摘要:
Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.
摘要:
An oral care implement, such as a toothbrush (100), comprises a handle (110) and a head (120). A plurality of tooth cleaning elements (130) may be provided on a front surface (121) of the head (120). The head (120) is formed by a plurality of spaced-apart segments (140-145) made of a rigid material. The segments (140-145) are isolated from one another by channels (157-159B) containing an elastomeric material (146) that flexibly connects the segments (140-145) together. The oral care implement further comprises an elastomeric soft tissue cleaner (200) located on a rear surface (122) of the head (120) opposite the front surface (121) of the head (120). Each of the segments (140-145) comprises a protuberance (163-169) made of the rigid material that extends through the elastomeric soft tissue cleaner (200) and is exposed therethrough.
摘要:
An oral care implement, such as a toothbrush. In one aspect, the invention is an oral care implement comprising a handle and a head. A plurality of tooth cleaning elements may extend from a front surface of the head, which is formed by a plurality of spaced-apart segments formed of a rigid material, wherein the plurality of segments include a cruciform segment integrally formed with and extending from a distal end of the handle, a first pair of segments located on opposite sides of a longitudinal portion of the cruciform segment, and a second pair of segments located on opposite sides of the longitudinal portion of the cruciform segment, the first pair of segments located on an opposite side of a transverse portion of the cruciform segment from the second pair of segments. The segments of the first and second pairs are flexibly connected to the cruciform segment.
摘要:
Methods of generating wide process range libraries for metrology are described. For example, a method includes generating a first library having a first process range for a first parameter. A second library is generated having a second process range for the first parameter. The second process range is overlapping with the first process range. The second library is stitched to the first library to generate a third library having a third process range for the first parameter. The third process range is wider than each of the first and second process ranges.
摘要:
A method of bonding and detaching a temporary carrier used for handling a wafer during the fabrication of semiconductor devices includes bonding a wafer onto a carrier through a first adhesive layer and a second adhesive layer, in which the edge zone of the wafer and the carrier is covered by the first adhesive layer while the edge zone is not covered by the second adhesive layer. A wafer edge clean process is then performed to remove the first adhesive layer adjacent the edge of the wafer and expose the edge zone of the carrier, followed by removing the second adhesive layer from the carrier. After detaching the carrier from the wafer, the first adhesive layer remaining on the wafer is removed.
摘要:
Compression molding of metals is used to make microchannel heat exchangers. Heat transfer can be improved by employing controlled microchannel surface roughness. Flux-free bonding is achieved using a eutectic thin-film intermediate layer. Seals are leak-tight, mechanically strong, and uniform across multiple contact areas. The metal heat exchangers may be mass-produced inexpensively, and are useful for applications including the cooling of computer chips and other high-power electronic devices, air conditioning, refrigeration, condenser plates, radiators, fuel cell heat management, and instant water heating.