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    LED substrate structure, LED unit and lighting module having the same
    1.
    发明授权
    LED substrate structure, LED unit and lighting module having the same 有权
    LED基板结构，LED单元和具有相同的照明模块

    公开(公告)号：US08803186B2

    公开(公告)日：2014-08-12

    申请号：US13545643

    申请日：2012-07-10

    申请人： Hou-Te Lee ,  Tsung-Kang Ying ,  Chia-Hung Chu ,  Shih-Po Yu

    发明人： Hou-Te Lee ,  Tsung-Kang Ying ,  Chia-Hung Chu ,  Shih-Po Yu

    IPC分类号： H01L33/62 ,  H01L33/48

    CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    摘要： An LED substrate structure has a substrate and a conducting portion. The substrate has a bottom surface and two opposite first lateral surfaces connected with the bottom surface. The bottom surface has the conducting portion formed thereon, and the conducting portion has a first cutting segment located on a contact border defined between one of the two first lateral surfaces and the bottom surface. The conducting portion further has an expansion region connected with the first cutting segment. The length of the first cutting segment is shorter than any segment taken on the expansion region parallel thereto.

    摘要翻译： LED基板结构具有基板和导电部分。 衬底具有底表面和与底表面连接的两个相对的第一侧表面。 底表面具有形成在其上的导电部分，并且导电部分具有位于在两个第一侧表面之一和底表面之间限定的接触界面上的第一切割段。 导电部分还具有与第一切割部分连接的扩张区域。 第一切割段的长度比在与其平行的扩展区域上取得的任何段短。