公开(公告)号：US20060131260A1

公开(公告)日：2006-06-22

申请号：US10542851

申请日：2004-01-21

申请人： Futoshi Okuyama ,  Yoichi Shinba ,  Tetsyuya Hayashi ,  Takayoshi Akamatsu

发明人： Futoshi Okuyama ,  Yoichi Shinba ,  Tetsyuya Hayashi ,  Takayoshi Akamatsu

IPC分类号： H01B13/00

CPC分类号： H05K3/007 ,  B65H2301/51122 ,  H05K1/0393 ,  H05K2203/016 ,  H05K2203/0264 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order; a method forms a circuit board by forming a circuit pattern on a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, and peeling the film from the plate at an angle ranging from more than 0° to 80°; and an apparatus for forming a circuit board has one of a separation means for separating the flexible film from the reinforcing plate while the film contacts a curved support body; a curved separation means for separating the reinforcing plate from a support body for the flexible film while the plate is curved; or a moving means for relatively moving holding means and peeling means having a wedge-shaped member for peeling the flexible film.

摘要翻译： 电路板使用构件具有加强板，可移除有机层，具有电路图案的柔性膜和依次层压的剥离辅助层。 一种方法通过在柔性膜上形成电路图形形成电路板，所述柔性膜粘附到具有可移除有机层的加强板之间，并且以大于0°至80°的角度从所述板剥离所述膜; 并且用于形成电路板的装置具有一个分离装置，用于在薄膜接触弯曲的支撑体时将柔性膜与加强板分离; 弯曲分离装置，用于在板弯曲时将加强板与用于柔性膜的支撑体分离; 或用于相对移动的保持装置的移动装置和具有用于剥离柔性膜的楔形构件的剥离装置。