公开(公告)号：US5425793A

公开(公告)日：1995-06-20

申请号：US17375

申请日：1993-02-09

申请人： Kazuhiro Mori ,  Yoshiyuki Kubota ,  Naoyuki Hashimoto ,  Tatsuki Nogiwa

发明人： Kazuhiro Mori ,  Yoshiyuki Kubota ,  Naoyuki Hashimoto ,  Tatsuki Nogiwa

IPC分类号： F24F7/06 ,  B01D46/42 ,  F24F3/16 ,  H01L21/00 ,  B01D50/00

CPC分类号： B01D46/0013 ,  B01D46/10 ,  F24F3/1607 ,  H01L21/67126 ,  B01D2273/30

摘要： According to the present invention, chamber units are sequentially coupled with each other to thereby provide a volume of clean space, and whereby different environments can be maintained in the different chamber units. An air blowhole or door is provided at an opening section of each chamber unit. Moreover, a space section can be defined at the coupling part of the chamber units, and a suction pump and a suction hose can be provided in the space section, so as to prevent the environments of the different chambers from influencing one another.

摘要翻译： 根据本发明，室单元相互连接，从而提供一定量的清洁空间，并且可以在不同的室单元中保持不同的环境。 在每个室单元的开口部分设置有气孔或门。 此外，空腔部分可以限定在腔室单元的联接部分处，并且可以在空间部分中设置抽吸泵和抽吸软管，以防止不同腔室的环境彼此影响。

公开(公告)号：US20050230050A1

公开(公告)日：2005-10-20

申请号：US10825335

申请日：2004-04-16

申请人： Tatsuki Nogiwa ,  Mitsuhiro Ikeda ,  Hiroshi Yamauchi ,  Mineo Tokunaga

发明人： Tatsuki Nogiwa ,  Mitsuhiro Ikeda ,  Hiroshi Yamauchi ,  Mineo Tokunaga

IPC分类号： H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H05K13/00 ,  H05K13/04 ,  B32B31/00

CPC分类号： H05K13/0069 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/0097 ,  H05K3/386 ,  H05K2201/09918 ,  H05K2203/0152 ,  Y10T156/1089 ,  Y10T156/1092 ,  Y10T156/17 ,  Y10T156/1702 ,  Y10T156/1906 ,  Y10T156/1994

摘要： A substrate support jig, for removably holding a substrate when mounting electronic components on the substrate, includes a base member having a first surface and a second surface facing and substantially parallel to each other; and an adhesive layer with a predetermined shape and a predetermined thickness formed on the first surface side by applying an adhesive material with a predetermined unit tackiness to an adhesive region. In the adhesive region is formed a land section such that a surface of the land section protrudes from a surface of the adhesive layer by a predetermined amount. The tackiness between the adhesive material and the base member is lower than the tackiness between the adhesive material and the substrate.

摘要翻译： 一种基板支撑夹具，用于在将电子部件安装在基板上时用于可拆卸地保持基板，包括：基部构件，其具有面对并且基本上彼此平行的第一表面和第二表面; 以及通过向粘合剂区域施加预定单位粘性的粘合剂材料，形成在第一表面侧上具有预定形状和预定厚度的粘合剂层。 在粘合剂区域中形成有陆地部分，使得陆部的表面从粘合剂层的表面突出预定量。 粘合剂材料与基材之间的粘合性低于粘合剂材料与基材之间的粘合性。

公开(公告)号：US07517419B2

公开(公告)日：2009-04-14

申请号：US10825335

申请日：2004-04-16

申请人： Tatsuki Nogiwa ,  Mitsuhiro Ikeda ,  Hiroshi Yamauchi ,  Mineo Tokunaga

发明人： Tatsuki Nogiwa ,  Mitsuhiro Ikeda ,  Hiroshi Yamauchi ,  Mineo Tokunaga

IPC分类号： B32B37/20

CPC分类号： H05K13/0069 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/0097 ,  H05K3/386 ,  H05K2201/09918 ,  H05K2203/0152 ,  Y10T156/1089 ,  Y10T156/1092 ,  Y10T156/17 ,  Y10T156/1702 ,  Y10T156/1906 ,  Y10T156/1994

摘要： A substrate support jig, for removably holding a substrate when mounting electronic components on the substrate, includes a base member having a first surface and a second surface facing and substantially parallel to each other; and an adhesive layer with a predetermined shape and a predetermined thickness formed on the first surface side by applying an adhesive material with a predetermined unit tackiness to an adhesive region. In the adhesive region is formed a land section such that a surface of the land section protrudes from a surface of the adhesive layer by a predetermined amount. The tackiness between the adhesive material and the base member is lower than the tackiness between the adhesive material and the substrate.

摘要翻译： 一种基板支撑夹具，用于在将电子部件安装在基板上时用于可拆卸地保持基板，包括：基部构件，其具有面对并且基本上彼此平行的第一表面和第二表面; 以及通过向粘合剂区域施加预定单位粘性的粘合剂材料，形成在第一表面侧上具有预定形状和预定厚度的粘合剂层。 在粘合剂区域中形成有陆地部分，使得陆部的表面从粘合剂层的表面突出预定量。 粘合剂材料与基材之间的粘合性低于粘合剂材料与基材之间的粘合性。

公开(公告)号：US07077908B2

公开(公告)日：2006-07-18

申请号：US10854253

申请日：2004-05-27

申请人： Tatsuki Nogiwa ,  Hidehiko Uemura ,  Hironori Uemura

发明人： Tatsuki Nogiwa ,  Hidehiko Uemura ,  Hironori Uemura

IPC分类号： B05C13/02

CPC分类号： H05K3/1216 ,  B23K3/0623 ,  B23K3/0638 ,  B23K2101/40 ,  H05K1/0393 ,  H05K3/0097 ,  H05K2203/0165 ,  Y10S269/903 ,  Y10T156/1972

摘要： In a substrate holder for holding a circuit board onto which a viscous material for bonding electronic components is printed by use of a squeegee through a screen mask, a first holding area for holding the screen mask and a second holding area for holding the circuit board are provided on a base surface. The squeegee is supported by at least one of the first holding area and the second holding area. The squeegee is abutted against the circuit board being held to the second holding area, via the screen mask placed on the circuit board.

摘要翻译： 在用于保持电路板的基板保持器中，通过使用刮板通过屏蔽掩模印刷用于粘合电子部件的粘性材料，用于保持屏蔽掩模的第一保持区域和用于保持电路板的第二保持区域是 设在基面上。 刮板由第一保持区域和第二保持区域中的至少一个支撑。 刮板通过放置在电路板上的屏蔽掩模抵靠保持在第二保持区域的电路板。