公开(公告)号：US20140030140A1

公开(公告)日：2014-01-30

申请号：US14110458

申请日：2012-04-06

申请人： Tetsuro Nishimura ,  Kazuhiro Nogita ,  Stuart David McDonald ,  Jonathan James Read ,  Tina Ventura

发明人： Tetsuro Nishimura ,  Kazuhiro Nogita ,  Stuart David McDonald ,  Jonathan James Read ,  Tina Ventura

IPC分类号： B23K35/26

CPC分类号： B23K35/262 ,  C22C13/00

摘要： A solder alloy may include a Sn—Cu hypereutectic area having Cu in the amount of up to 7.6 weight percent, from 0.006 to 0.5 weight percent of Al, Al2O3, or a combination thereof.

摘要翻译： 焊料合金可以包括具有高达7.6重量％的Cu，0.006-0.5重量％的Al，Al 2 O 3或其组合的Cu的Sn-Cu过共晶体区域。

公开(公告)号：US20120280020A1

公开(公告)日：2012-11-08

申请号：US13469755

申请日：2012-05-11

申请人： Tetsuro Nishimura

发明人： Tetsuro Nishimura

IPC分类号： B23K3/06

CPC分类号： B23K3/063 ,  B23K35/0227 ,  B23K35/0238 ,  B23K35/3613 ,  B23K35/362 ,  B23K35/40 ,  B23K2101/42 ,  Y10T428/12222 ,  Y10T428/2938

摘要： Provided is an apparatus for feeding wire solder with high tensile strength and pull cut resistance. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The apparatus for feeding the wire solder comprises a wire solder storage section where the wire solder with a core wire is stored and a core wire rewinding member that takes up an end of the core wire to rewind the core wire. While the core rewinding member is rotated to rewind the core wire, the single or multiple strands of solder are heated to perform soldering at the location of soldering upstream of the core wire rewinding member.

摘要翻译： 本发明提供一种具有高拉伸强度和抗拉力的线焊料的装置。 焊丝具有延长的焊丝和具有比焊丝更高的拉伸强度的芯线。 用于供给焊丝的装置包括：焊丝存储部，其中存储有芯线的焊丝;以及芯线重绕部件，其卷绕芯线的一端以重绕芯线。 当芯重绕构件被旋转以重绕芯线时，单个或多股焊料被加热以在芯线重绕构件的上游焊接的位置处进行焊接。

公开(公告)号：US20100007068A1

公开(公告)日：2010-01-14

申请号：US12518656

申请日：2006-12-14

申请人： Tetsuro Nishimura

发明人： Tetsuro Nishimura

IPC分类号： C22B15/14

CPC分类号： C22B25/08 ,  C22B9/10 ,  C22B15/006

摘要： An apparatus for depositing and separating excess copper dissolved in molten lead-free solder containing tin as the main element is provided. An apparatus 1 deposits excess copper in the molten lead-free solder as an intermetallic compound and separates it from the molten solder. The apparatus includes a deposition bath 2 for causing an intermetallic compound in the molten solder, a metal added from the outside and copper in the molten solder to be deposited, a granulation bath 4 including plates 31 32 and 33 for allowing the molten solder to pass through the plates to merge the intermetallic compounds into particles having a larger diameter, and a separation bath 5 for causing the enlarged intermetallic compounds to precipitate and separate in the molten solder.

摘要翻译： 提供一种用于沉积和分离溶解在含有锡的熔融无铅焊料中的多余铜作为主要元件的装置。 装置1将作为金属间化合物的熔融无铅焊料中的多余的铜沉积在熔融的无铅焊料中，并将其与熔融的焊料分离。 该装置包括用于使熔融焊料中的金属间化合物，从外部添加的金属和待沉积的熔融焊料中的铜的沉积槽2，包括用于允许熔融焊料通过的板31​​,32和33的造粒槽4 通过板将金属间化合物合并成具有较大直径的颗粒;以及分离槽5，用于使扩大的金属间化合物沉淀并在熔融焊料中分离。

公开(公告)号：US06296722B1

公开(公告)日：2001-10-02

申请号：US09582608

申请日：2000-06-28

申请人： Tetsuro Nishimura

发明人： Tetsuro Nishimura

IPC分类号： C22C1300

CPC分类号： C22C13/00 ,  B23K35/262

摘要： A lead-free solder characterized as comprising 0.1 to 2 wt % of Cu, 0.002 to 1 wt % of Ni with the residue being Sn. The solder preferably contains Cu in an amount of 0.3 to 0.7 wt %, and more preferably it contains Cu in an amount of 0.3 to 0.7 wt % and Ni in an amount of 0.04 to 0.1 wt %. The solder can be prepared by adding Ni to a molten mother alloy of Sn—Cu, or by adding Cu to a molten mother alloy of Sn—Ni. A lead-free solder which further comprises 0.001 to 1 wt % of Ga is also disclosed. The lead-free solder can form a solder joint having a high strength and stability comparable to those of a conventional Sn—Pb eutectic solder.

摘要翻译： 一种无铅焊料，其特征在于包含0.1至2重量％的Cu，0.002至1重量％的Ni，残余物为Sn。 焊料优选含有0.3〜0.7重量％的Cu，更优选含有0.3〜0.7重量％的Cu，0.04〜0.1重量％的Ni。 可以通过将Sn添加到Sn-Cu的熔融母合金中，或者通过向Sn-Ni的熔融母合金中添加Cu来制备焊料。 还公开了还含有0.001〜1重量％的Ga的无铅焊料。 无铅焊料可以形成具有与常规Sn-Pb共晶焊料相当的高强度和稳定性的焊点。

公开(公告)号：US4657535A

公开(公告)日：1987-04-14

申请号：US734094

申请日：1985-05-15

申请人： Tetsuro Nishimura ,  Nobukazu Tanokura ,  Masahiro Urushibata

发明人： Tetsuro Nishimura ,  Nobukazu Tanokura ,  Masahiro Urushibata

IPC分类号： A61M5/14 ,  A61M5/158 ,  A61M5/32 ,  A61M39/02

CPC分类号： A61M5/158

摘要： A heat sterilized medical needle device having a needle cannula with a pointed distal end, a hub supporting a proximal end portion of the needle cannula at one end thereof and allowing connection of a tube at the other end thereof to allow communication between the tube and the needle cannula therethrough, and a protector comprising a hollow body with a closed distal end and an open proximal end and sealing a portion of the needle cannula which is exposed from the hub within the hollow portion thereof. The hub has a thin portion to be twisted and broken to disconnect the hub from the protector, and the hub is coupled to the protector to form a liquid-tight joint by blocking at a portion of the hub which is closer to the pointed end of the needle cannula than the thin portion.

摘要翻译： 一种热灭菌的医用针装置，其具有带有尖端远端的针插管，其一端支撑针套管的近端部分，并且允许在另一端连接管，以允许管和管之间的连通 针管穿过其中，以及保护器，其包括具有闭合的远端和敞开的近端的中空本体，并且密封在其中空部分内从轮毂露出的针管的一部分。 轮毂具有薄的部分以扭曲和断裂以将轮毂与保护器断开，并且轮毂联接到保护器以通过在毂的一部分处被阻塞而形成液密接头，该部分更靠近尖端 针管比薄部分。

公开(公告)号：US20140037369A1

公开(公告)日：2014-02-06

申请号：US14111898

申请日：2012-04-16

申请人： Tetsuro Nishimura

发明人： Tetsuro Nishimura

IPC分类号： B23K35/26

CPC分类号： B23K35/262 ,  B23K35/26 ,  C22C13/00 ,  H05K3/3463 ,  Y10T403/479

摘要： The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt % of Ag, 0.3 to 1.5 wt % of Cu, 0.01 to 0.2 wt % of Ni, 1.0 wt % or less of Ga, and the balance being Sn and unavoidable impurities.

摘要翻译： 本发明提供一种具有高可靠性和优异的焊接性能的无铅焊料合金，并且适用于以低成本安装微粉化的电子部件。 根据本发明的无铅焊料合金具有含有0.5〜1.5重量％的Ag，0.3〜1.5重量％的Cu，0.01〜0.2重量％的Ni，1.0重量％以下的Ga的组成，余量 是Sn和不可避免的杂质。

公开(公告)号：US08147746B2

公开(公告)日：2012-04-03

申请号：US12518656

申请日：2006-12-14

申请人： Tetsuro Nishimura

发明人： Tetsuro Nishimura

IPC分类号： C22B15/14

CPC分类号： C22B25/08 ,  C22B9/10 ,  C22B15/006

摘要： An apparatus for depositing and separating excess copper dissolved in molten lead-free solder containing tin as the main element is provided. An apparatus 1 deposits excess copper in the molten lead-free solder as an intermetallic compound and separates it from the molten solder. The apparatus includes a deposition bath 2 for causing an intermetallic compound in the molten solder, a metal added from the outside and copper in the molten solder to be deposited, a granulation bath 4 including plates 31 32 and 33 for allowing the molten solder to pass through the plates to merge the intermetallic compounds into particles having a larger diameter, and a separation bath 5 for causing the enlarged intermetallic compounds to precipitate and separate in the molten solder.

摘要翻译： 提供一种用于沉积和分离溶解在含有锡的熔融无铅焊料中的多余铜作为主要元件的装置。 装置1将作为金属间化合物的熔融无铅焊料中的多余的铜沉积在熔融的无铅焊料中，并将其与熔融的焊料分离。 该装置包括用于使熔融焊料中的金属间化合物，从外部添加的金属和待沉积的熔融焊料中的铜的沉积槽2，包括用于允许熔融焊料通过的板31​​,32和33的造粒槽4 通过板将金属间化合物合并成具有较大直径的颗粒;以及分离槽5，用于使扩大的金属间化合物沉淀并在熔融焊料中分离。

公开(公告)号：US6044769A

公开(公告)日：2000-04-04

申请号：US937768

申请日：1997-09-25

申请人： Kiyoshi Oka ,  Eisuke Tada ,  Tadashi Ogawa ,  Kouichi Tuji ,  Yuuji Takiguchi ,  Seiichiro Kimura ,  Akiko Sakurai ,  Nami Sasaki ,  Yasunori Ozaki ,  Tetsuro Nishimura

发明人： Kiyoshi Oka ,  Eisuke Tada ,  Tadashi Ogawa ,  Kouichi Tuji ,  Yuuji Takiguchi ,  Seiichiro Kimura ,  Akiko Sakurai ,  Nami Sasaki ,  Yasunori Ozaki ,  Tetsuro Nishimura

IPC分类号： F16L55/179 ,  F16L55/34 ,  B61B13/00

CPC分类号： F16L55/179 ,  F16L55/34

摘要： An in-pipe work device comprising at least two movement mechanisms connected with each other in a longitudinal direction of a pipe by a flexible tube, and a control device for controlling the movement mechanisms, the movement mechanisms including a body connected to the flexible tube, a guide member installed on the body such that the guide member is slidable in an axial direction, a support leg drive mechanism provided on the guide member and having a support leg movable in a radial direction of the pipe, for pressing the support leg against an inner wall of the pipe, thereby to hold the guide member kept unmovable in an axis direction of the pipe, a slide mechanism for relatively sliding the guide member and the body, with the support leg pressed against the inner wall of the pipe, thereby to slide the body in the axis direction of the pipe, wherein the control device controls the in-pipe movement device so as to move in a pipe by itself, by sequentially operating the plurality of movement mechanism in a predetermined order.

摘要翻译： 一种管内作业装置，包括通过柔性管沿管子的纵向方向彼此连接的至少两个运动机构，以及用于控制运动机构的控制装置，所述运动机构包括连接到柔性管的主体， 引导构件，其安装在所述主体上，使得所述引导构件能够沿轴向滑动;支撑腿驱动机构，设置在所述引导构件上，并具有可在所述管的径向方向上移动的支撑腿，用于将所述支撑腿压靠在所述导向构件上 从而保持引导构件在管的轴线方向上保持不动的滑动机构，用于使引导构件和主体相对滑动的滑动机构，其中支撑腿压靠在管的内壁上，从而 在管道的轴线方向滑动主体，其中控制装置控制管内移动装置，以便通过依次操作多个mo 预定的顺序。

公开(公告)号：US5772101A

公开(公告)日：1998-06-30

申请号：US693916

申请日：1996-08-05

申请人： Tetsuro Nishimura ,  Yasuo Seo

发明人： Tetsuro Nishimura ,  Yasuo Seo

IPC分类号： B23K3/06 ,  H05K3/34

CPC分类号： B23K3/0653

摘要： A wave soldering machine welling up molten solder by means of a pump for soldering a printed circuit board. The wave soldering machine comprises a nozzle formed of an enclosure surrounded by a front upright, a rear upright and side plates, a rear baffle plate extended from the top edge of the rear upright in a manner that the height of the rear baffle plate is adjusted, and a generally L-shaped front baffle plate having a large radius of curvature pivotally attached to the top edge of the front upright, whereby a solder wave formed on the top end of the rear baffle plate by surface tension of molten solder flows along the top surface of the front baffle plate. The rear baffle plate is particularly shaped and a bypass is formed to present a stable solder wave.

摘要翻译： 波峰焊机通过用于焊接印刷电路板的泵来熔化熔融焊料。 波峰焊机包括由前立柱，后立柱和侧板围绕的外壳形成的喷嘴，后挡板从后立柱的顶边缘延伸，后挡板的高度被调节 ，以及大体呈L形的前挡板，其具有大的曲率半径，其可枢转地附接到前立柱的顶部边缘，由此通过熔融焊料的表面张力在后挡板的顶端形成的焊波沿着 前挡板的顶面。 后挡板特别成形，形成旁路以呈现稳定的焊波。

公开(公告)号：US08652269B2

公开(公告)日：2014-02-18

申请号：US13121734

申请日：2009-09-25

申请人： Tetsuro Nishimura ,  Mitsuhiro Kawahara ,  Masuml Asakawa ,  Toshimi Shimizu

发明人： Tetsuro Nishimura ,  Mitsuhiro Kawahara ,  Masuml Asakawa ,  Toshimi Shimizu

IPC分类号： B23K35/36 ,  B23K35/363

CPC分类号： C22C13/00 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3484 ,  H05K3/3489

摘要： Disclosed herein are a flux and a soldering paste based on the flux. The flux is free from a change in viscosity with age, “skinned surface,” and “rough and crumbling,” and is excellent in printability and solderability. The flux contains, as elements, a resin, a thixo agent, an activator, a solvent and glucopyranosylamine type nanotube. The soldering paste further contains a solder powder. Preferably, the solder powder is free from lead.

摘要翻译： 本文公开了基于助焊剂的焊剂和焊膏。 助焊剂随着年龄，“皮肤表面”和“粗糙和破碎”而没有粘度变化，并且具有优异的可印刷性和可焊性。 助熔剂含有树脂，触变剂，活化剂，溶剂和吡喃葡萄糖胺型纳米管。 焊膏还含有焊料粉末。 优选地，焊料粉末不含铅。