Device and method for regulating application of adhesives and/or sealants
    1.
    发明授权
    Device and method for regulating application of adhesives and/or sealants 有权
    用于调节粘合剂和/或密封剂的应用的装置和方法

    公开(公告)号:US06746712B2

    公开(公告)日:2004-06-08

    申请号:US10248256

    申请日:2002-12-31

    IPC分类号: B05D510

    摘要: The present invention pertains to an arrangement for the controlled application of adhesive to substrate. In at least one embodiment, the arrangement comprises a) an adhesive reservoir, b) a pump, c) an applicator head having at least one applicator nozzle, d) a volume throughput sensor, and e) a monitoring unit. The reservoir, the pump, and the applicator head are connected together by a conduit system carrying the adhesive. The volume throughput sensor and the monitoring unit are connected together by a pulse transmission line. The monitoring unit, the feed pump, and the applicator head are connected together by control lines. In at least one embodiment, the application of adhesive to substrates is controlled by measuring the volume throughput of the adhesive, transmitting signals indicative of volume throughout to the monitoring unit, and controlling the amount of adhesive applied to the substrate material in-line in response to the signals.

    摘要翻译: 本发明涉及用于将粘合剂控制应用于基底的布置。 在至少一个实施例中,该装置包括a)粘合剂储存器,b)泵,c)具有至少一个施加器喷嘴的施加器头,d)体积通量传感器,以及e)监控单元。 储存器,泵和施用器头通过携带粘合剂的管道系统连接在一起。 体积吞吐量传感器和监测单元通过脉冲传输线连接在一起。 监控单元,进料泵和涂抹头通过控制线连接在一起。 在至少一个实施方案中,通过测量粘合剂的体积生产量来控制粘合剂对基底的施加,将指示体积的信号传输到监测单元,并且响应地控制施加到衬底材料的粘合剂的量 信号。