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1.
公开(公告)号:US12110594B2
公开(公告)日:2024-10-08
申请号:US17476508
申请日:2021-09-16
发明人: Kuan Soo Shin , Jeong Hei Choi , Yoon Kyung Jung , Min Young Cho
CPC分类号: C23C18/44 , C23C18/1641
摘要: The present invention relates to a composition for electroless platinum plating and an electroless platinum plating method using the same, wherein it is possible to easily and safely produce a uniformly dispersed platinum thin film without expensive additional equipment by performing electroless platinum plating with a composition for electroless platinum plating containing an alcohol, an aqueous solution of a platinum chloride compound, and an aqueous solution of a basic compound.
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公开(公告)号:US20240304355A1
公开(公告)日:2024-09-12
申请号:US18275827
申请日:2022-02-04
申请人: MONASH UNIVERSITY
发明人: Wenlong CHENG , Lim Wei YAP , Fenge LIN , Kaixuan WANG
IPC分类号: H01B1/22 , A61B5/00 , A61B5/257 , A61B5/28 , C23C18/16 , C23C18/20 , C23C18/44 , C25B3/07 , C25B3/09 , C25B11/031 , C25B11/052 , C25B11/057 , C25B11/081 , H01Q1/36
CPC分类号: H01B1/22 , A61B5/0006 , A61B5/257 , A61B5/28 , C23C18/1641 , C23C18/1644 , C23C18/1666 , C23C18/2086 , C23C18/44 , C25B11/031 , C25B11/052 , C25B11/057 , C25B11/081 , H01Q1/364 , A61B2560/0214 , C25B3/07 , C25B3/09
摘要: Deformable porous elastic conductors and fabrication methods thereof, as well as their use in a broad range of applications including electrodes, supercapacitors, antennae, and electrocatalysts, medical devices, soft electronic devices and wearable sensors.
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公开(公告)号:US20230313382A1
公开(公告)日:2023-10-05
申请号:US17754502
申请日:2020-10-02
申请人: MacDermid, Inc.
发明人: Trevor PEARSON , Alison HYSLOP , Amrik SINGH , Roderick HERDMAN
CPC分类号: C23C18/163 , C23C18/1608 , C23C18/1641 , C23C18/1879 , C23C18/32 , C23C18/38
摘要: A support for supporting a component to be plated in a chromic acid-free plating process, the support having a contact surface comprising iodine-treated and/or bromine-treated plastic.
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公开(公告)号:US11761091B2
公开(公告)日:2023-09-19
申请号:US16651768
申请日:2018-09-28
发明人: Urko Martin , Miguel Ventura , Manuel Pastor , Rebeca Negron Canovas , Julio Gomez Cordon , Luis Otano Jiminez , Javier Perez Martinez
IPC分类号: C23C18/30 , C23C18/12 , C23C18/28 , C23C18/32 , C23C18/38 , C23C18/24 , C23C18/20 , C23C18/16 , C25D3/38 , C25D5/56 , C09K13/10
CPC分类号: C23C18/24 , C09K13/10 , C23C18/122 , C23C18/1641 , C23C18/1653 , C23C18/2066 , C23C18/2086 , C23C18/28 , C23C18/30 , C25D3/38 , C25D5/56 , C09K2211/183 , C23C18/32 , C23C18/38 , C23C2222/10
摘要: An aqueous composition for use in activating surface of polymers.
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公开(公告)号:US20230193470A1
公开(公告)日:2023-06-22
申请号:US17559653
申请日:2021-12-22
申请人: Xerox Corporation
发明人: Nan-Xing HU , Yulin WANG , Sandra J. GARDNER
CPC分类号: C23C18/1641 , C08J3/14 , C08J3/05 , C23C18/31 , C08J2377/00
摘要: Metallized polymer particle compositions may comprise polymer particles, and a metal coating on an outer surface of at least a portion of the polymer particles. The metal coating comprises a plating metal and overlays a plurality of two-dimensional conductive nanoparticles and a catalyst metal. The metal coating may be formed by at least an electroless plating process conducted in the presence of the catalyst metal. The polymer particles may comprise thermoplastic polymer particles.
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6.
公开(公告)号:US11668008B2
公开(公告)日:2023-06-06
申请号:US17111040
申请日:2020-12-03
申请人: TDK CORPORATION
IPC分类号: B32B27/08 , B32B27/36 , B32B15/09 , B32B15/20 , B32B3/30 , H01L23/52 , H01L27/15 , B32B27/18 , H01L23/498 , H01L33/62 , H01L23/14 , H01L25/075 , C23C18/16 , C23C18/32 , C23C18/38 , C23C18/30 , C23F1/02
CPC分类号: C23C18/1641 , B32B3/30 , B32B15/09 , B32B15/20 , B32B27/08 , B32B27/18 , B32B27/36 , C23C18/161 , C23C18/1608 , C23C18/1651 , C23C18/30 , C23C18/32 , C23C18/38 , H01L23/52 , H01L27/156 , B32B2307/412 , B32B2457/20 , C23F1/02 , H01L23/145 , H01L23/498 , H01L25/0753 , H01L33/62
摘要: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.
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公开(公告)号:US20190202696A1
公开(公告)日:2019-07-04
申请号:US16230070
申请日:2018-12-21
IPC分类号: C01B21/064 , C23C16/34 , C23C18/32 , C23C18/16
CPC分类号: C01B21/0648 , C01P2004/22 , C01P2004/30 , C23C16/342 , C23C18/1641 , C23C18/32 , G03F1/20 , G03F1/60
摘要: A microstructure comprises a plurality of interconnected units wherein the units are formed of hexagonal boron nitride (h-BN) tubes. The graphene tubes may be formed by photo-initiating the polymerization of a monomer in a pattern of interconnected units to form a polymer microlattice, removing unpolymerized monomer, coating the polymer microlattice with a metal, removing the polymer microlattice to leave a metal microlattice, depositing an h-BN precursor on the metal microlattice, converting the h-BN precursor to h-BN, and removing the metal microlattice.
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公开(公告)号:US20180265985A1
公开(公告)日:2018-09-20
申请号:US15920391
申请日:2018-03-13
申请人: Raytheon Company
CPC分类号: C23C18/1616 , B32B37/16 , B63B3/16 , B64C1/00 , B64C2001/0072 , C23C18/08 , C23C18/16 , C23C18/1601 , C23C18/1603 , C23C18/1614 , C23C18/1633 , C23C18/1639 , C23C18/1641 , F42B10/143 , F42B12/76
摘要: A composite structural component is disclosed. The composite structural component can include a lattice structure, a casing disposed about at least a portion of the lattice structure, and a skin adhered to a surface of the casing. The lattice structure and the casing can be formed of a polymeric material and the skin can be formed of a metallic material. A method of manufacturing a composite structural component is disclosed. The method can include creating a casing of a polymeric material and creating a lattice structure of a polymeric material disposed about at least a portion of the casing. The method can include sealing the porosity of the casing and lattice structure. The method can include adhering a skin of a metallic material to at least a portion of the casing. At least one of creating a lattice structure and creating a casing comprises utilizing an additive manufacturing process.
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9.
公开(公告)号:US20180230294A1
公开(公告)日:2018-08-16
申请号:US15752929
申请日:2016-08-24
发明人: Yunan CHENG , Shijie SONG
CPC分类号: C08K5/5313 , B29B7/90 , B29C35/0805 , B29C45/0001 , B29C45/0005 , B29C2035/0838 , B29K2077/00 , B29K2105/0005 , B29K2105/16 , B29K2309/08 , B29K2479/085 , B29K2505/02 , C08K3/08 , C08K3/22 , C08K5/49 , C08K7/00 , C08K7/14 , C08K2003/0812 , C08K2003/2248 , C08K2003/2251 , C08K2201/003 , C08K2201/005 , C23C18/1641 , C23C18/38 , C08L77/06
摘要: Disclosed herein are laser activatable compositions. One composition may comprise: about 35% to about 75% by weight of at least one polyamide resin, preferably a 9,T resin; about 0.1% to about 20% by weight of a laser direct structuring additive; the laser activatable additive being operative to plate the composition upon being activated by a laser; about 0.5% to 20% by weight of a phosphorus-containing additive, preferably an organo phosphinate salt; and about 10% to 50% by weight of a reinforcing fiber, preferably a glass fiber having a substantially circular cross-section, the substantially circular cross-section having a diameter of 10 microns or less; where all weight percents are based on the total weight of the composition. Further embodiments provide compositions further comprising one or more organic, metallic, or mineral fillers, pigments, or combinations thereof. Also disclosed are methods of preparing these compositions and articles produced therefrom.
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公开(公告)号:US09982144B2
公开(公告)日:2018-05-29
申请号:US15100588
申请日:2014-12-19
发明人: Kensuke Kageyama
IPC分类号: H01B1/02 , C09D5/24 , C09D11/52 , C09J9/02 , C09J11/00 , C09J201/00 , C23C18/16 , C23C18/31 , C23C18/44 , H01B1/22 , C23C18/42 , C23C18/52 , C08J3/12 , C08K9/10 , C09D163/00 , C09J11/06 , C09J11/08 , C09J7/00 , C09J11/04
CPC分类号: C09D5/24 , C08J3/128 , C08J2325/06 , C08J2333/00 , C08J2361/06 , C08K9/10 , C08K2201/001 , C09D7/40 , C09D7/62 , C09D7/63 , C09D7/65 , C09D7/68 , C09D7/69 , C09D7/70 , C09D11/52 , C09D163/00 , C09J7/00 , C09J7/10 , C09J9/02 , C09J11/00 , C09J11/04 , C09J11/06 , C09J11/08 , C09J201/00 , C09J2203/318 , C23C18/16 , C23C18/1633 , C23C18/1641 , C23C18/165 , C23C18/31 , C23C18/42 , C23C18/44 , C23C18/52 , H01B1/02 , H01B1/22
摘要: Provided are highly reliable silver-coated conductive particles, which are prevented from an occurrence of migration, the silver-coated conductive particles in which: a tin layer is formed on a surface of each spherical base particle, and a silver plating layer is formed on a surface of the tin layer, and a surface of the silver plating layer is coated with a water repellent layer: the water repellent layer includes an organic sulfur compound that is mainly composed of a sulfide compound or a surfactant such as polyoxyethylene ethers: and a molded body that is formed by pressing the silver-coated conductive particles at a pressure of 14.7 MPa has a contact angle with water of 125 degree or more.
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