Method for manufacturing a hard, water-resistant anti-fog coating
    1.
    发明授权
    Method for manufacturing a hard, water-resistant anti-fog coating 有权
    硬质,防水防雾涂料的制造方法

    公开(公告)号:US09103977B2

    公开(公告)日:2015-08-11

    申请号:US13325318

    申请日:2011-12-14

    CPC classification number: G02B1/14 C08J7/045 G02B1/105 G02B1/18 G02B27/0006

    Abstract: The present invention relates to a method for manufacturing a hard, water-resistant anti-fog coating, and particularly relates to a method for manufacturing a hard, water-resistant anti-fog coating on plastic material. In this method, an organic-inorganic hard adhesion layer and a hydrophilic anti-fog coating film are prepared for manufacturing a hard, water-resistant anti-fog coating. Both of the organic-inorganic hard adhesion layer and the hydrophilic anti-fog coating have C═C double bonds. Therefore, the organic-inorganic hard adhesion layer and the hydrophilic anti-fog coating are adhered to each other tightly. It brings high hardness, high water resistance and good anti-fog effect.

    Abstract translation: 本发明涉及一种制造硬质防水防雾涂料的方法,特别涉及一种在塑料材料上制造硬质防水防雾涂料的方法。 在该方法中,制备有机 - 无机硬粘合层和亲水性防雾涂膜,用于制造硬质防水防雾涂料。 有机 - 无机硬粘合层和亲水性防雾涂层都具有C = C双键。 因此,有机 - 无机硬粘合层和亲水性防雾涂层紧密地粘合。 它具有高硬度,高耐水性和良好的防雾效果。

    Electronic device and engaging structure thereof
    2.
    发明授权
    Electronic device and engaging structure thereof 有权
    电子设备及其接合结构

    公开(公告)号:US08203843B2

    公开(公告)日:2012-06-19

    申请号:US12540158

    申请日:2009-08-12

    Inventor: Ching-Chung Chen

    Abstract: The invention discloses an electronic device and an engaging structure thereof. The electronic device comprises a first casing and a second casing. The first casing comprises a plate portion and a plurality of hooks. Each hook is located on the plate portion. The second casing comprises a first side portion, a second side portion, an engaging portion, a first rib and a second rib. The engaging portion is between the first and the second side portions and comprises a plurality of recesses. Each recess is engaged with one of the hooks and has a front edge. A gap is between one end of the hook and the front edge of the recess. The first and second ribs are respectively located on the first and the second side portions. The plate portion is disposed on the first and second ribs. The hook can be detached from the recess by the gap.

    Abstract translation: 本发明公开了一种电子设备及其接合结构。 电子设备包括第一壳体和第二壳体。 第一壳体包括板部分和多个钩。 每个钩位于板部分上。 第二壳体包括第一侧部,第二侧部,接合部,第一肋和第二肋。 接合部分在第一和第二侧部之间并且包括多个凹部。 每个凹槽与其中一个钩接合并且具有前边缘。 在钩的一端和凹部的前边缘之间存在间隙。 第一和第二肋分别位于第一和第二侧部上。 板部分设置在第一和第二肋上。 钩可以通过间隙与凹槽分离。

    Detecting device and connector module thereof
    3.
    发明授权
    Detecting device and connector module thereof 有权
    检测装置及其连接器模块

    公开(公告)号:US07794269B2

    公开(公告)日:2010-09-14

    申请号:US12349450

    申请日:2009-01-06

    CPC classification number: H01R13/641 H01R13/6658

    Abstract: A detecting device is used to detect the connection of an electronic device. The detecting device includes a circuit board and a connector module. The circuit board includes a power terminal and a signal processing unit. The connector module includes a body and a detecting member. The body has a connecting port and a connecting sidewall. The detecting member is disposed on the connecting sidewall and electrically connected to the power terminal and the signal processing unit, and it has a potential. When a plug of the electronic device is connected to the connecting port, the plug contacts the detecting member to change the potential. The change of the potential is detected by the signal processing unit such that the connection between the electronic device and the connector module is confirmed.

    Abstract translation: 检测装置用于检测电子设备的连接。 检测装置包括电路板和连接器模块。 电路板包括电源端子和信号处理单元。 连接器模块包括主体和检测构件。 主体具有连接端口和连接侧壁。 检测部件设置在连接侧壁上,与电源端子和信号处理部电连接,具有电位。 当电子设备的插头连接到连接端口时,插头接触检测构件以改变电位。 由信号处理单元检测电位的变化,使得确认电子设备与连接器模块之间的连接。

    LIGHT EMITTING DIODE
    4.
    发明申请
    LIGHT EMITTING DIODE 有权
    发光二极管

    公开(公告)号:US20070164307A1

    公开(公告)日:2007-07-19

    申请号:US11686967

    申请日:2007-03-16

    Inventor: Ching-Chung Chen

    CPC classification number: H01L33/44 H01L33/641 H01L2933/0091

    Abstract: A light emitting diode comprising a semiconductor layer, a first electrode, a second electrode and a diamond-like carbon layer is provided. The semiconductor layer includes a first type doped semiconductor layer, a light emitting layer and a second type doped semiconductor layer. Wherein, the light emitting layer locates between the first type doped semiconductor layer and the second type doped semiconductor layer. The first electrode is electrically connected to the first type doped semiconductor layer. The second electrode is electrically connected to the second type doped semiconductor layer. The diamond-like carbon layer covers on the semiconductor layer and exposes at least a portion of the first electrode. Moreover, the exposed outer surface of the diamond-like carbon layer is a rough surface. Alternatively, other passivation layer with rough surface can be substituted for the diamond-like carbon layer.

    Abstract translation: 提供了包括半导体层,第一电极,第二电极和类金刚石碳层的发光二极管。 半导体层包括第一掺杂半导体层,发光层和第二掺杂半导体层。 其中,发光层位于第一掺杂半导体层和第二掺杂半导体层之间。 第一电极电连接到第一类型的掺杂半导体层。 第二电极电连接到第二类型掺杂半导体层。 类金刚石碳层覆盖在半导体层上并暴露第一电极的至少一部分。 此外,金刚石状碳层的露出的外表面是粗糙的表面。 或者,具有粗糙表面的其它钝化层可以代替类金刚石碳层。

    Screw mounting jig
    5.
    发明授权
    Screw mounting jig 失效
    螺丝安装夹具

    公开(公告)号:US07210208B2

    公开(公告)日:2007-05-01

    申请号:US10840122

    申请日:2004-05-06

    CPC classification number: B23Q3/06 Y10T29/5313 Y10T29/53978

    Abstract: A screw mounting jig. The jig supports an electronic device thereon. The electronic device includes a first surface and a second surface opposite to the first surface. A first screw hole is formed on the first surface, and a second screw hole is formed on the second surface. The jig includes a base and a supporting assembly. The electronic device is received in the supporting assembly. The supporting assembly is disposed on the base in a manner such that it rotates between a first position and a second position. When the supporting assembly is located at the first position, the first surface faces the base so that the second screw hole is exposed for insertion. When the supporting assembly is located at the second position, the second surface faces the base so that the first screw hole is exposed for insertion.

    Abstract translation: 螺丝安装夹具 夹具支撑其上的电子设备。 电子设备包括与第一表面相对的第一表面和第二表面。 第一螺纹孔形成在第一表面上,第二螺纹孔形成在第二表面上。 夹具包括基座和支撑组件。 电子设备被接收在支撑组件中。 支撑组件以使得其在第一位置和第二位置之间旋转的方式设置在基座上。 当支撑组件位于第一位置时,第一表面面向基部,使得第二螺钉孔暴露以便插入。 当支撑组件位于第二位置时,第二表面面向基部,使得第一螺钉孔暴露以便插入。

    Multipurpose illumination device
    6.
    发明申请
    Multipurpose illumination device 失效
    多用途照明装置

    公开(公告)号:US20050201092A1

    公开(公告)日:2005-09-15

    申请号:US10833147

    申请日:2004-04-28

    Inventor: Ching-Chung Chen

    CPC classification number: F21L4/02 F21S8/035 F21S9/022 F21W2111/00 F21Y2115/10

    Abstract: A multipurpose illumination device, specifically related to an illumination instrument that can be used as an electric torch, a night-light, an emergency aid or an indicator light. The device includes a column with three sections. A main section, which is a middle of the three, has a main light, a battery, circuits, a button switch and a power supply plug. An upper section located above the main section is made of transparent or semi-transparent material. A pedestal located below the main section is made of semi-transparent material.

    Abstract translation: 一种多功能照明装置,具体涉及可用作电动炬,夜灯,紧急援助或指示灯的照明器具。 该设备包括一个具有三个部分的列。 主要部分是三分之一的中心,主要有一个主灯,一个电池,一个电路,一个按钮开关和一个电源插头。 位于主体部分上方的上部由透明或半透明材料制成。 位于主要部分下方的基座由半透明材料制成。

    Method of fabricating an image sensor
    7.
    发明授权
    Method of fabricating an image sensor 有权
    制作图像传感器的方法

    公开(公告)号:US06617189B1

    公开(公告)日:2003-09-09

    申请号:US10063949

    申请日:2002-05-28

    CPC classification number: H01L27/14685 H01L27/14621 H01L27/14627

    Abstract: A method of fabricating an image sensor on a semiconductor substrate including a sensor array region is introduced. First, an R/G/B color filter array (CFA) is formed on portions of the semiconductor substrate corresponding to the sensor array region. Then, a spacer layer is formed on the R/G/B CFA, and a plurality of U-lens is formed on the spacer layer corresponding to the R/G/B CFA. Afterwards, a buffer layer is coated to fill a space between the U-lens, and a low-temperature passivation layer is deposited on the buffer layer and the U-lens at a temperature of about 300° C. or less to prevent the R/G/B CFA from damage.

    Abstract translation: 引入了在包括传感器阵列区域的半导体衬底上制造图像传感器的方法。 首先,在对应于传感器阵列区域的半导体衬底的部分上形成R / G / B滤色器阵列(CFA)。 然后,在R / G / B CFA上形成间隔层,在对应于R / G / B CFA的间隔层上形成多个U型透镜。 然后,涂覆缓冲层以填充U型透镜之间的空间,并且在约300℃或更低的温度下在缓冲层和U型透镜上沉积低温钝化层以防止R / G / B CFA从损坏。

    DOCKING STATION
    9.
    发明申请
    DOCKING STATION 有权
    锁定站

    公开(公告)号:US20130148298A1

    公开(公告)日:2013-06-13

    申请号:US13710475

    申请日:2012-12-11

    CPC classification number: H05K7/20145 G06F1/1632 G06F1/20

    Abstract: A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.

    Abstract translation: 适用于便携式电子设备的坞站包括底座,支撑部件和第一风扇。 基座包括气流引导斜面。 支撑部件设置在基座上并具有气流引导结构,其中便携式电子设备被配置为支撑在支撑部件上。 第一风扇设置在基座中并且提供冷却气流,其中气流引导斜面和气流引导结构引导冷却气流流入便携式电子设备。

    Electronic device
    10.
    发明授权
    Electronic device 有权
    电子设备

    公开(公告)号:US08213178B2

    公开(公告)日:2012-07-03

    申请号:US12757057

    申请日:2010-04-09

    CPC classification number: H05K7/20145 G06F1/203

    Abstract: An electronic device includes a housing, a module, a main board, and a fan. The module, the main board and the fan are all installed in the housing. The main board divides the interior of the housing into a first space and a second space, and there exists a channel opening between the main board and the module so as to communicate the first space with the second space. The fan is electrically connected to the main board, has a fan outlet and is capable of outputting airflow through the fan outlet to the outside of the housing.

    Abstract translation: 电子设备包括壳体,模块,主板和风扇。 模块,主板和风扇都安装在外壳中。 主板将壳体的内部分成第一空间和第二空间,并且在主板和模块之间存在通道开口,以将第一空间与第二空间连通。 风扇电连接到主板,具有风扇出口,并且能够将通过风扇出口的气流输出到壳体的外部。

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