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10 条记录 (耗时 0.018 秒)

    IC package transfer and relocation mechanism
    7.
    发明授权
    IC package transfer and relocation mechanism 失效
    IC封装转移和搬迁机制

    公开(公告)号：US5950802A

    公开(公告)日：1999-09-14

    申请号：US699343

    申请日：1996-08-19

    申请人： Toshihiro Kubota

    发明人： Toshihiro Kubota

    IPC分类号： B23P19/00 ,  H05K13/02 ,  B65G25/00

    CPC分类号： H05K13/021

    摘要： A transfer mechanism for transferring molded IC device packages or the like between different types of trays which have IC package holder nests in differently spaced arrays. The transfer mechanism includes a suction gripper assembly supported on a horizontally and vertically movable robot arm, and having four suction heads mounted separately on four support blocks on a mounting plate. The four support blocks consist of a first support block fixed in a predetermined reference position on the mounting plate, second and third support blocks movably supported on the mounting plate for movements toward and away from the first support block in perpendicularly intersecting directions, and a fourth support block movably supported on the mounting plate for movements toward and away from the first support block in a diagonal direction following movement of at least one of the second and third support blocks.

    摘要翻译： 在具有IC封装保持器的不同类型的托盘之间传送模制的IC器件封装等的转移机构以不同间隔的阵列嵌套。 传送机构包括支撑在水平和垂直移动的机器人臂上的吸力夹持器组件，并且具有分别安装在安装板上的四个支撑块上的四个吸头。 四个支撑块包括固定在安装板上的预定基准位置的第一支撑块，可移动地支撑在安装板上用于在垂直相交方向上朝向和远离第一支撑块移动的第二和第三支撑块，以及第四支撑块 支撑块可动地支撑在安装板上，用于在第二和第三支撑块中的至少一个的运动之后朝向和远离第一支撑块移动。

    Holographic multiplexer/demultiplexer and its manufacturing method
    8.
    发明授权
    Holographic multiplexer/demultiplexer and its manufacturing method 失效
    全息多路复用器/解复用器及其制造方法

    公开(公告)号：US4824193A

    公开(公告)日：1989-04-25

    申请号：US889890

    申请日：1986-07-25

    申请人： Teizou Maeda ,  Toshihiro Kubota ,  Hiroyuki Ishii

    发明人： Teizou Maeda ,  Toshihiro Kubota ,  Hiroyuki Ishii

    IPC分类号： G02B5/32 ,  G02B6/34

    CPC分类号： G02B6/2931 ,  G02B5/32 ,  G02B6/29311

    摘要： A holographic multiplexer and holographic demultiplexer, which has a diffraction grating formed of a hologram with an interference pattern produced by interference of two wave fronts, of which at least one wave front is of an aspherical wave and the other is of, for example, a spherical wave, and its manufacturing method are disclosed. The aspherical wave is used for correction of aberration and provided by obtaining the phase function .phi..sub.G of the aspherical wave using a computer generated hologram and through an optical method or an electron-beam direct drawing method. The hologram serving as the diffraction grating for the holographic multiplexer/demultiplexer is produced by a two-beam interference method of an electron-beam direct drawing method. As the result, a holographic multiplexer/demultiplexer having a high degree of multiplexing, which is compact in size, and exhibiting low loss of light can be provided.

    摘要翻译： 一种全息多路复用器和全息解复用器，其具有由具有由两个波前的干涉产生的干涉图案的全息图形成的衍射光栅，其中至少一个波前是非球面波，另一个波长例如为 球面波及其制造方法。 非球面波用于校正像差，并且通过使用计算机产生的全息图和通过光学方法或电子束直接绘制方法获得非球面波的相位函数phi G来提供。 用作全息复用器/解复用器的衍射光栅的全息图是通过电子束直接绘制法的双光束干涉法产生的。 结果，可以提供具有高度复用度的全息多路复用器/解复用器，其尺寸紧凑并且表现出低的光损失。

    Gravitational IC package transfer mechanism
    10.
    发明授权
    Gravitational IC package transfer mechanism 失效
    重力IC封装传输机制

    公开(公告)号：US5702224A

    公开(公告)日：1997-12-30

    申请号：US699341

    申请日：1996-08-19

    申请人： Toshihiro Kubota

    发明人： Toshihiro Kubota

    IPC分类号： H05K13/02 ,  B65B69/00

    CPC分类号： H05K13/021 ,  Y10T29/53478

    摘要： An IC package transfer mechanism for transferring molded IC packages to and from a flat tray with a large number of IC holder nests in an array and an IC magazine adapted to accommodate a large number of IC packages in a row within a tubular housing to be turned into a tilted position in loading and unloading operations to let IC packages slide into or out of the cylindrical housing automatically by gravity. The IC package transfer mechanism comprises: an IC transfer block movably supported for displacement between a horizontal position and a tilted position, and internally provided with a slide channel with stopper devices for holding a plural number of IC packages in predetermined IC stop positions, the slide channel having an open entrance at an end to be turned into the tilted position and connected to an outlet end of a tubular IC magazine set in a similarly tilted position for transferring IC packages to the slide channel automatically by gravitational sliding movements of individual IC packages, along with top openings bored over in a top wall over the IC stop positions to permit access to IC packages in the slide channel by a handling device.

    摘要翻译： 一种IC封装传送机构，用于将模制的IC封装传送到具有大量集成电路保持器的平板托盘和阵列中的IC封装，以及IC盒，其适于在管状壳体内容纳多个串联的IC封装以转动 在装载和卸载操作中处于倾斜位置，以使IC封装通过重力自动地滑入或流出圆柱形壳体。 IC封装传送机构包括：可移动地支撑在水平位置和倾斜位置之间的位移的IC传送块，并且内部设置有具有用于将多个IC封装保持在预定的IC停止位置的止动装置的滑动通道， 通道在一端具有开放入口以转动到倾斜位置，并连接到设置在类似倾斜位置的管状IC盒的出口端，用于通过各IC封装的重力滑动自动地将IC封装传送到滑动通道， 以及在IC停止位置上的顶壁中钻出的顶部开口，以允许通过处理装置访问滑动通道中的IC封装。