direction in which the wafer carrying portions are disposed in stories.

摘要翻译： 可用于载体的晶片检测装置具有设置在故障中的多个晶片承载部分，用于在其上承载晶片。 该装置包括用于发射光束的发光部分，使得其从其一侧穿过载体到另一侧，并且在基本上平行于晶片承载在晶片承载部分的平面的方向上 载体 光接收部分设置在载体的另一侧，用于检测穿过载体的光的存在/不存在。 发光部被配置为在覆盖所有晶片承载部的尺寸范围内相对于晶片承载部设置在故障中的方向发射光，并且光接收部相对于载体固定，并且具有 光接收表面的有效尺寸范围大于覆盖所有晶片承载部分的尺寸范围，所述尺寸范围相对于晶片承载部分设置在故事中的方向。