公开(公告)号：US20050224973A1

公开(公告)日：2005-10-13

申请号：US11148923

申请日：2005-06-08

申请人： William Bernier ,  Charles Carey ,  Eberhard Gramatzki ,  Thomas Homa ,  Eric Johnson ,  Pierre Langevin ,  Irving Memis ,  Son Tran ,  Robert White

发明人： William Bernier ,  Charles Carey ,  Eberhard Gramatzki ,  Thomas Homa ,  Eric Johnson ,  Pierre Langevin ,  Irving Memis ,  Son Tran ,  Robert White

IPC分类号： H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01L23/48 ,  H01L21/44

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/351 ,  H05K3/3436 ,  H01L2924/00

摘要： A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.

摘要翻译： 用于将半导体衬底（例如，半导体芯片）耦合到有机衬底（例如，芯片载体）的方法和结构。 耦合器将焊接部件（例如，焊球）与半导体衬底上的导电焊盘和有机衬底上的导电焊盘接合。 可以通过使半导体衬底上的焊盘的表面积超过有机衬底上焊盘的表面积来减少热循环期间焊料部件上的热应变。 在热循环期间焊料构件上的热应变也可以通过从焊料构件的中心线到半导体衬底的最近侧边缘的距离超过约0.25mm来减小。