HEAT DISSIPATION STRUCTURE
    3.
    发明申请
    HEAT DISSIPATION STRUCTURE 审中-公开
    散热结构

    公开(公告)号:US20170034901A1

    公开(公告)日:2017-02-02

    申请号:US15293303

    申请日:2016-10-14

    摘要: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.

    摘要翻译: 散热结构包括第一导热片,第二导热片和网状导热层。 网状导热层粘接在第一导热片和第二导热片之间。 网状导热层包括多个第一导热介质和多个第二导热介质,第一导热介质和第二导热介质交替布置,并且每个的导热性 第一导热介质小于第二导热介质的热导率。

    DOCKING STATION
    4.
    发明申请
    DOCKING STATION 有权
    锁定站

    公开(公告)号:US20130148298A1

    公开(公告)日:2013-06-13

    申请号:US13710475

    申请日:2012-12-11

    IPC分类号: H05K7/20

    摘要: A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.

    摘要翻译: 适用于便携式电子设备的坞站包括底座,支撑部件和第一风扇。 基座包括气流引导斜面。 支撑部件设置在基座上并具有气流引导结构,其中便携式电子设备被配置为支撑在支撑部件上。 第一风扇设置在基座中并且提供冷却气流,其中气流引导斜面和气流引导结构引导冷却气流流入便携式电子设备。

    HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE

    公开(公告)号:US20190059177A1

    公开(公告)日:2019-02-21

    申请号:US15894886

    申请日:2018-02-12

    摘要: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion and an extending portion, wherein the extending portion has a slot, and a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is detachably assembled to the extending portion to be adjacent to the heat dissipation portion, wherein the heat dissipation fan covers the slot, the slot is connected to the heat dissipation flow channel, the heat dissipation fan is adapted to provide a heat dissipation air flow, and a part of the heat dissipation air flow passes through the slot and the heat dissipation flow channel in sequence.

    HEAT DISSIPATION STRUCTURE
    6.
    发明申请
    HEAT DISSIPATION STRUCTURE 审中-公开
    散热结构

    公开(公告)号:US20140076529A1

    公开(公告)日:2014-03-20

    申请号:US14016212

    申请日:2013-09-02

    IPC分类号: F28F3/00

    摘要: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.

    摘要翻译: 散热结构包括第一导热片,第二导热片和网状导热层。 网状导热层粘接在第一导热片和第二导热片之间。 网状导热层包括多个第一导热介质和多个第二导热介质,第一导热介质和第二导热介质交替布置,并且每个的导热性 第一导热介质小于第二导热介质的热导率。

    ELECTRONIC APPARATUS
    7.
    发明申请
    ELECTRONIC APPARATUS 审中-公开
    电子设备

    公开(公告)号:US20120169639A1

    公开(公告)日:2012-07-05

    申请号:US13342978

    申请日:2012-01-04

    IPC分类号: G06F3/041

    摘要: A touch panel device includes a display module with a touch function and an anti-solar radiation film. The anti-solar radiation film is disposed on a side of the display module and in the touch panel device, so as to prevent solar radiation that passes through the display module to increase an inside temperature of a housing of the touch panel device.

    摘要翻译: 触摸面板装置包括具有触摸功能的显示模块和防太阳辐射膜。 防太阳辐射膜设置在显示模块的一侧和触摸面板装置中,以防止通过显示模块的太阳辐射增加触摸面板装置的壳体的内部温度。

    Thermal conducting medium protector
    8.
    发明授权
    Thermal conducting medium protector 失效
    导热介质保护器

    公开(公告)号:US07623350B2

    公开(公告)日:2009-11-24

    申请号:US11692926

    申请日:2007-03-29

    IPC分类号: H05K7/20 H01L23/34 F28F7/00

    摘要: A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.

    摘要翻译: 热传导介质保护器适用于组装到载体上,以保护设置在载体上的导热介质。 导热介质保护器包括外壳和盖板。 壳体在壳体的一侧具有第一弯曲部分和开口。 当载体放置在壳体的侧表面上时,导热介质位于开口中。 盖板具有第二弯曲部分,第一侧面,第二弯曲部分位于该第一弯曲部分上,第二侧面与第一侧相对并且枢转到壳体。 当盖板沿着第二侧旋转,然后穿过设置在壳体的侧表面上的载体时,该弯曲部分彼此弯曲以将托架保持在壳体和盖板之间。

    Docking station
    10.
    发明授权
    Docking station 有权
    对接站

    公开(公告)号:US09226427B2

    公开(公告)日:2015-12-29

    申请号:US13710475

    申请日:2012-12-11

    摘要: A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.

    摘要翻译: 适用于便携式电子设备的坞站包括基座,支撑部件和第一风扇。 基座包括气流引导斜面。 支撑部件设置在基座上并具有气流引导结构,其中便携式电子设备被配置为支撑在支撑部件上。 第一风扇设置在基座中并且提供冷却气流,其中气流引导斜面和气流引导结构引导冷却气流流入便携式电子设备。