公开(公告)号：US07295441B1

公开(公告)日：2007-11-13

申请号：US11383168

申请日：2006-05-12

申请人： Tse-Hsine Laio ,  Ting-Kuo Kao

发明人： Tse-Hsine Laio ,  Ting-Kuo Kao

IPC分类号： H05K7/20

CPC分类号： H05K1/0206 ,  H01L23/3677 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2203/044 ,  H01L2924/00

摘要： A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically coupled to an electronic component, a heat dissipating layer disposed on another surface of the substrate, and at least one heat pipe, each having a heated end and a condensing end extended from the heated end. The substrate includes a through hole passing through the heat dissipating layer, and the heat dissipating layer includes an adhering layer disposed at a surface proximate to the surroundings of the heat pipe, and a distal end of the heated end of the heat pipe is covered by the adhering layer, and the adhering layer is extended from the surface of the heat dissipating layer to a corresponding position of the electronic component.

摘要翻译： 散热型印刷电路板及其用热导管传导热量的结构包括：衬底，设置在衬底的表面上并电耦合到电子部件的信号电路，设置在衬底的另一个表面上的散热层 ，以及至少一个热管，每个热管具有加热端和从加热端延伸的冷凝端。 基板包括穿过散热层的通孔，散热层包括设置在靠近热管周围的表面的粘附层，并且热管的加热端的远端被覆盖在 粘附层和粘附层从散热层的表面延伸到电子部件的对应位置。

公开(公告)号：US07474541B2

公开(公告)日：2009-01-06

申请号：US11383185

申请日：2006-05-12

申请人： Tse-Hsine Laio ,  Ting-Kuo Kao

发明人： Tse-Hsine Laio ,  Ting-Kuo Kao

IPC分类号： H05K7/12

CPC分类号： H05K1/0209 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0373 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2203/043

摘要： In a printed circuit board and its heat dissipating metal surface layout, a layer of copper foil is coated onto the printed circuit board for dissipating heat, and the surface of the copper foil is covered by an insulating coating, and a bare copper is formed on the surface of copper foil which is not covered by the insulating coating, and the bare copper is arranged in a cross shape, or in the shape of “#”, so that when the printed circuit board goes through a soldering furnace, the cohesion of solder is even instead of aggregating at a same position or the center, so as to obtain a larger protruding area and facilitate dissipating heat and transmitting current.

摘要翻译： 在印刷电路板及其散热金属表面布置中，将一层铜箔涂覆在印刷电路板上用于散热，铜箔的表面被绝缘涂层覆盖，并且裸铜形成在 未被绝缘涂层覆盖的铜箔的表面和裸铜布置成十字形或“＃”形，使得当印刷电路板通过焊接炉时，其内聚力 焊料是均匀的，而不是在相同的位置或中心处聚集，以便获得更大的突出面积并且有助于散热和传输电流。

公开(公告)号：US20070261882A1

公开(公告)日：2007-11-15

申请号：US11383185

申请日：2006-05-12

申请人： Tse-Hsine Laio ,  Ting-Kuo Kao

发明人： Tse-Hsine Laio ,  Ting-Kuo Kao

IPC分类号： H05K1/00

CPC分类号： H05K1/0209 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0373 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2203/043

摘要： In a printed circuit board and its heat dissipating metal surface layout, a layer of copper foil is coated onto the printed circuit board for dissipating heat, and the surface of the copper foil is covered by an insulating coating, and a bare copper is formed on the surface of copper foil which is not covered by the insulating coating, and the bare copper is arranged in a cross shape, or in the shape of “#”, so that when the printed circuit board goes through a soldering furnace, the cohesion of solder is even instead of aggregating at a same position or the center, so as to obtain a larger protruding area and facilitate dissipating heat and transmitting current.

摘要翻译： 在印刷电路板及其散热金属表面布置中，将一层铜箔涂覆在印刷电路板上用于散热，铜箔的表面被绝缘涂层覆盖，并且裸铜形成在 未被绝缘涂层覆盖的铜箔的表面和裸铜布置成十字形或“＃”形，使得当印刷电路板通过焊接炉时，其内聚力 焊料是均匀的，而不是在相同的位置或中心处聚集，以便获得更大的突出面积并且有助于散热和传输电流。

公开(公告)号：US20070254526A1

公开(公告)日：2007-11-01

申请号：US11413088

申请日：2006-04-28

申请人： Chih-Ming Lai ,  Hou-Yuan Lin ,  Yung-Shun Kao ,  Tse-Hsine Laio

发明人： Chih-Ming Lai ,  Hou-Yuan Lin ,  Yung-Shun Kao ,  Tse-Hsine Laio

IPC分类号： H01R24/00

CPC分类号： H01R12/716 ,  H01R12/721 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10515

摘要： A structure of an interface card connector includes a connector body and a plurality of terminals provided on the connector body. The bottom surface of the connector body is divided into a terminal zone and a space zone along the transverse direction. The distal ends of the terminals project from the terminal zone toward the bottom surface of the connector body. The space zone is recessed toward the connector body to form a notch portion, so that the bottom surface formed by the space zone is higher than that formed by the terminal zone. The space zone is used to provide a space for arranging the electronic components on the main board, so that more space on the main board is spared for the circuit layout. With this arrangement, the problem of the insufficient space and area of the main board can be solved.

公开(公告)号：US07300315B2

公开(公告)日：2007-11-27

申请号：US11413088

申请日：2006-04-28

申请人： Chih-Ming Lai ,  Hou-Yuan Lin ,  Yung-Shun Kao ,  Tse-Hsine Laio

发明人： Chih-Ming Lai ,  Hou-Yuan Lin ,  Yung-Shun Kao ,  Tse-Hsine Laio

IPC分类号： H01R24/00

CPC分类号： H01R12/716 ,  H01R12/721 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10515

摘要： A structure of an interface card connector includes a connector body and a plurality of terminals provided on the connector body. The bottom surface of the connector body is divided into a terminal zone and a space zone along the transverse direction. The distal ends of the terminals project from the terminal zone toward the bottom surface of the connector body. The space zone is recessed toward the connector body to form a notch portion, so that the bottom surface formed by the space zone is higher than that formed by the terminal zone. The space zone is used to provide a space for arranging the electronic components on the main board, so that more space on the main board is spared for the circuit layout. With this arrangement, the problem of the insufficient space and area of the main board can be solved.

摘要翻译： 接口卡连接器的结构包括连接器主体和设置在连接器本体上的多个端子。 连接器本体的底面沿着横向方向分为端子区和空间区。 端子的远端从端子区域突出到连接器主体的底面。 空间区域朝向连接器主体凹入以形成切口部分，使得由空间区域形成的底面高于由终端区域形成的底面。 空间区域用于为主板上的电子部件配置空间，使得主板上的空间更多地用于电路布局。 通过这种布置，可以解决主板空间和面积不足的问题。

公开(公告)号：US20070263362A1

公开(公告)日：2007-11-15

申请号：US11383168

申请日：2006-05-12

申请人： Tse-Hsine Laio ,  Ting-Kuo Kao

发明人： Tse-Hsine Laio ,  Ting-Kuo Kao

IPC分类号： H05K7/20

CPC分类号： H05K1/0206 ,  H01L23/3677 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2203/044 ,  H01L2924/00

摘要： A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically coupled to an electronic component, a heat dissipating layer disposed on another surface of the substrate, and at least one heat pipe, each having a heated end and a condensing end extended from the heated end. The substrate includes a through hole passing through the heat dissipating layer, and the heat dissipating layer includes an adhering layer disposed at a surface proximate to the surroundings of the heat pipe, and a distal end of the heated end of the heat pipe is covered by the adhering layer, and the adhering layer is extended from the surface of the heat dissipating layer to a corresponding position of the electronic component.

摘要翻译： 散热型印刷电路板及其用热导管传导热量的结构包括：衬底，设置在衬底的表面上并电耦合到电子部件的信号电路，设置在衬底的另一个表面上的散热层 ，以及至少一个热管，每个热管具有加热端和从加热端延伸的冷凝端。 基板包括穿过散热层的通孔，散热层包括设置在靠近热管周围的表面的粘附层，并且热管的加热端的远端被覆盖在 粘附层和粘附层从散热层的表面延伸到电子部件的对应位置。