公开(公告)号：US20060237514A1

公开(公告)日：2006-10-26

申请号：US11279693

申请日：2006-04-13

申请人： Tatsuya WAGOU ,  Toru Mizuno ,  Osamu Shindo

发明人： Tatsuya WAGOU ,  Toru Mizuno ,  Osamu Shindo

IPC分类号： B23K1/08

CPC分类号： B23K3/0615 ,  H01L2224/11 ,  H05K3/3478

摘要： A solder dispenser provides a cylindrical dispensing container which has a solder inlet for introducing the above-mentioned solder member, and an opening portion for discharging the above-mentioned solder member to the external, and forms an internal space where the solder member can fall between the above-mentioned solder inlet and the above-mentioned opening portion, and a solder supply portion which is detachably mounted in the dispensing container and holds the solder member, wherein, in a state that the above-mentioned lid member is mounted in the above-mentioned dispensing container, the above-mentioned solder supply portion holds the above-mentioned solder member in the opening region of the above-mentioned solder inlet and the above-mentioned internal space becomes a closed space except the above-mentioned opening portion, and wherein, when holding of the solder member is released, the solder member falls inside a closed space to arrive at the opening portion.

摘要翻译： 焊料分配器提供圆柱形分配容器，其具有用于引入上述焊料构件的焊料入口和用于将上述焊料部件排出到外部的开口部分，并形成内部空间，焊料部件可以落在 上述焊料入口和上述开口部分，以及可拆卸地安装在分配容器中并保持焊料构件的焊料供应部分，其中，在上述盖构件安装在上述状态下 上述焊料供给部将上述焊料保持在上述焊料入口的开口区域中，上述内部空间成为除上述开口部以外的封闭空间， 其中，当焊料部件的保持被释放时，焊料部件落入封闭空间内以到达开口部分。

公开(公告)号：US07810705B2

公开(公告)日：2010-10-12

申请号：US11854222

申请日：2007-09-12

申请人： Toru Mizuno ,  Kazuaki Takanuki ,  Tatsuya Wagou

发明人： Toru Mizuno ,  Kazuaki Takanuki ,  Tatsuya Wagou

IPC分类号： B23K35/12

CPC分类号： B23K3/0623 ,  B23K2101/38 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/086

摘要： In a conductive material supply apparatus that can connect a small slider electrode and a wiring electrode on a flexure in a miniaturized magnetic head, electrically conductive material is supplied, with the aid of flow of nitrogen gas that is pressurized to a first pressure, into the interior of a nozzle assembly that defines an interior space having a nozzle orifice through which the electrically conductive material can pass. After the electrically conductive material has been supplied, the flow of the nitrogen gas is stopped, and the interior space is temporarily brought into communication with the exterior space thereby decreasing the pressure in the interior space. Thereafter, nitrogen gas maintained at a second pressure that is designed to be lower than the first pressure is supplied to the interior space, whereby the electrically conductive material is ejected to the exterior from the nozzle orifice by the effect of the second pressure.

摘要翻译： 在小型磁头中的弯曲部上可以连接小滑块电极和布线电极的导电材料供给装置中，借助于加压到第一压力的氮气流，供给导电材料， 喷嘴组件的内部限定具有喷嘴孔的内部空间，导电材料可以通过该喷嘴孔通过。 在提供导电材料之后，停止氮气的流动，并且内部空间暂时与外部空间连通，从而减小内部空间中的压力。 此后，保持在设计为低于第一压力的第二压力的氮气被供应到内部空间，由此导电材料通过第二压力从喷嘴孔喷射到外部。

公开(公告)号：US20080050209A1

公开(公告)日：2008-02-28

申请号：US11842644

申请日：2007-08-21

申请人： Toru Mizuno ,  Kazuaki Takanuki ,  Tatsuya Wagou

发明人： Toru Mizuno ,  Kazuaki Takanuki ,  Tatsuya Wagou

IPC分类号： B65G53/12 ,  H01L21/67

CPC分类号： B23K3/0623 ,  H02G3/30 ,  H05K3/3478

摘要： A conductive member supply apparatus including a reservoir portion containing an internal space in which the conductive members are stored and a first gas-passing aperture communicating with the internal space, an alignment portion including an alignment path in which the conductive members are arranged in a row and which communicates with the internal space, and a second gas-passing aperture communicating with the alignment path, a stopper for closing/opening the alignment path, first gas supply unit which supplies gas to the alignment path from the first gas-passing aperture and through the internal space, second gas supply unit which supplies gas to the aligning direction of the conductive members from the second gas-passing aperture, and control unit which activates the first gas supply unit to supply gas in a state where the stopper is closed, wherein a distance between the second gas-passing aperture and the stopper along a direction of the alignment is substantially within a range of from a dimension of one conductive member to a dimension of one and a half conductive members.

摘要翻译： 一种导电构件供给装置，包括储存部，该储存部包含存储有导电构件的内部空间和与内部空间连通的第一气体通过孔，对准部，其具有将导电构件排列成一列的取向路径 和与内部空间连通的第二气体通过孔和与对准路径连通的第二气体通过孔，用于关闭/打开对准路径的止动件，从第一气体通过孔向对准路径供给气体的第一气体供给单元， 通过内部空间，从第二气体通过孔向导电构件的排列方向供给气体的第二气体供给单元以及在止动器关闭的状态下启动第一气体供给单元供给气体的控制单元， 其中所述第二气体通过孔和所述止动件沿着所述取向的方向之间的距离基本上在一定的范围内 从一个导电构件的尺寸到一个半导电构件的尺寸。

公开(公告)号：US20090001054A1

公开(公告)日：2009-01-01

申请号：US12143267

申请日：2008-06-20

申请人： Toru Mizuno ,  Tatsuya Wagou ,  Hidetoshi Suzuki

发明人： Toru Mizuno ,  Tatsuya Wagou ,  Hidetoshi Suzuki

IPC分类号： B23K11/00 ,  B23K11/24

CPC分类号： B23K1/0056 ,  B23K3/0623 ,  B23K2101/36 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/742 ,  H01L2924/00014 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/074 ,  H05K2203/107 ,  H01L2224/05599

摘要： The present invention relates to a bonding method or an apparatus for projecting a conductive element from a nozzle onto an object to be bonded and electrically bonding the object to be bonded and the conductive element. The method of invention comprises the steps of: preparing the conductive element having an outer diameter with a curvature radius larger than a curvature radius of a portion of an opening of the nozzle which is in contact with the conductive element; pressurizing and attaching the conductive element to the opening of the nozzle; and supplying a compressed gas into an inner space of the nozzle and projecting the conductive element in a solid phase state onto the object to be bonded.

摘要翻译： 本发明涉及一种用于将导电元件从喷嘴突出到待接合物体上并将待接合物体与导电元件电接合的接合方法或装置。 本发明的方法包括以下步骤：制备具有曲率半径大于与导电元件接触的喷嘴的开口部分的曲率半径的外径的导电元件; 将导电元件加压并附着到喷嘴的开口; 并将压缩气体供给到所述喷嘴的内部空间，并将所述导电元件以固相状态投影到所述被接合物上。

公开(公告)号：US20080073413A1

公开(公告)日：2008-03-27

申请号：US11854222

申请日：2007-09-12

申请人： Toru MIZUNO ,  Kazuaki TAKANUKI ,  Tatsuya WAGOU

发明人： Toru MIZUNO ,  Kazuaki TAKANUKI ,  Tatsuya WAGOU

IPC分类号： B23K31/02 ,  B23K37/06

CPC分类号： B23K3/0623 ,  B23K2101/38 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/086

摘要： In a conductive material supply apparatus that can connect a small slider electrode and a wiring electrode on a flexure in a miniaturized magnetic head, electrically conductive material is supplied, with the aid of flow of nitrogen gas that is pressurized to a first pressure, into the interior of a nozzle assembly that defines an interior space having a nozzle orifice through which the electrically conductive material can pass. After the electrically conductive material has been supplied, the flow of the nitrogen gas is stopped, and the interior space is temporarily brought into communication with the exterior space thereby decreasing the pressure in the interior space. Thereafter, nitrogen gas maintained at a second pressure that is designed to be lower than the first pressure is supplied to the interior space, whereby the electrically conductive material is ejected to the exterior from the nozzle orifice by the effect of the second pressure.

摘要翻译： 在小型磁头中的弯曲部上可以连接小滑块电极和布线电极的导电材料供给装置中，借助于加压到第一压力的氮气流，供给导电材料， 喷嘴组件的内部限定具有喷嘴孔的内部空间，导电材料可以通过该喷嘴孔通过。 在提供导电材料之后，停止氮气的流动，并且内部空间暂时与外部空间连通，从而减小内部空间中的压力。 此后，保持在设计为低于第一压力的第二压力的氮气被供应到内部空间，由此导电材料通过第二压力从喷嘴孔喷射到外部。

公开(公告)号：US07348515B2

公开(公告)日：2008-03-25

申请号：US11279693

申请日：2006-04-13

申请人： Tatsuya Wagou ,  Toru Mizuno ,  Osamu Shindo

发明人： Tatsuya Wagou ,  Toru Mizuno ,  Osamu Shindo

IPC分类号： B23K26/00

CPC分类号： B23K3/0615 ,  H01L2224/11 ,  H05K3/3478

摘要： A solder dispenser provides a cylindrical dispensing container which has a solder inlet for introducing a solder member, and an opening portion for discharging the above-mentioned solder member to the external, and forms an internal space where the solder member can fall between the above-mentioned solder inlet and the above-mentioned opening portion, and a solder supply portion which is detachably mounted in the dispensing container and holds the solder member, wherein, in a state that a lid member is mounted in the above-mentioned dispensing container, the above-mentioned solder supply portion holds the above-mentioned solder member in the opening region of the above-mentioned solder inlet and the above-mentioned internal space becomes a closed space except the above-mentioned opening portion, and wherein, when holding of the solder member is released, the solder member falls inside a closed space to arrive at the opening portion.

摘要翻译： 焊料分配器提供圆柱形分配容器，其具有用于引入焊料部件的焊料入口和用于将上述焊接部件排出到外部的开口部分，并且形成内部空间， 上述焊料入口和上述开口部分，以及可拆卸地安装在分配容器中并保持焊料部件的焊料供给部，其中，在将盖部件安装在上述分配容器中的状态下， 上述焊料供给部将上述焊料保持在上述焊料入口的开口区域中，上述内部空间除了上述开口部分之外成为封闭空间，并且其中，当保持 焊料部件被释放，焊料部件落入封闭空间内以到达开口部分。

公开(公告)号：US20070228021A1

公开(公告)日：2007-10-04

申请号：US11686514

申请日：2007-03-15

申请人： Tatsuya Wagou ,  Osamu Shindo ,  Toru Mizuno

发明人： Tatsuya Wagou ,  Osamu Shindo ,  Toru Mizuno

IPC分类号： B23K26/00

CPC分类号： B23K3/0623 ,  B23K1/0056

摘要： A nozzle unit for use in an adjoining apparatus which places a heat fused electrically conductive member in an adjoining position for adjoining a first member and a second member, thereby electrically adjoining the first member and the second member, the nozzle unit including: a tubular nozzle assembly having a containing space which contains the conductive member and an aperture which communicates with the containing space, through which the conductive member, contained in the containing space, is ejected to the adjoining position, and which has a diameter larger than a diameter of the conductive member; and a hold member for releasably holding the conductive member in the containing space; wherein the nozzle assembly includes a tubular guide area of an internal diameter same as the diameter of the aperture, in a region from the position of the conductive member, supported by the support member, to the aperture.

摘要翻译： 一种用于相邻装置的喷嘴单元，其将热熔接的导电构件放置在邻接位置以邻接第一构件和第二构件，从而与第一构件和第二构件电连接，喷嘴单元包括：管状喷嘴 组件，其具有容纳空间的容纳导电构件和与容纳空间连通的孔，容纳在容纳空间中的导电构件通过该孔被排出到邻接位置，并且其直径大于 导电构件; 以及保持构件，用于将导电构件可释放地保持在容纳空间中; 其中所述喷嘴组件包括与所述孔的直径相同的内径的管状引导区域，所述引导区域从所述导电构件的位置由所述支撑构件支撑到所述孔。