公开(公告)号：US20060131260A1

公开(公告)日：2006-06-22

申请号：US10542851

申请日：2004-01-21

申请人： Futoshi Okuyama ,  Yoichi Shinba ,  Tetsyuya Hayashi ,  Takayoshi Akamatsu

发明人： Futoshi Okuyama ,  Yoichi Shinba ,  Tetsyuya Hayashi ,  Takayoshi Akamatsu

IPC分类号： H01B13/00

CPC分类号： H05K3/007 ,  B65H2301/51122 ,  H05K1/0393 ,  H05K2203/016 ,  H05K2203/0264 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order; a method forms a circuit board by forming a circuit pattern on a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, and peeling the film from the plate at an angle ranging from more than 0° to 80°; and an apparatus for forming a circuit board has one of a separation means for separating the flexible film from the reinforcing plate while the film contacts a curved support body; a curved separation means for separating the reinforcing plate from a support body for the flexible film while the plate is curved; or a moving means for relatively moving holding means and peeling means having a wedge-shaped member for peeling the flexible film.

摘要翻译： 电路板使用构件具有加强板，可移除有机层，具有电路图案的柔性膜和依次层压的剥离辅助层。 一种方法通过在柔性膜上形成电路图形形成电路板，所述柔性膜粘附到具有可移除有机层的加强板之间，并且以大于0°至80°的角度从所述板剥离所述膜; 并且用于形成电路板的装置具有一个分离装置，用于在薄膜接触弯曲的支撑体时将柔性膜与加强板分离; 弯曲分离装置，用于在板弯曲时将加强板与用于柔性膜的支撑体分离; 或用于相对移动的保持装置的移动装置和具有用于剥离柔性膜的楔形构件的剥离装置。

公开(公告)号：US07540079B2

公开(公告)日：2009-06-02

申请号：US10542851

申请日：2004-01-21

申请人： Futoshi Okuyama ,  Yoichi Shinba ,  Tetsuya Hayashi ,  Takayoshi Akamatsu

发明人： Futoshi Okuyama ,  Yoichi Shinba ,  Tetsuya Hayashi ,  Takayoshi Akamatsu

IPC分类号： H05K3/36

CPC分类号： H05K3/007 ,  B65H2301/51122 ,  H05K1/0393 ,  H05K2203/016 ,  H05K2203/0264 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order; a method forms a circuit board by forming a circuit pattern on a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, and peeling the film from the plate at an angle ranging from more than 0° to 80°; and an apparatus for forming a circuit board has one of a separation means for separating the flexible film from the reinforcing plate while the film contacts a curved support body; a curved separation means for separating the reinforcing plate from a support body for the flexible film while the plate is curved; or a moving means for relatively moving holding means and peeling means having a wedge-shaped member for peeling the flexible film.

摘要翻译： 电路板使用构件具有加强板，可移除有机层，具有电路图案的柔性膜和依次层压的剥离辅助层。 一种方法通过在柔性膜上形成电路图形形成电路板，所述柔性膜粘附到具有可移除有机层的加强板之间，并且以大于0°至80°的角度从所述板剥离所述膜; 并且用于形成电路板的装置具有一个分离装置，用于在薄膜接触弯曲的支撑体时将柔性膜与加强板分离; 弯曲分离装置，用于在板弯曲时将加强板与用于柔性膜的支撑体分离; 或用于相对移动的保持装置的移动装置和具有用于剥离柔性膜的楔形构件的剥离装置。

公开(公告)号：US20060237133A1

公开(公告)日：2006-10-26

申请号：US11474427

申请日：2006-06-26

申请人： Takayoshi Akamatsu ,  Futoshi Okuyama ,  Nobuyuki Kuroki ,  Hiroshi Enomoto ,  Tetsuya Hayashi ,  Yoshio Matsuda ,  Yoichi Shinba ,  Masahiro Oguni

发明人： Takayoshi Akamatsu ,  Futoshi Okuyama ,  Nobuyuki Kuroki ,  Hiroshi Enomoto ,  Tetsuya Hayashi ,  Yoshio Matsuda ,  Yoichi Shinba ,  Masahiro Oguni

IPC分类号： C09J7/00

CPC分类号： B32B38/18 ,  B32B37/025 ,  B32B2037/109 ,  B32B2038/1891 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/0393 ,  H05K3/007 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/016 ,  H05K2203/066 ,  H05K2203/068 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917

摘要： The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

公开(公告)号：US07534361B2

公开(公告)日：2009-05-19

申请号：US11474427

申请日：2006-06-26

申请人： Takayoshi Akamatsu ,  Futoshi Okuyama ,  Nobuyuki Kuroki ,  Hiroshi Enomoto ,  Tetsuya Hayashi ,  Yoshio Matsuda ,  Yoichi Shinba ,  Masahiro Oguni

发明人： Takayoshi Akamatsu ,  Futoshi Okuyama ,  Nobuyuki Kuroki ,  Hiroshi Enomoto ,  Tetsuya Hayashi ,  Yoshio Matsuda ,  Yoichi Shinba ,  Masahiro Oguni

IPC分类号： H01B13/00

CPC分类号： B32B38/18 ,  B32B37/025 ,  B32B2037/109 ,  B32B2038/1891 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/0393 ,  H05K3/007 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/016 ,  H05K2203/066 ,  H05K2203/068 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917

摘要： The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

摘要翻译： 电路基板技术领域本发明涉及具备极细电路图案的柔性膜，电路基板用层叠体以及生产率优异的电路板用叠层体的方法。 本发明的电路板包括柔性膜和由设置在柔性膜上的金属构成的电路图案，电路图案的尺寸变化率在±0.01％以内。 本发明的电路基板用层叠体的特征在于，具有加强板，自粘式，可移除有机层，柔性膜，以及由依次层压的金属构成的电路图案。

公开(公告)号：US07105221B2

公开(公告)日：2006-09-12

申请号：US10450415

申请日：2002-07-17

申请人： Takayoshi Akamatsu ,  Futoshi Okuyama ,  Nobuyuki Kuroki ,  Hiroshi Enomoto ,  Tetsuya Hayashi ,  Yoshio Matsuda ,  Yoichi Shinba ,  Masahiro Oguni

发明人： Takayoshi Akamatsu ,  Futoshi Okuyama ,  Nobuyuki Kuroki ,  Hiroshi Enomoto ,  Tetsuya Hayashi ,  Yoshio Matsuda ,  Yoichi Shinba ,  Masahiro Oguni

IPC分类号： B32B3/00 ,  H05K1/16

CPC分类号： B32B38/18 ,  B32B37/025 ,  B32B2037/109 ,  B32B2038/1891 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/0393 ,  H05K3/007 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/016 ,  H05K2203/066 ,  H05K2203/068 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917

摘要： The present invention relates to a circuit board including a flexible film provided with an extremely fine circuit pattern, a laminated member for a circuit board, and a method for making a laminated member for a circuit board with excellent productivity. A circuit board of the present invention includes a flexible film and a circuit pattern composed of a metal provided on the flexible film, and dimensional change rate of the circuit pattern is within ±0.01%. A laminated member for a circuit board of the present invention includes a reinforcing plate, a self-stick, removable organic layer, a flexible film, and a circuit pattern composed of a metal laminated in that order.

摘要翻译： 电路基板技术领域本发明涉及具备极细电路图案的柔性膜，电路基板用层叠体以及生产率优异的电路板用叠层体的方法。 本发明的电路板包括柔性膜和由设置在柔性膜上的金属构成的电路图案，电路图案的尺寸变化率在±0.01％以内。 本发明的电路基板用层叠体的特征在于，具有加强板，自粘型，可移除有机层，柔性膜，以及由依次层叠的金属构成的电路图案。

公开(公告)号：US20120183775A1

公开(公告)日：2012-07-19

申请号：US13498161

申请日：2010-10-08

申请人： Yoichi Shinba ,  Shoichi Niizeki ,  Toshihisa Nonaka

发明人： Yoichi Shinba ,  Shoichi Niizeki ,  Toshihisa Nonaka

IPC分类号： H05K3/22 ,  C09K5/00 ,  B32B15/02 ,  C23C22/06 ,  C23C22/07

CPC分类号： C09C3/10 ,  C01P2004/03 ,  C01P2004/62 ,  C01P2004/84 ,  C01P2006/40 ,  C09C1/62 ,  C09C1/64 ,  C09C1/644 ,  H05K3/28 ,  H05K2201/0224 ,  H05K2201/10977 ,  H05K2203/122 ,  Y10T428/2991

摘要： Disclosed is a process which comprises bringing an acidic organic substance or phosphoric acid into contact with a metal to form, on the surface of the metal, a layer that contains either an organic acid salt formed from both the acidic organic substance and the metal or a phosphoric acid salt formed from both the phosphoric acid and the metal. In the process, the layer can be selectively formed only on the surface of the metal. When the process is applied to the production of core-shell particles, neither agglomeration of the particles nor viscosity increase of the fluid occurs, while when the process is applied to the production of a covered metal-wiring circuit board, the layer can be selectively formed only in the metal area to be covered.

摘要翻译： 公开了一种方法，其包括使酸性有机物质或磷酸与金属接触以在金属表面上形成含有由酸性有机物质和金属形成的有机酸盐的层或 由磷酸和金属形成的磷酸盐。 在该过程中，该层可以仅选择性地形成在金属的表面上。 当将该方法应用于核 - 壳颗粒的生产时，不会发生颗粒的聚集或流体的粘度增加，而当该方法应用于覆盖金属布线电路板的生产时，该层可以是选择性的 仅在被覆盖的金属区域形成。

公开(公告)号：US07960462B2

公开(公告)日：2011-06-14

申请号：US12312436

申请日：2007-11-06

申请人： Yoichi Shinba ,  Hiroyuki Niwa ,  Yoshiko Tatsuta ,  Koichi Fujimaru ,  Toshihisa Nonaka

发明人： Yoichi Shinba ,  Hiroyuki Niwa ,  Yoshiko Tatsuta ,  Koichi Fujimaru ,  Toshihisa Nonaka

IPC分类号： C08K3/30

CPC分类号： G02B6/138 ,  C08F290/00 ,  C08F290/06 ,  C08F292/00 ,  C08K3/30

摘要： The present invention is an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

摘要翻译： 本发明是一种光波导形成膏组合物，其包含（A）平均粒径为1nm以上且50nm以下的硫酸钡粒子，（B）具有聚合性基团和羧基的化合物，或 具有聚合性基团的磷酸酯化合物，（C）有机溶剂。

公开(公告)号：US20090270541A1

公开(公告)日：2009-10-29

申请号：US12312436

申请日：2007-11-06

申请人： Yoichi Shinba ,  Hiroyuki Niwa ,  Yoshiko Tatsuta ,  Koichi Fujimaru ,  Toshihisa Nonaka

发明人： Yoichi Shinba ,  Hiroyuki Niwa ,  Yoshiko Tatsuta ,  Koichi Fujimaru ,  Toshihisa Nonaka

IPC分类号： C08K3/30

CPC分类号： G02B6/138 ,  C08F290/00 ,  C08F290/06 ,  C08F292/00 ,  C08K3/30

摘要： Problems: an object of the present invention is to provide an optical waveguide-forming paste composition that allows short-time curing and provides excellent developability.Means for Solving: The present invention is directed to an optical waveguide-forming paste composition including (A) barium sulfate particles with a mean particle diameter of 1 nm or more to 50 nm or less, (B) a compound having a polymerizable group and a carboxyl group, or a phosphoric ester compound having a polymerizable group, and (C) an organic solvent.

摘要翻译： 问题：本发明的目的是提供一种允许短时间固化并提供优异显影性的光波导形成膏组合物。 解决方法本发明涉及一种光波导形成用糊剂组合物，其包含（A）平均粒径为1nm以上且50nm以下的硫酸钡粒子，（B）具有聚合性基团的化合物和 羧基或具有聚合性基团的磷酸酯化合物，和（C）有机溶剂。

公开(公告)号：US20130245160A1

公开(公告)日：2013-09-19

申请号：US13990880

申请日：2011-11-28

申请人： Akira Shimada ,  Yoichi Shinba ,  Toshihisa Nonaka

发明人： Akira Shimada ,  Yoichi Shinba ,  Toshihisa Nonaka

IPC分类号： C09J163/00 ,  C09J179/08

CPC分类号： C09J163/00 ,  C08G77/14 ,  C08K3/28 ,  C08K2003/2227 ,  C08L63/00 ,  C08L101/10 ,  C09J7/20 ,  C09J9/02 ,  C09J179/08 ,  C09J183/10 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  C08L79/08 ,  H01L2924/00

摘要： The purpose of the present invention is to provide an adhesive composition, which has high thermal conductivity and excellent adhesion, and wherein dispersibility of a thermally conductive filler is controlled. The adhesive composition is configured to contain (A) a soluble polyimide, (B) an epoxy resin and (C) a thermally conductive filler. The adhesive composition is characterized in that the soluble polyimide (A) contains a structure represented by general formula (1) as a component derived from a diamine and the amount of the thermally conductive filler (C) contained in the adhesive composition is not less than 60% by volume. (In general formula (1), X represents an integer of 1-10 (inclusive) and n represents an integer of 1-20 (inclusive).)

摘要翻译： 本发明的目的是提供具有高导热性和优异粘合性的粘合剂组合物，并且其中控制导热填料的分散性。 粘合剂组合物构成为含有（A）可溶性聚酰亚胺，（B）环氧树脂和（C）导热性填料。 粘合剂组合物的特征在于，可溶性聚酰亚胺（A）含有作为源自二胺的成分的通式（1）表示的结构，粘合剂组合物中所含的导热性填料（C）的量不小于 60％（体积）。 （通式（1）中，X表示1〜10的整数，n表示1〜20的整数）。