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1.发明授权Material for forming electroless plate and method for forming electroless plate using the same 有权用于形成无电镀板的材料和使用其形成无电镀板的方法公开(公告)号：US08206828B2
公开(公告)日：2012-06-26
申请号：US12224722
申请日：2007-03-12
Applicant: Tetsuji Ohta , Mitsuhiro Watanabe
Inventor： Tetsuji Ohta , Mitsuhiro Watanabe
CPC classification number: C23C18/31 , C23C18/1608 , C23C18/1653 , C23C18/1893 , C23C18/2086 , C23C18/285 , C23C18/30 , C23C18/405 , Y10T428/2896 , Y10T428/31551 , Y10T428/31554
Abstract: A material for electroless plating shows good adhesion for a catalyst and does not cause delamination of a catalyst adhering layer from a non-conductive base material in a catalyst adhering step, development step or other step.In a material for electroless plating, having a catalyst adhering layer on a non-conductive base material, the catalyst adhering layer is formed from a hydrophilic and/or water-soluble resin containing hydroxyl group, and a curable layer formed from a resin having hydroxyl group and an isocyanate type compound is provided between the base material and the catalyst adhering layer. The catalyst adhering layer is preferably formed while isocyanate groups of the isocyanate type compound in the curable layer remain.
Abstract translation: 用于无电镀的材料对于催化剂显示出良好的粘附性，并且在催化剂附着步骤，显影步骤或其它步骤中不会引起催化剂粘附层与非导电性基材的分层。 在无电镀的材料中，在非导电性基材上具有催化剂附着层，催化剂附着层由含有羟基的亲水性和/或水溶性树脂形成，由具有羟基的树脂形成的固化层 基团和催化剂附着层之间设置异氰酸酯型化合物。 优选在固化层中的异氰酸酯类化合物的异氰酸酯基残留的同时形成催化剂附着层。
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2.发明申请MATERIAL FOR FORMING ELECTROLESS PLATE, COATING SOLUTION FOR ADHERING CATALYST, METHOD FOR FORMING ELECTROLESS PLATE, AND PLATING METHOD 审中-公开用于形成电镀板的材料，用于加入催化剂的涂层溶液，形成电镀板的方法和镀层方法公开(公告)号：US20100016147A1
公开(公告)日：2010-01-21
申请号：US12525462
申请日：2008-02-01
Applicant: Tetsuji Ohta , Keiko Kitamura , Mitsuhiro Watanabe
Inventor： Tetsuji Ohta , Keiko Kitamura , Mitsuhiro Watanabe
CPC classification number: C23C18/1893 , C23C18/1653 , C23C18/1692 , C23C18/1889 , C23C18/285 , C23C18/30 , C23C18/31 , Y10T428/31678 , Y10T428/31681 , Y10T428/31786
Abstract: A material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of catalyst adhering layer from non-conductive base material, no dissolution of catalyst adhering layer into a plating solution, and no discoloration of interface of plate layer with catalyst adhering layer during the catalyst adhering step, development step and other steps. The material includes a non-conductive base material and a catalyst adhering layer, provided on the non-conductive base and including a water-insoluble polyester resin The catalyst adhering layer shows a contact angle of 60° or smaller to purified water.
Abstract translation: 用于形成无电镀板的材料显示出良好的催化剂附着性，并且不显示催化剂粘附层与非导电性基材的分层，催化剂粘附层不溶解到电镀液中，并且不会使板层与催化剂粘附层的界面变色 在催化剂粘附步骤，显影步骤等步骤中。 该材料包括非导电性基材和催化剂粘合层，其设置在非导电性基材上，并且包含水不溶性聚酯树脂。催化剂粘合层与纯化水的接触角为60°以下。
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3.发明申请公开(公告)号：US20050036220A1
公开(公告)日：2005-02-17
申请号：US10805087
申请日：2004-03-19
Applicant: Tetsuto Miyanishi , Tetsuji Ohta
Inventor： Tetsuto Miyanishi , Tetsuji Ohta
CPC classification number: B60K37/02 , B60Y2410/12
Abstract: An indicator panel for a vehicle instrument panel is provided with a base substrate having transparency, an ink-acceptance layer coated on at least one surface of the base substrate and a shading layer coated further on the ink-acceptance layer. Hazes of the base substrate and the ink-acceptance layer are more than 92.8% and less than 93.5%.
Abstract translation: 车用仪表板的指示面板设置有具有透明性的基底基材，涂覆在基础基材的至少一个表面上的油墨接受层和进一步涂布在油墨接受层上的遮光层。 基底和油墨接受层的Haz值大于92.8％，小于93.5％。
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公开(公告)号：US06592970B2
公开(公告)日：2003-07-15
申请号：US09417124
申请日：1999-10-13
Applicant: Tetsuji Ohta , Mitsuru Ochiai , Helmut Mangold
Inventor： Tetsuji Ohta , Mitsuru Ochiai , Helmut Mangold
IPC: B41M500
CPC classification number: B41M5/5218 , B41M5/508 , B41M5/52 , Y10T428/24802
Abstract: An ink jet recording material excellent in all characteristics including drying property, ink absorbency, water resistance and the like, is provided. The ink jet recording material has an ink-receiving layer comprising hydrophilic resin and inorganic pigment, the ink-receiving layer containing silica particles surface-doped with alumina as the inorganic pigment. The alumina-doped silica is prepared by a process employing flame hydrolysis techniques combined with pyrolysis. The ink-receiving layer preferably contains the alumina-doped silica in an amount ranging from 5 to 200 weight parts based on 100 weight parts of the hydrophilic resin.
Abstract translation: 提供了具有干燥性，油墨吸收性，耐水性等所有特性优异的喷墨记录材料。 喷墨记录材料具有包含亲水性树脂和无机颜料的油墨接收层，油墨接收层含有表面掺杂氧化铝作为无机颜料的二氧化硅颗粒。 氧化铝掺杂的二氧化硅通过使用与热解相结合的火焰水解技术的方法制备。 油墨接收层优选含有相对于100重量份亲水性树脂为5〜200重量份的氧化铝掺杂二氧化硅。
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5.发明授权Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating method 有权用于形成无电镀板的材料，用于粘合催化剂的涂布溶液，用于形成无电镀板的方法和电镀方法公开(公告)号：US08734958B2
公开(公告)日：2014-05-27
申请号：US12525469
申请日：2008-02-01
Applicant: Tetsuji Ohta , Keiko Kitamura , Mitsuhiro Watanabe
Inventor： Tetsuji Ohta , Keiko Kitamura , Mitsuhiro Watanabe
CPC classification number: C23C18/1893 , C23C18/1653 , C23C18/1692 , C23C18/1889 , C23C18/285 , C23C18/30 , C23C18/31 , Y10T428/31678 , Y10T428/31681 , Y10T428/31786
Abstract: A material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of catalyst adhering layer from non-conductive base material, no dissolution of catalyst adhering layer into a plating solution, and no discoloration of interface of plate layer with catalyst adhering layer during the catalyst adhering step, development step and other steps. The material includes a non-conductive base material and a catalyst adhering layer, provided on the non-conductive base and including a water-insoluble polyester resin The catalyst adhering layer shows a contact angle of 60° or smaller to purified water.
Abstract translation: 用于形成无电镀板的材料显示出良好的催化剂附着性，并且不显示催化剂粘附层与非导电性基材的分层，催化剂粘附层不溶解到电镀液中，并且不会使板层与催化剂粘附层的界面变色 在催化剂粘附步骤，显影步骤等步骤中。 该材料包括非导电性基材和催化剂粘合层，其设置在非导电性基材上，并且包含水不溶性聚酯树脂。催化剂粘合层与纯化水的接触角为60°以下。
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Patent Agency Ranking
6.发明授权Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating method 有权用于形成无电镀板的材料，用于粘合催化剂的涂布溶液，用于形成无电镀板的方法和电镀方法公开(公告)号：US08389123B2
公开(公告)日：2013-03-05
申请号：US12525374
申请日：2008-02-01
Applicant: Tetsuji Ohta , Keiko Kitamura , Mitsuhiro Watanabe
Inventor： Tetsuji Ohta , Keiko Kitamura , Mitsuhiro Watanabe
CPC classification number: C09J133/26 , C08F220/14 , C08L33/066 , C23C18/1641 , C23C18/1653 , C23C18/1692 , C23C18/2066 , C23C18/31 , H05K3/387 , Y10T428/31855 , Y10T428/31935 , C08F2220/281 , C08F220/06 , C08F220/58 , C08F212/08
Abstract: A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a hydrophilic (meth)acrylic resin constituted with a hydrophilic monomer and a hydrophobic monomer and containing the hydrophobic monomer at a ratio of 50 to 90 mol %. This material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of the catalyst adhering layer from the non-conductive base material, no dissolution of the catalyst adhering layer into a plating solution, and no discoloration of plate layer during the catalyst adhering step, development step and other steps.
Abstract translation: 包含非导电性基体材料和设置在非导电性基材上的催化剂粘附层的无电解板的形成用材料构成为，催化剂粘附层应包含亲水性单体构成的亲水性（甲基）丙烯酸树脂， 疏水性单体，含有50〜90摩尔％的疏水性单体。 用于形成无电镀板的材料表现出良好的催化剂附着性，并且不显示催化剂粘附层与非导电性基材的分层，催化剂粘附层不溶解于电镀液中，并且在催化剂期间不会使板层变色 贴合步骤，开发步骤等步骤。
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7.发明申请MATERIAL FOR FORMING ELECTROLESS PLATE, COATING SOLUTION FOR ADHERING CATALYST, METHOD FOR FORMING ELECTROLESS PLATE, AND PLATING METHOD 有权用于形成电镀板的材料，用于加入催化剂的涂层溶液，形成电镀板的方法和镀层方法公开(公告)号：US20110005936A1
公开(公告)日：2011-01-13
申请号：US12525469
申请日：2008-02-01
Applicant: Tetsuji Ohta , Keiko Kitamura , Mitsuhiro Watanabe
Inventor： Tetsuji Ohta , Keiko Kitamura , Mitsuhiro Watanabe
CPC classification number: C23C18/1893 , C23C18/1653 , C23C18/1692 , C23C18/1889 , C23C18/285 , C23C18/30 , C23C18/31 , Y10T428/31678 , Y10T428/31681 , Y10T428/31786
Abstract: There is provided a material for forming electroless plate which shows favorable catalyst adhering property, and shows no delamination of catalyst adhering layer from non-conductive base material, no dissolution of catalyst adhering layer into a plating solution, and no discoloration of interface of plate layer with catalyst adhering layer during the catalyst adhering step, development step and other steps.A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a water-insoluble polyester resin, and surface of the catalyst adhering layer should show a contact angle of 60° or smaller to purified water.
Abstract translation: 提供了形成无电镀板的材料，其具有良好的催化剂附着性，并且不显示催化剂粘附层与非导电基材的分层，催化剂粘附层不溶解到电镀液中，并且不会使板层的界面变色 在催化剂粘附步骤中具有催化剂粘附层，显影步骤等步骤。 包含非导电性基体材料和设置在非导电性基材上的催化剂粘附层的无电镀板的形成材料构成为使催化剂粘附层由不溶于水的聚酯树脂构成，催化剂附着层的表面 应显示与净化水接触角为60°或更小的接触角。
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8.发明授权公开(公告)号：US06856478B1
公开(公告)日：2005-02-15
申请号：US10805087
申请日：2004-03-19
Applicant: Tetsuto Miyanishi , Tetsuji Ohta
Inventor： Tetsuto Miyanishi , Tetsuji Ohta
CPC classification number: B60K37/02 , B60Y2410/12
Abstract: An indicator panel for a vehicle instrument panel is provided with a base substrate having transparency, an ink-acceptance layer coated on at least one surface of the base substrate and a shading layer coated further on the ink-acceptance layer. Hazes of the base substrate and the ink-acceptance layer are more than 92.8% and less than 93.5%.
Abstract translation: 车用仪表板的指示面板设置有具有透明性的基底基材，涂覆在基础基材的至少一个表面上的油墨接受层和进一步涂布在油墨接受层上的遮光层。 基底和油墨接受层的Haz值大于92.8％，小于93.5％。
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9.发明申请Material for forming electroless plate and method for producing electrolessly plated non-conductive substrate 审中-公开用于形成无电镀板的材料和用于生产无电镀非导电衬底的方法公开(公告)号：US20090035559A1
公开(公告)日：2009-02-05
申请号：US12153207
申请日：2008-05-15
Applicant: Keiko Kitamura , Takashi Shimizu , Tetsuji Ohta , Masayuki Nakatani
Inventor： Keiko Kitamura , Takashi Shimizu , Tetsuji Ohta , Masayuki Nakatani
CPC classification number: H05K3/387 , C23C18/1601 , C23C18/1608 , C23C18/1653 , C23C18/1893 , C23C18/2006 , C23C18/2086 , C23C18/31 , Y10T428/265
Abstract: A material for forming electroless plate comprising a non-conductive substrate and a catalyst adhering layer provided on the substrate is constituted so that the catalyst adhering layer contains a hydrophilic ionizing radiation curable resin composition, a surface of the catalyst adhering layer shows a contact angle of 60° or smaller to purified water, and preferably the hydrophilic ionizing radiation curable resin composition is in a half-cured state for the portion of the catalyst adhering layer. A material for forming electroless plate shows favorable adhesion for catalyst, and the catalyst adhering layer hardly dissolves into a plating solution in the step of adhering catalyst, the step of development and other steps.
Abstract translation: 用于形成包含设置在基板上的非导电基板和催化剂粘合层的无电镀板的材料构成为使得催化剂粘附层含有亲水电离辐射固化树脂组合物，催化剂粘合层的表面显示出接触角 对于净化水为60℃以下，优选亲水性电离辐射固化型树脂组合物在催化剂粘附层的一部分处于半固化状态。 用于形成无电镀板的材料在催化剂粘附，显影步骤和其它步骤的步骤中，对催化剂具有良好的粘合性，并且催化剂粘附层几乎不溶解于电镀溶液中。
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10.发明申请MATERIAL FOR FORMING ELECTROLESS PLATE, COATING SOLUTION FOR ADHERING CATALYST, METHOD FOR FORMING ELECTROLESS PLATE, AND PLATING METHOD 有权用于形成电镀板的材料，用于加入催化剂的涂层溶液，形成电镀板的方法和镀层方法公开(公告)号：US20100108528A1
公开(公告)日：2010-05-06
申请号：US12525374
申请日：2008-02-01
Applicant: Tetsuji Ohta , Keiko Kitamura , Mitsuhiro Watanabe
Inventor： Tetsuji Ohta , Keiko Kitamura , Mitsuhiro Watanabe
CPC classification number: C09J133/26 , C08F220/14 , C08L33/066 , C23C18/1641 , C23C18/1653 , C23C18/1692 , C23C18/2066 , C23C18/31 , H05K3/387 , Y10T428/31855 , Y10T428/31935 , C08F2220/281 , C08F220/06 , C08F220/58 , C08F212/08
Abstract: A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a hydrophilic (meth)acrylic resin constituted with a hydrophilic monomer and a hydrophobic monomer and containing the hydrophobic monomer at a ratio of 50 to 90 mol %. This material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of the catalyst adhering layer from the non-conductive base material, no dissolution of the catalyst adhering layer into a plating solution, and no discoloration of plate layer during the catalyst adhering step, development step and other steps.
Abstract translation: 包含非导电性基体材料和设置在非导电性基材上的催化剂粘附层的无电解板的形成用材料构成为，催化剂粘附层应包含亲水性单体构成的亲水性（甲基）丙烯酸树脂， 疏水性单体，含有50〜90摩尔％的疏水性单体。 用于形成无电镀板的材料表现出良好的催化剂附着性，并且不显示催化剂粘附层与非导电性基材的分层，催化剂粘附层不溶解于电镀液中，并且在催化剂期间不会使板层变色 贴合步骤，开发步骤等步骤。
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