公开(公告)号：US06657294B2

公开(公告)日：2003-12-02

申请号：US09863565

申请日：2001-05-23

申请人： Marcus Toth ,  Joachim Heinz Schober ,  Peter Schmallegger ,  Veronika Sauer

发明人： Marcus Toth ,  Joachim Heinz Schober ,  Peter Schmallegger ,  Veronika Sauer

IPC分类号： H01L2304

CPC分类号： G06K19/07728 ,  G06K19/07745 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A data carrier (1) includes an IC module (3), having a substrate (4), and a conductor configuration (5) connected to the substrate (4), and an IC (2) connected to the substrate (4), and connecting leads (10, 11) between the conductor configuration (5) and the IC (2), and a cover (12) of an electrically insulating material, which cover (12) shrouds the IC (2) and the connecting leads (10, 11) and the portions (13, 14, 15) of the conductor configuration (5) The data carrier (1) is equipped with a protection mechanism (20) that provides protection against damage to at least a part of the IC module (3) when the IC module (3) is bent or twisted, which protection mechanism (20) forms a part of the IC module (3), consists of a ductile material, and is formed by a layer-shaped, preferably net-like, cap which is encased in the cover (12) up to the substrate means (4).

摘要翻译： 数据载体（1）包括具有衬底（4）的IC模块（3）和连接到衬底（4）的导体结构（5）和连接到衬底（4）的IC（2） 以及导体构造（5）和IC（2）之间的连接引线（10,11）和电绝缘材料的盖（12），盖（12）覆盖IC（2）和连接引线 导体构造（5）的部分（13,14,15）数据载体（1）配备有保护机构（20），该保护机构（20）提供防止对IC模块的至少一部分的损坏 （3）当IC模块（3）弯曲或扭曲时，该保护机构（20）形成IC模块（3）的一部分，由延性材料构成，并且由层状， （12）中的盖子直到基板装置（4）。

公开(公告)号：US06420660B1

公开(公告)日：2002-07-16

申请号：US09445235

申请日：1999-12-08

申请人： Veronika Sauer ,  Ben Slager ,  Friedrich Lach ,  Alfred Bauer ,  Horst Hartmann ,  Günter Kolodzei

发明人： Veronika Sauer ,  Ben Slager ,  Friedrich Lach ,  Alfred Bauer ,  Horst Hartmann ,  Günter Kolodzei

IPC分类号： H05K102

CPC分类号： H05K3/0097 ,  G06K19/077 ,  G06K19/07743 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/202 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/1545 ,  H01L2924/00

摘要： The chips for chip cards are customarily provided on a film strip which consists of a synthetic foil and a conductor track pattern and are connected to the conductor track pattern by way of bonding wires. Automatic mounting is made possible by the use of a film strip with periodically arranged conductor track patterns. For chips which can be driven via contacts as well as in a contactless manner, using a coil, conductor tracks are effectively provided on both sides of the synthetic foil forming the film strip. However, the film strip then becomes very inflexible so that it cannot be suitably handled by conventional automatic apparatus. The invention proposes to provide the metal foils wherefrom the conductor tracks are cut out with additional interruptions which reduce the cross-section of the metal foils at short intervals in the direction perpendicular to the longitudinal direction of the film. The film strip thus becomes more flexible so that it can be handled by conventional automatic apparatus.

摘要翻译： 用于芯片卡的芯片通常设置在由合成箔和导体轨迹图案组成的薄膜条上，并且通过接合线连接到导体轨迹图案。 通过使用具有周期性布置的导体轨迹图案的胶片条，可实现自动安装。 对于可以通过触点驱动的芯片以及以非接触方式驱动的芯片，使用线圈，在形成薄膜条的合成箔的两侧上有效地设置导体轨迹。 然而，薄膜条变得非常不灵活，使得它不能被传统的自动装置适当地处理。 本发明提出提供金属箔，其中导体轨迹被切除，附加中断，其在垂直于膜的纵向方向的方向上以短的间隔减小金属箔的横截面。 因此，薄膜条变得更加柔软，从而可以通过常规的自动装置来处理。