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    Laminated member for circuit board, method and apparatus for manufacturing of circuit board
    1.
    发明授权
    Laminated member for circuit board, method and apparatus for manufacturing of circuit board 失效
    电路板层压构件，电路板制造方法和装置

    公开(公告)号：US07540079B2

    公开(公告)日：2009-06-02

    申请号：US10542851

    申请日：2004-01-21

    申请人： Futoshi Okuyama ,  Yoichi Shinba ,  Tetsuya Hayashi ,  Takayoshi Akamatsu

    发明人： Futoshi Okuyama ,  Yoichi Shinba ,  Tetsuya Hayashi ,  Takayoshi Akamatsu

    IPC分类号： H05K3/36

    CPC分类号： H05K3/007 ,  B65H2301/51122 ,  H05K1/0393 ,  H05K2203/016 ,  H05K2203/0264 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order; a method forms a circuit board by forming a circuit pattern on a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, and peeling the film from the plate at an angle ranging from more than 0° to 80°; and an apparatus for forming a circuit board has one of a separation means for separating the flexible film from the reinforcing plate while the film contacts a curved support body; a curved separation means for separating the reinforcing plate from a support body for the flexible film while the plate is curved; or a moving means for relatively moving holding means and peeling means having a wedge-shaped member for peeling the flexible film.

    摘要翻译： 电路板使用构件具有加强板，可移除有机层，具有电路图案的柔性膜和依次层压的剥离辅助层。 一种方法通过在柔性膜上形成电路图形形成电路板，所述柔性膜粘附到具有可移除有机层的加强板之间，并且以大于0°至80°的角度从所述板剥离所述膜; 并且用于形成电路板的装置具有一个分离装置，用于在薄膜接触弯曲的支撑体时将柔性膜与加强板分离; 弯曲分离装置，用于在板弯曲时将加强板与用于柔性膜的支撑体分离; 或用于相对移动的保持装置的移动装置和具有用于剥离柔性膜的楔形构件的剥离装置。

    Back-face protection sheet for solar cell module, and solar cell module using same
    2.
    发明授权
    Back-face protection sheet for solar cell module, and solar cell module using same 有权
    用于太阳能电池模块的背面保护片和使用其的太阳能电池模块

    公开(公告)号：US09064995B2

    公开(公告)日：2015-06-23

    申请号：US13819841

    申请日：2011-08-30

    申请人： Futoshi Okuyama ,  Kouhei Katou ,  Yuuka Ashida ,  Masahiro Mikawa ,  Masayoshi Teranishi

    发明人： Futoshi Okuyama ,  Kouhei Katou ,  Yuuka Ashida ,  Masahiro Mikawa ,  Masayoshi Teranishi

    IPC分类号： H01L31/049 ,  B32B27/36 ,  B32B27/40 ,  H01L31/048 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32

    CPC分类号： H01L31/049 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/36 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50

    摘要： A back-face protection sheet for a solar cell module exhibits excellent adhesion strength and tensile strength even under a high-temperature and high-humidity environment, by using a plastic film that has excellent characteristics such as electrical insulation characteristic, heat resistance, dimension stability, mechanical strength, weatherability, and water resistance, and using a two-part type lamination adhesive having excellent weatherability. The back-face protection sheet is made to have excellent adhesion strength and tensile strength for a long period of time, even under a high-temperature and high-humidity environment, by improving weatherability (hydrolysis resistance) as base material films, and giving weatherability (hydrolysis resistance) to the two-part type lamination adhesive to be used in pasting together the base material films.

    摘要翻译： 太阳能电池组件的背面保护片即使在高温高湿环境下也能表现出优异的附着强度和拉伸强度，通过使用电绝缘特性，耐热性，尺寸稳定性等优异的塑料膜 机械强度，耐候性和耐水性，并且使用具有优异耐候性的两部分型层压粘合剂。 通过提高作为基材膜的耐候性（耐水解性），即使在高温高湿环境下也能够长时间地具有优异的粘合强度和拉伸强度，并赋予耐候性 （耐水解性）到用于将基材薄膜粘贴在一起的两部分型层压粘合剂。

    BACK-FACE PROTECTION SHEET FOR SOLAR CELL MODULE, AND SOLAR CELL MODULE USING SAME
    4.
    发明申请
    BACK-FACE PROTECTION SHEET FOR SOLAR CELL MODULE, AND SOLAR CELL MODULE USING SAME 有权
    用于太阳能电池模块的背面保护片和使用其的太阳能电池模块

    公开(公告)号：US20140144488A1

    公开(公告)日：2014-05-29

    申请号：US13819841

    申请日：2011-08-30

    申请人： Futoshi Okuyama ,  Kouhei Katou ,  Yuuka Ashida ,  Masahiro Mikawa ,  Masayoshi Teranishi

    发明人： Futoshi Okuyama ,  Kouhei Katou ,  Yuuka Ashida ,  Masahiro Mikawa ,  Masayoshi Teranishi

    IPC分类号： H01L31/048

    CPC分类号： H01L31/049 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/36 ,  H01L31/048 ,  H01L31/0481 ,  Y02E10/50

    摘要： A back-face protection sheet for a solar cell module exhibits excellent adhesion strength and tensile strength even under a high-temperature and high-humidity environment, by using a plastic film that has excellent characteristics such as electrical insulation characteristic, heat resistance, dimension stability, mechanical strength, weatherability, and water resistance, and using a two-part type lamination adhesive having excellent weatherability. The back-face protection sheet is made to have excellent adhesion strength and tensile strength for a long period of time, even under a high-temperature and high-humidity environment, by improving weatherability (hydrolysis resistance) as base material films, and giving weatherability (hydrolysis resistance) to the two-part type lamination adhesive to be used in pasting together the base material films.

    摘要翻译： 太阳能电池组件的背面保护片即使在高温高湿环境下也能表现出优异的附着强度和拉伸强度，通过使用电绝缘特性，耐热性，尺寸稳定性等优异的塑料膜 机械强度，耐候性和耐水性，并且使用具有优异耐候性的两部分型层压粘合剂。 通过提高作为基材膜的耐候性（耐水解性），即使在高温高湿环境下也能够长时间地具有优异的粘合强度和拉伸强度，并赋予耐候性 （耐水解性）到用于将基材薄膜粘贴在一起的两部分型层压粘合剂。

    Member for circuit board, method and manufacturing circuit board, apparatus for manufacturing circuit board
    7.
    发明申请
    Member for circuit board, method and manufacturing circuit board, apparatus for manufacturing circuit board 失效
    电路板，方法和制造电路板的成员，电路板的制造设备

    公开(公告)号：US20060131260A1

    公开(公告)日：2006-06-22

    申请号：US10542851

    申请日：2004-01-21

    申请人： Futoshi Okuyama ,  Yoichi Shinba ,  Tetsyuya Hayashi ,  Takayoshi Akamatsu

    发明人： Futoshi Okuyama ,  Yoichi Shinba ,  Tetsyuya Hayashi ,  Takayoshi Akamatsu

    IPC分类号： H01B13/00

    CPC分类号： H05K3/007 ,  B65H2301/51122 ,  H05K1/0393 ,  H05K2203/016 ,  H05K2203/0264 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order; a method forms a circuit board by forming a circuit pattern on a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, and peeling the film from the plate at an angle ranging from more than 0° to 80°; and an apparatus for forming a circuit board has one of a separation means for separating the flexible film from the reinforcing plate while the film contacts a curved support body; a curved separation means for separating the reinforcing plate from a support body for the flexible film while the plate is curved; or a moving means for relatively moving holding means and peeling means having a wedge-shaped member for peeling the flexible film.

    摘要翻译： 电路板使用构件具有加强板，可移除有机层，具有电路图案的柔性膜和依次层压的剥离辅助层。 一种方法通过在柔性膜上形成电路图形形成电路板，所述柔性膜粘附到具有可移除有机层的加强板之间，并且以大于0°至80°的角度从所述板剥离所述膜; 并且用于形成电路板的装置具有一个分离装置，用于在薄膜接触弯曲的支撑体时将柔性膜与加强板分离; 弯曲分离装置，用于在板弯曲时将加强板与用于柔性膜的支撑体分离; 或用于相对移动的保持装置的移动装置和具有用于剥离柔性膜的楔形构件的剥离装置。