公开(公告)号：US11117108B2

公开(公告)日：2021-09-14

申请号：US16570029

申请日：2019-09-13

申请人： Rian Reyneke ,  Jose Manuel Urquiaga ,  Truc Vu ,  Jeffrey Donald Caton

发明人： Rian Reyneke ,  Jose Manuel Urquiaga ,  Truc Vu ,  Jeffrey Donald Caton

IPC分类号： B01J8/00 ,  B01J8/02 ,  B01J8/18 ,  B01J39/12 ,  C07C5/333 ,  B01J38/12

摘要： A process where external fuel oil is used to wash entrained catalyst from a fluidized-bed propane dehydrogenation reactor effluent, where the fuel oil and catalyst mixture is returned to the reactor to provide the net fuel required for catalyst regeneration. Optionally the fluidized-bed propane dehydrogenation reactor effluent and the fuel oil are contacted in a direct contact inline device before entering a flash zone in the reactor vessel.

公开(公告)号：US20070105265A1

公开(公告)日：2007-05-10

申请号：US11414128

申请日：2006-04-28

申请人： Jay Lai ,  Truc Vu ,  Gary Warren

发明人： Jay Lai ,  Truc Vu ,  Gary Warren

IPC分类号： H01L21/00

CPC分类号： H01L31/105 ,  H01L27/1446 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2924/12032 ,  H01L2924/30107 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： This invention relates to a novel optoelectronic chip with one or more optoelectronic devices, such as photodiodes, fabricated on a front side of a semiconductor wafer and contacts on a backside of the semiconductor wafer. The backside contacts can be contact bumps, which allow the optoelectronic chip to achieve the benefits of flip chip packaging without flipping the optoelectronic chip upside down with respect to a chip carrier. In an optical communication system, a photodiode chip can be backside bumped to a chip carrier or an electronic chip, allowing front side illumination of the photodiode chip. Front side illumination offers many benefits, including improved fiber alignment, reduced manufacturing time, and overall cost reduction.

摘要翻译： 本发明涉及一种具有一个或多个光电子器件（例如光电二极管）的新型光电子芯片，其制造在半导体晶片的正面并接触半导体晶片的背面。 背面触点可以是接触凸块，其允许光电芯片实现倒装芯片封装的优点，而不会相对于芯片载体颠倒光电芯片。 在光通信系统中，光电二极管芯片可以背面凸起到芯片载体或电子芯片，从而允许光电二极管芯片的正面照明。 前侧照明提供许多优点，包括改进光纤对准，缩短制造时间和降低总体成本。

公开(公告)号：US20060255419A1

公开(公告)日：2006-11-16

申请号：US11413634

申请日：2006-04-28

申请人： Jay Lai ,  Truc Vu ,  Gary Warren

发明人： Jay Lai ,  Truc Vu ,  Gary Warren

IPC分类号： H01L31/0203

CPC分类号： H01L31/105 ,  H01L27/1446 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2924/12032 ,  H01L2924/30107 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： This invention relates to a novel optoelectronic chip with one or more optoelectronic devices, such as photodiodes, fabricated on a front side of a semiconductor wafer and contacts on a backside of the semiconductor wafer. The backside contacts can be contact bumps, which allow the optoelectronic chip to achieve the benefits of flip chip packaging without flipping the optoelectronic chip upside down with respect to a chip carrier. In an optical communication system, a photodiode chip can be backside bumped to a chip carrier or an electronic chip, allowing front side illumination of the photodiode chip. Front side illumination offers many benefits, including improved fiber alignment, reduced manufacturing time, and overall cost reduction.

公开(公告)号：US20050090539A1

公开(公告)日：2005-04-28

申请号：US10716012

申请日：2003-11-18

申请人： Truc Vu ,  David Brzozowski ,  Rita Fox ,  Jollie Godfrey ,  Ronald Hanson ,  Sergei Kolotuchin ,  John Mazzullo ,  Ramesh Patel ,  Jianji Wang ,  Kwok Wong ,  Jurong Yu ,  Jason Zhu ,  David Magnin ,  David Augeri ,  Lawrence Hamann

发明人： Truc Vu ,  David Brzozowski ,  Rita Fox ,  Jollie Godfrey ,  Ronald Hanson ,  Sergei Kolotuchin ,  John Mazzullo ,  Ramesh Patel ,  Jianji Wang ,  Kwok Wong ,  Jurong Yu ,  Jason Zhu ,  David Magnin ,  David Augeri ,  Lawrence Hamann

IPC分类号： A61K31/403 ,  A61K31/435 ,  C07C62/06 ,  C07C69/00 ,  C07C69/716 ,  C07C229/28 ,  C07C271/22 ,  C07D20060101 ,  C07D201/00 ,  C07D207/22 ,  C07D207/277 ,  C07D209/02 ,  C07D209/52 ,  C07D221/02

CPC分类号： C07C69/757 ,  C07C62/06 ,  C07C69/635 ,  C07C69/675 ,  C07C229/28 ,  C07C271/22 ,  C07C2603/74 ,  C07D207/22 ,  C07D209/52

摘要： Methods and compounds for production of cyclopropyl-fused pyrrolidine-based inhibitors of dipeptidyl peptidase IV are provided.

摘要翻译： 提供了用于制备二肽基肽酶IV的环丙基稠合吡咯烷基抑制剂的方法和化合物。

公开(公告)号：US20210077967A1

公开(公告)日：2021-03-18

申请号：US16570029

申请日：2019-09-13

申请人： Rian Reyneke ,  Jose Manuel Urquiaga ,  Truc Vu ,  Jeffrey Donald Caton

发明人： Rian Reyneke ,  Jose Manuel Urquiaga ,  Truc Vu ,  Jeffrey Donald Caton

IPC分类号： B01J8/00 ,  B01J8/18 ,  B01J8/02 ,  B01J38/12 ,  C07C5/333

摘要： A process where external fuel oil is used to wash entrained catalyst from a fluidized-bed propane dehydrogenation reactor effluent, where the fuel oil and catalyst mixture is returned to the reactor to provide the net fuel required for catalyst regeneration. Optionally the fluidized-bed propane dehydrogenation reactor effluent and the fuel oil are contacted in a direct contact inline device before entering a flash zone in the reactor vessel.