-
公开(公告)号：US5078831A
公开(公告)日：1992-01-07
申请号：US581763
申请日：1990-09-13
CPC分类号： H05K3/4661 , H05K3/38 , H05K3/4626 , H05K1/0306 , H05K1/0373 , H05K2201/0195 , H05K2201/0209 , H05K2201/0347 , H05K2201/2072 , H05K2203/0759 , H05K3/102 , H05K3/246 , Y10T428/24917 , Y10T428/252 , Y10T428/256
摘要： A multilayer printed wiring board and a method of manufacturing the board are provided. The board has a printed wiring incorporating metal powder consisting of fine grains and a layer of insulation material which is adhesive when uncured. The fine grains of the metal powder are securely fixed to the layer of insulation material so as to strengthen the bond between the printed wiring and the layer of insulation material. Alternatively, the layer of insulation material incorporates a layer of glass powder to enhance the insulation thereof. In this case, the layer of glass powder is made by evenly spreading glass powder on a first coat of uncured adhesive insulation material. The layer of glass powder is covered by a second coat of insulation material after the first coat of insulation material is cured so that the layer of glass powder is sandwiched between the two coats of insulation material. The metal powder is evenly spread on a layer of insulation material or the second coat of insulation material while the insulation material is uncured and adhesive. After the insulation material is cured, the surface of the insulation material covered with metal powder is copper-plated and is etched to form a printed wiring incorporating the metal powder.
摘要翻译： 提供一种多层印刷线路板及其制造方法。 该板具有包含由细晶粒组成的金属粉末和未固化时为粘合剂的绝缘材料层的印刷线路。 金属粉末的细晶粒牢固地固定在绝缘材料层上，以加强印刷布线和绝缘材料层之间的结合。 或者，绝缘材料层包含一层玻璃粉末以增强其绝缘。 在这种情况下，玻璃粉末层通过将玻璃粉均匀地分散在第一层未固化的粘合绝缘材料上而制成。 在第一层绝缘材料固化之后，玻璃粉末层被第二层绝缘材料覆盖，使得玻璃粉末层夹在两层绝缘材料之间。 金属粉末均匀铺展在绝缘材料层或第二层绝缘材料上，同时绝缘材料未固化和粘合。 在绝缘材料固化之后，用金属粉末覆盖的绝缘材料的表面被镀铜并被蚀刻以形成包含金属粉末的印刷线路。
-
公开(公告)号：US5130179A
公开(公告)日：1992-07-14
申请号：US803027
申请日：1991-12-06
CPC分类号： H05K3/4661 , H05K3/38 , H05K3/4626 , H05K1/0306 , H05K1/0373 , H05K2201/0195 , H05K2201/0209 , H05K2201/0347 , H05K2201/2072 , H05K2203/0759 , H05K3/102 , H05K3/246 , Y10T428/24917 , Y10T428/252 , Y10T428/256
摘要： A multilayer printed wiring board and a method of manufacturing the board are provided. The board has a printed wiring incorporating metal powder consisting of fine grains and a layer of insulation material which is adhesive when uncured. The fine grains of the metal powder are securely fixed to the layer of insulation material so as to strengthen the bond between the printed wiring and the layer of insulation material. Alternatively, the layer of insulation material incorporates a layer of glass powder to enhance the insulation thereof. In this case, the layer of glass powder is made by evenly spreading glass powder on a first coat of uncured adhesive insulation material. The layer of glass powder is covered by a second coat of insulation material after the first coat of insulation material is cured so that the layer of glass powder is sandwiched between the two coats of insulation material. The metal powder is evenly spread on a layer of insulation material or the second coat of insulation material while the insulation material is uncured and adhesive. After the insulation material is cured, the surface of the insulation material covered with metal powder is copper-plated and is etched to form a printed wiring incorporating the metal powder.
-
搜索结果
2 条记录 (耗时 0.009 秒)
