公开(公告)号：US5434219A

公开(公告)日：1995-07-18

申请号：US194123

申请日：1994-02-09

申请人： Katsuro Oomura ,  Tateki Furuyama ,  Kazuhiko Yamamoto ,  Toshihiro Shimamura ,  Yoshinobu Suzuki

发明人： Katsuro Oomura ,  Tateki Furuyama ,  Kazuhiko Yamamoto ,  Toshihiro Shimamura ,  Yoshinobu Suzuki

IPC分类号： C08F279/02 ,  C08F287/00 ,  C08L23/02 ,  C08L51/04 ,  C08L75/04 ,  C08L77/00

CPC分类号： C08L23/02 ,  C08F279/02 ,  C08F287/00 ,  C08L51/04 ,  C08L75/04 ,  C08L77/00

摘要： A thermoplastic resin composition comprising: (I) a rubber-modified thermoplastic resin, and (II) a transparent thermoplastic resin, a thermoplastic elastomer or combination thereof, provided that said resin (I) is excluded from component (II), wherein the rubber-modified thermoplastic resin (I) is a resin prepared by polymerizing (B) 30-100% by weight of at least one member selected from the group consisting of an aromatic alkenyl compound monomer and an alkyl (meth)acrylate monomer and (C) 70-0% by weight of at least one other monomeric compound copolymerizable therewith, in the presence of 5-45% by weight of (A) a hydrogenated diene copolymer of component (I) obtained by hydrogenating a diene copolymer comprising a random copolymer of 50% by weight or more of at least one conjugated diene and 50% by weight or less of an alkenyl aromatic compound until at least 70% by weight of the olefinic unsaturation of the diene copolymer is hydrogenated.

摘要翻译： 一种热塑性树脂组合物，其包含：（I）橡胶改性的热塑性树脂，和（II）透明热塑性树脂，热塑性弹性体或其组合，条件是所述树脂（I）不在组分（II）中，其中橡胶 改性热塑性树脂（I）是通过聚合（B）30-100重量％的至少一种选自芳族烯基化合物单体和（甲基）丙烯酸烷基酯单体的组分和（C） 70重量％的至少一种可与其共聚的其它单体化合物，在5-45重量％的（A）组分（I）的氢化二烯共聚物存在下，通过氢化包含无规共聚物 50重量％以上的至少一种共轭二烯和50重量％以下的链烯基芳香族化合物，直到二烯共聚物的烯属不饱和键的至少70重量％被氢化为止。

公开(公告)号：US5306778A

公开(公告)日：1994-04-26

申请号：US16182

申请日：1993-02-11

申请人： Atushi Ishida ,  Katsuro Oomura ,  Yuji Yamamoto ,  Yuji Nakagawa ,  Tateki Furuyama ,  Hisao Nagai ,  Toshio Teramoto ,  Yasuo Takahashi ,  Hideki Ueda ,  Kazuhiko Yamamoto ,  Toshihiro Shimamura ,  Yoshinobu Suzuki

发明人： Atushi Ishida ,  Katsuro Oomura ,  Yuji Yamamoto ,  Yuji Nakagawa ,  Tateki Furuyama ,  Hisao Nagai ,  Toshio Teramoto ,  Yasuo Takahashi ,  Hideki Ueda ,  Kazuhiko Yamamoto ,  Toshihiro Shimamura ,  Yoshinobu Suzuki

IPC分类号： C08F279/02 ,  C08F287/00 ,  C08L23/02 ,  C08L51/04 ,  C08L75/04 ,  C08L77/00 ,  C08F379/02 ,  C08F387/00

CPC分类号： C08L23/02 ,  C08F279/02 ,  C08F287/00 ,  C08L51/04 ,  C08L75/04 ,  C08L77/00

摘要： A process for producing a rubber-modified thermoplastic resin, which comprises polymerizing (B) 30-100% by weight of an aromatic alkenyl compound monomer and/or an alkyl (meth)acrylate monomer and (C) 70-0% by weight of at least one other monomer compound copolymerizable therewith, in the presence of (A) a hydrogenated diene copolymer obtained by hydrogenating a diene copolymer comprising a rndom copolymer of 50% by weight or more of at least one conjugated diene and 50% by weight or less of an alkenyl aromatic compound until at least 70% by weight of the olefinic unsaturation of the diene copolymer is hydrogenated. The hydrogenated diene copolymer (A) may be a hydrogenated copolymer consisting of an A-B block copolymer or an A-B-C block copolymer (A is an alkenyl aromatic compound polymer block, B is an alkenyl aromatic compound-conjugated diene random copolymer block, and C is a polymer block composed mainly of an alkenyl aromatic compound), wherein(i) the weight ratio of the alkenyl aromatic compound/the conjugated diene is 5-50/95-50,(ii) the total amount of the alkenyl aromatic compounds of the block A and the block C in the copolymer is 3-40% by weight, and(iii) the vinyl configuration content in the conjugated diene portion of the block B is 10-90%, and wherein at least 90% of the double bonds of the conjugated diene is saturated.

摘要翻译： 一种制备橡胶改性热塑性树脂的方法，其包括将（B）30-100重量％的芳族烯基化合物单体和/或（甲基）丙烯酸烷基酯单体和（C）70重量％ 在（A）通过氢化包含50重量％以上的至少一种共轭二烯和50重量％以下的共聚物的二烯共聚物而获得的氢化二烯共聚物的存在下，可以与其共聚的至少一种其它单体化合物 的链烯基芳族化合物直到二烯共聚物的烯属不饱和键的至少70重量％被氢化。 氢化二烯共聚物（A）可以是由AB嵌段共聚物或ABC嵌段共聚物（A是烯基芳香族化合物聚合物嵌段，B是烯基芳香族化合物 - 共轭二烯无规共聚物嵌段）构成的氢化共聚物，C是 主要由链烯基芳族化合物组成的聚合物嵌段），其中（i）链烯基芳族化合物/共轭二烯的重量比为5-50 / 95-50，（ii）嵌段的烯基芳族化合物的总量 A和共聚物中的嵌段C为3-40重量％，和（iii）嵌段B的共轭二烯部分中的乙烯基构型含量为10-90％，并且其中至少90％ 共轭二烯是饱和的。