LIGHT-EMITTING DEVICE
    2.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号:US20120138892A1

    公开(公告)日:2012-06-07

    申请号:US13313645

    申请日:2011-12-07

    IPC分类号: H01L33/04

    CPC分类号: H01L27/15 H01L33/08 H01L33/32

    摘要: A light-emitting device comprises a substrate, and a light-emitting structure formed on the substrate. The light-emitting structure comprises a first active layer emitting the light with a first wavelength, and a second active layer emitting the light with a second wavelength. The light-emitting structure is formed by the first active layer and the second active layer stacked alternately.

    摘要翻译: 发光器件包括衬底和形成在衬底上的发光结构。 发光结构包括发射具有第一波长的光的第一有源层和发射具有第二波长的光的第二有源层。 发光结构由交替堆叠的第一有源层和第二有源层形成。

    Wafer-scaled light-emitting structure
    4.
    发明授权
    Wafer-scaled light-emitting structure 有权
    晶圆尺寸发光结构

    公开(公告)号:US08299481B2

    公开(公告)日:2012-10-30

    申请号:US12533196

    申请日:2009-07-31

    IPC分类号: H01L33/00

    摘要: This invention discloses a wafer-scaled light-emitting structure comprising a supportive substrate; an anti-deforming layer; a bonding layer; and a light-emitting stacked layer, wherein the anti-deforming layer reduces or removes the deformation like warp caused by thinning of the substrate.

    摘要翻译: 本发明公开了一种包括支撑衬底的晶片级发光结构; 抗变形层; 接合层; 以及发光层叠体,其中,所述抗变形层减少或去除由所述基板的变薄引起的翘曲。