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公开(公告)号：US20080283492A1
公开(公告)日：2008-11-20
申请号：US12121030
申请日：2008-05-15
IPC分类号： C25F5/00
CPC分类号： H01L33/60 , H01L24/48 , H01L24/85 , H01L33/486 , H01L2224/48091 , H01L2224/48235 , H01L2224/48464 , H01L2224/85 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15153 , Y10T29/49167 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method for manufacturing a light reflecting metal wall including a step (a) forming a cavity structure on a metal plate on which back surface a substrate is laminated, the cavity structure including on its side wall a light reflecting wall, the step (a) including the steps of (b) forming a first mask on a surface of the metal plate, the first mask having a mask opening portion corresponding to an opening portion of the cavity structure, and (c) forming the light reflecting wall on a side wall of the metal plate by carrying out wet etching with respect to the metal plate with the first mask, in the step (c), in the middle of the wet etching, the first mask being bent by press working along the light reflecting wall formed by the wet etching. As a result, the light reflecting metal wall is stably formed by securing both (i) an area of an LED chip mounting surface and (ii) a thickness of the light reflecting metal wall even if a packaged light-emitting element has a narrow lateral width of its short side.
摘要翻译： 一种制造光反射金属壁的方法，该方法包括：在层压背衬表面的金属板上形成空腔结构的步骤（a），其侧壁上包括光反射壁，所述工序（a） 包括以下步骤：（b）在金属板的表面上形成第一掩模，第一掩模具有对应于空腔结构的开口部分的掩模开口部分，以及（c）在侧壁上形成光反射壁 在步骤（c）中，在湿式蚀刻的中间，通过对具有第一掩模的金属板进行湿式蚀刻，第一掩模通过沿着由 湿蚀刻。 结果，即使封装的发光元件具有狭窄的侧面，也可以通过确保（i）LED芯片安装表面的面积和（ii）光反射金属壁的厚度来稳定地形成光反射金属壁 宽边的短边。
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公开(公告)号：US08052880B2
公开(公告)日：2011-11-08
申请号：US12121030
申请日：2008-05-15
IPC分类号： C25F5/00
CPC分类号： H01L33/60 , H01L24/48 , H01L24/85 , H01L33/486 , H01L2224/48091 , H01L2224/48235 , H01L2224/48464 , H01L2224/85 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15153 , Y10T29/49167 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method for manufacturing a light reflecting metal wall including a step (a) forming a cavity structure on a metal plate on which back surface a substrate is laminated, the cavity structure including on its side wall a light reflecting wall, the step (a) including the steps of (b) forming a first mask on a surface of the metal plate, the first mask having a mask opening portion corresponding to an opening portion of the cavity structure, and (c) forming the light reflecting wall on a side wall of the metal plate by carrying out wet etching with respect to the metal plate with the first mask, in the step (c), in the middle of the wet etching, the first mask being bent by press working along the light reflecting wall formed by the wet etching. As a result, the light reflecting metal wall is stably formed by securing both (i) an area of an LED chip mounting surface and (ii) a thickness of the light reflecting metal wall even if a packaged light-emitting element has a narrow lateral width of its short side.
摘要翻译： 一种制造光反射金属壁的方法，该方法包括：在层压背衬表面的金属板上形成空腔结构的步骤（a），其侧壁上包括光反射壁，所述工序（a） 包括以下步骤：（b）在金属板的表面上形成第一掩模，第一掩模具有对应于空腔结构的开口部分的掩模开口部分，以及（c）在侧壁上形成光反射壁 在步骤（c）中，在湿式蚀刻的中间，通过对具有第一掩模的金属板进行湿式蚀刻，第一掩模通过沿着由 湿蚀刻。 结果，即使封装的发光元件具有狭窄的侧面，也可以通过确保（i）LED芯片安装表面的面积和（ii）光反射金属壁的厚度来稳定地形成光反射金属壁 宽边的短边。
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