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公开(公告)号：US20190059177A1
公开(公告)日：2019-02-21
申请号：US15894886
申请日：2018-02-12
Applicant: Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh
Inventor： Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh
Abstract: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion and an extending portion, wherein the extending portion has a slot, and a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is detachably assembled to the extending portion to be adjacent to the heat dissipation portion, wherein the heat dissipation fan covers the slot, the slot is connected to the heat dissipation flow channel, the heat dissipation fan is adapted to provide a heat dissipation air flow, and a part of the heat dissipation air flow passes through the slot and the heat dissipation flow channel in sequence.
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公开(公告)号：US20140076529A1
公开(公告)日：2014-03-20
申请号：US14016212
申请日：2013-09-02
Applicant: Jia-Yu Hung , Chang-Yuan Wu , Ching-Ya Tu , Tse-An Chu
Inventor： Jia-Yu Hung , Chang-Yuan Wu , Ching-Ya Tu , Tse-An Chu
IPC: F28F3/00
CPC classification number: H05K1/0203 , F28F3/00 , G06F1/203 , H01L23/367 , H01L23/3675 , H01L23/3733 , H01L23/433 , H01L2924/0002 , H01L2924/00
Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.
Abstract translation: 散热结构包括第一导热片，第二导热片和网状导热层。 网状导热层粘接在第一导热片和第二导热片之间。 网状导热层包括多个第一导热介质和多个第二导热介质，第一导热介质和第二导热介质交替布置，并且每个的导热性 第一导热介质小于第二导热介质的热导率。
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Patent Agency Ranking
公开(公告)号：US10936028B2
公开(公告)日：2021-03-02
申请号：US15854828
申请日：2017-12-27
Applicant: Chih-Chin Chien , I-Feng Hsu , Ching-Chung Chen , Tse-Yang Lin , Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh , Chin-Hsien Chang , Chin-Yuan Chuang , Chia-Hung Lin
Inventor： Chih-Chin Chien , I-Feng Hsu , Ching-Chung Chen , Tse-Yang Lin , Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh , Chin-Hsien Chang , Chin-Yuan Chuang , Chia-Hung Lin
Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.
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公开(公告)号：US20110043998A1
公开(公告)日：2011-02-24
申请号：US12861805
申请日：2010-08-23
Applicant: Tse-An Chu , Chang-Yuan Wu
Inventor： Tse-An Chu , Chang-Yuan Wu
IPC: H05K7/20
CPC classification number: H01L23/467 , H01L2924/0002 , H01L2924/00
Abstract: A heat-dissipating module is disclosed, which is suitable for an electronic apparatus with a case and a heat source. The heat-dissipating module includes a set of dissipation fins and a fan. The set of dissipation fins is suitable to connect a heat source and there is a flow channel between the set of dissipation fins and the case. The fan is for producing an airflow flowing towards the set of dissipation fins, while the partial airflow flows through the flow channel.
Abstract translation: 公开了一种散热模块，其适用于具有外壳和热源的电子设备。 散热模块包括一组散热片和风扇。 该组散热鳍片适合于连接热源，并且在该散热片与壳体之间存在流路。 该风扇用于产生流向该组散热片的气流，而部分气流流过流动通道。
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公开(公告)号：US20180228050A1
公开(公告)日：2018-08-09
申请号：US15854828
申请日：2017-12-27
Applicant: Chih-Chin Chien , I-Feng Hsu , Ching-Chung Chen , Tse-Yang Lin , Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh , Chin-Hsien Chang , Chin-Yuan Chuang , Chia-Hung Lin
Inventor： Chih-Chin Chien , I-Feng Hsu , Ching-Chung Chen , Tse-Yang Lin , Tse-An Chu , Ching-Ya Tu , Chang-Yuan Wu , Hao-Wu Yang , Huan-Yang Yeh , Chin-Hsien Chang , Chin-Yuan Chuang , Chia-Hung Lin
Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.
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公开(公告)号：US20170034901A1
公开(公告)日：2017-02-02
申请号：US15293303
申请日：2016-10-14
Applicant: Jia-Yu Hung , Chang-Yuan Wu , Ching-Ya Tu , Tse-An Chu
Inventor： Jia-Yu Hung , Chang-Yuan Wu , Ching-Ya Tu , Tse-An Chu
IPC: H05K1/02 , H01L23/367 , H01L23/373 , G06F1/20
CPC classification number: H05K1/0203 , F28F3/00 , G06F1/203 , H01L23/367 , H01L23/3675 , H01L23/3733 , H01L23/433 , H01L2924/0002 , H01L2924/00
Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.
Abstract translation: 散热结构包括第一导热片，第二导热片和网状导热层。 网状导热层粘接在第一导热片和第二导热片之间。 网状导热层包括多个第一导热介质和多个第二导热介质，第一导热介质和第二导热介质交替布置，并且每个的导热性 第一导热介质小于第二导热介质的热导率。
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公开(公告)号：US08305758B2
公开(公告)日：2012-11-06
申请号：US12861805
申请日：2010-08-23
Applicant: Tse-An Chu , Chang-Yuan Wu
Inventor： Tse-An Chu , Chang-Yuan Wu
IPC: H05K7/20
CPC classification number: H01L23/467 , H01L2924/0002 , H01L2924/00
Abstract: A heat-dissipating module is disclosed, which is suitable for an electronic apparatus with a case and a heat source. The heat-dissipating module includes a set of dissipation fins and a fan. The set of dissipation fins is suitable to connect a heat source and there is a flow channel between the set of dissipation fins and the case. The fan is for producing an airflow flowing towards the set of dissipation fins, while the partial airflow flows through the flow channel.
Abstract translation: 公开了一种散热模块，其适用于具有外壳和热源的电子设备。 散热模块包括一组散热片和风扇。 该组散热鳍片适合于连接热源，并且在该散热片与壳体之间存在流路。 该风扇用于产生流向该组散热片的气流，而部分气流流过流动通道。
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