Elasto-plastic sockets for Land or Ball Grid Array packages and subsystem assembly
    1.
    发明申请
    Elasto-plastic sockets for Land or Ball Grid Array packages and subsystem assembly 失效
    弹性塑料插座,用于土地或球栅阵列封装和子系统组装

    公开(公告)号:US20050174744A1

    公开(公告)日:2005-08-11

    申请号:US10775590

    申请日:2004-02-09

    申请人: Wen-Chun Zheng

    发明人: Wen-Chun Zheng

    IPC分类号: H01R13/24 H05K7/06

    CPC分类号: H01R13/2435

    摘要: An elasto-plastic socket for Land or Ball Grid Array package comprising a plurality of metal contacts embedded in a substrate by lamination. The curved plate spring of the metal contacts enable large deformation to accommodate all tolerances other than package tolerance and ensure uniform contact pressure across the package because they are designed based on the application of elasto-plasticity theory. An elasto-plastic stiffener shares the pressure from heat sink to package substrate and semiconductor. A cutting edge subsystem assembly for Land or Ball Grid Array package integrates L/BGA socket, L/BGA package and heat sink with a frame on top of PCB to increase the stiffness. The methods of post manufacturing including post forming and post age hardening used for testing socket application can increase the durability.

    摘要翻译: 一种用于陆地或球栅阵列封装的弹性塑料插座,其包括通过层压嵌入衬底中的多个金属触点。 金属触头的弯曲板簧能够实现大的变形,以适应除封装公差之外的所有公差,并确保封装上的均匀接触压力,因为它们是基于弹性可塑性理论的应用而设计的。 弹性塑料加强件将散热器的压力与封装衬底和半导体共享。 用于Land或Ball Grid Array封装的前沿子系统组件将L / BGA插座,L / BGA封装和散热器与PCB顶部的框架集成,以增加刚度。 用于测试插座应用的后制造方法包括后成型和后期硬化可以提高耐久性。

    Bi-directional blowers for cooling computers
    2.
    发明授权
    Bi-directional blowers for cooling computers 失效
    用于冷却电脑的双向鼓风机

    公开(公告)号:US07255532B2

    公开(公告)日:2007-08-14

    申请号:US11080764

    申请日:2005-03-14

    申请人: Wen-Chun Zheng

    发明人: Wen-Chun Zheng

    IPC分类号: F04D29/44

    摘要: A heat dissipating device includes a motor, a rotary unit, and a housing for receiving the motor and the rotary unit. The rotary unit includes a hub mounted to the motor and blades extending from the hub. The housing defines a hot air inlet, a hot air outlet, a cold air inlet, and a cold air outlet. The housing includes a first partition and a second partition located close to outer ends of the blades. The two partitions divide the housing into a first channel coupling the hot air inlet and the hot air outlet, and a second channel coupling the cold air inlet and the cold air outlet. The two partitions have widths greater than a pitch of the blades to prevent air from mixing in the two channels. The two channels create a bi-directional blower that removes hot air from and provides cold air into a computer case.

    摘要翻译: 散热装置包括马达,旋转单元和用于接收马达和旋转单元的壳体。 旋转单元包括安装到电动机的轮毂和从轮毂延伸的叶片。 壳体限定热空气入口,热空气出口,冷空气入口和冷空气出口。 壳体包括靠近叶片的外端的第一隔板和第二隔板。 两个分隔件将壳体分成连接热空气入口和热空气出口的第一通道,以及联接冷空气入口和冷气出口的第二通道。 两个隔板的宽度大于叶片间距,以防止空气在两个通道中混合。 这两个通道创建一个双向鼓风机,从而将热空气从冷空气中排出并提供给计算机机箱。

    Elasto-plastic sockets for Land or Ball Grid Array packages and subsystem assembly
    3.
    发明授权
    Elasto-plastic sockets for Land or Ball Grid Array packages and subsystem assembly 失效
    弹性塑料插座,用于土地或球栅阵列封装和子系统组装

    公开(公告)号:US07196907B2

    公开(公告)日:2007-03-27

    申请号:US10775590

    申请日:2004-02-09

    申请人: Wen-Chun Zheng

    发明人: Wen-Chun Zheng

    IPC分类号: H05K7/00

    CPC分类号: H01R13/2435

    摘要: An elasto-plastic socket for Land or Ball Grid Array package comprising a plurality of metal contacts embedded in a substrate by lamination. The curved plate spring of the metal contacts enable large deformation to accommodate all tolerances other than package tolerance and ensure uniform contact pressure across the package because they are designed based on the application of elasto-plasticity theory. An elasto-plastic stiffener shares the pressure from heat sink to package substrate and semiconductor. A cutting edge subsystem assembly for Land or Ball Grid Array package integrates L/BGA socket, L/BGA package and heat sink with a frame on top of PCB to increase the stiffness. The methods of post manufacturing including post forming and post age hardening used for testing socket application can increase the durability.

    摘要翻译: 一种用于陆地或球栅阵列封装的弹性塑料插座,其包括通过层压嵌入衬底中的多个金属触点。 金属触头的弯曲板簧能够实现大的变形,以适应除封装公差之外的所有公差,并确保封装上的均匀接触压力,因为它们是基于弹性可塑性理论的应用而设计的。 弹性塑料加强件将散热器的压力与封装衬底和半导体共享。 用于Land或Ball Grid Array封装的前沿子系统组件将L / BGA插座,L / BGA封装和散热器与PCB顶部的框架集成,以增加刚度。 用于测试插座应用的后制造方法包括后成型和后期硬化可以提高耐久性。

    Bi-directional blowers for cooling computers
    4.
    发明申请
    Bi-directional blowers for cooling computers 失效
    用于冷却电脑的双向鼓风机

    公开(公告)号:US20060078428A1

    公开(公告)日:2006-04-13

    申请号:US11080764

    申请日:2005-03-14

    申请人: Wen-Chun Zheng

    发明人: Wen-Chun Zheng

    IPC分类号: F04D29/44

    摘要: A heat dissipating device includes a motor, a rotary unit, and a housing for receiving the motor and the rotary unit. The rotary unit includes a hub mounted to the motor and blades extending from the hub. The housing defines a hot air inlet, a hot air outlet, a cold air inlet, and a cold air outlet. The housing includes a first partition and a second partition located close to outer ends of the blades. The two partitions divide the housing into a first channel coupling the hot air inlet and the hot air outlet, and a second channel coupling the cold air inlet and the cold air outlet. The two partitions have widths greater than a pitch of the blades to prevent air from mixing in the two channels. The two channels create a bi-directional blower that removes hot air from and provides cold air into a computer case.

    摘要翻译: 散热装置包括马达,旋转单元和用于接收马达和旋转单元的壳体。 旋转单元包括安装到电动机的轮毂和从轮毂延伸的叶片。 壳体限定热空气入口,热空气出口,冷空气入口和冷空气出口。 壳体包括靠近叶片的外端的第一隔板和第二隔板。 两个分隔件将壳体分成耦合热空气入口和热空气出口的第一通道,以及连接冷空气入口和冷气出口的第二通道。 两个隔板的宽度大于叶片间距,以防止空气在两个通道中混合。 这两个通道创建一个双向鼓风机,从而将热空气从冷空气中排出并提供给计算机机箱。

    Impeller with Hybrid Blades for Blowers
    5.
    发明申请
    Impeller with Hybrid Blades for Blowers 审中-公开
    叶轮与风机混合叶片

    公开(公告)号:US20090324403A1

    公开(公告)日:2009-12-31

    申请号:US12248895

    申请日:2008-10-10

    申请人: Wen-Chun Zheng

    发明人: Wen-Chun Zheng

    IPC分类号: F04D17/08 F01D5/14

    摘要: An impeller with hybrid blades can be used in any blowers, which are applied in many fields such as cooling computers and HVAC. The impeller increases air flow as well as pressure. Each hybrid blade extends from the impeller hub with the shape of an axial fan blade and smoothly transforms at a proper radius of the impeller to the shape of a centrifugal blower blade. In addition, a dual-tunnel blower with multiple outlets is also presented.

    摘要翻译: 具有混合叶片的叶轮可用于任何鼓风机,其应用于许多领域,例如冷却计算机和HVAC。 叶轮增加空气流量和压力。 每个混合叶片从叶轮毂以轴向风扇叶片的形状延伸,并在叶轮的适当半径处平稳地变换为离心式鼓风机叶片的形状。 此外,还提供了具有多个出口的双隧道鼓风机。

    Bi-directional Blowers for Cooling Laptop Computers
    6.
    发明申请
    Bi-directional Blowers for Cooling Laptop Computers 审中-公开
    双向鼓风机冷却笔记本电脑

    公开(公告)号:US20060078423A1

    公开(公告)日:2006-04-13

    申请号:US10711852

    申请日:2004-10-08

    申请人: Wen-Chun Zheng

    发明人: Wen-Chun Zheng

    IPC分类号: F04D29/44

    摘要: Bi-directional Blowers capable of sucking-in ambient air and blowing-out hot air from system box simultaneously are invented to cool computer or electronic systems. The application to cooling laptop computers is disclosed in very details. The bi-directional blowers are comprised of a DC or AC motor, a rotary part of blades and/or impellers, an optional cover, and a housing frame with built-in broken walls, stationary blades and airfoils, which control the flow volume and direction. The separate zone to divide the blow-out and suck-in channels is constructed using the broken walls with conjunction of the blades and/or impellers. The rotary part is the radial blades, or a combination of blades and impellers. Two types of bi-directional blowers are explored: the pressure type and hybrid type. A one-way blower of pressure type utilizes the same principle of the bi-directional blowers such that the inlet and outlet can be located on sides of the blower. With the advantages of the invention, the air gap between laptop bottom and top surface of the desk can be eliminated for better heat conduction through lower side because the desk can be used as a natural heat sink.

    摘要翻译: 发明了能够同时吸入环境空气和吹出系统箱的热空气的双向鼓风机来冷却计算机或电子系统。 非常详细地公开了冷却笔记本电脑的应用。 双向鼓风机包括直流或交流电动机,叶片和/或叶轮的旋转部分,可选的盖子和具有内置破壁的壳体框架,固定叶片和翼型件,其控制流量和 方向。 用于分割吹出和吸入通道的分离区域是利用破碎的壁与叶片和/或叶轮的结合构成的。 旋转部分是径向叶片,或叶片和叶轮的组合。 探讨了两种双向鼓风机:压力式和混合型。 单向式压力式鼓风机采用双向鼓风机相同的原理,使得进口和出口可以位于鼓风机的侧面。 利用本发明的优点,可以消除笔记本电脑底部和桌面顶面之间的气隙,以便通过下侧更好的热传导,因为桌子可以用作天然散热器。

    Nearly isothermal heat pipe heat sink
    7.
    发明授权
    Nearly isothermal heat pipe heat sink 失效
    几乎等温热管散热片

    公开(公告)号:US07677299B2

    公开(公告)日:2010-03-16

    申请号:US11150024

    申请日:2005-06-10

    申请人: Wen-Chun Zheng

    发明人: Wen-Chun Zheng

    IPC分类号: F28D15/00

    摘要: A nearly isothermal heat pipe heat sink is provided. The heat sink includes a flat heat pipe connected to one or more flat vapor chambers using a conduit and a heat pipe. The connected flat heat pipe and the flat vapor chambers form a common vapor domain. Fins are attached on the outer surfaces of the flat heat pipe and the flat vapor chambers. Various capillary structures are also provided for fabricating flat heat pipes. A panelized welding process is further provided for fabricating flat heat pipes or flat vapor chambers. The panelized welding process uses either friction stir welding (FSW) or plasma beam welding to transversely join the panels that form the flat heat pipes or the flat vapor chambers.

    摘要翻译: 提供了几乎等温的热管散热器。 散热器包括使用导管和热管连接到一个或多个平坦蒸气室的扁平热管。 连接的平的热管和平坦的蒸气室形成一个共同的蒸汽区。 翅片附着在平坦的热管和平坦的蒸气室的外表面上。 还提供了各种毛细结构用于制造扁平热管。 还提供了一种用于制造扁平热管或平坦蒸气室的镶板焊接工艺。 镶板焊接工艺使用摩擦搅拌焊接(FSW)或等离子束焊接来横向连接形成平坦热管或平坦蒸气室的面板。

    Nearly isothermal heat pipe heat sink and process for making the same
    9.
    发明申请
    Nearly isothermal heat pipe heat sink and process for making the same 失效
    几乎等温热管散热片和制作相同的工艺

    公开(公告)号:US20060096740A1

    公开(公告)日:2006-05-11

    申请号:US11150024

    申请日:2005-06-10

    申请人: Wen-Chun Zheng

    发明人: Wen-Chun Zheng

    IPC分类号: F28D15/00 H05K7/20

    摘要: A nearly isothermal heat pipe heat sink is provided. The heat sink includes a flat heat pipe connected to one or more flat vapor chambers using a conduit and a heat pipe. The connected flat heat pipe and the flat vapor chambers form a common vapor domain. Fins are attached on the outer surfaces of the flat heat pipe and the flat vapor chambers. Various capillary structures are also provided for fabricating flat heat pipes. A panelized welding process is further provided for fabricating flat heat pipes or flat vapor chambers. The panelized welding process uses either friction stir welding (FSW) or plasma beam welding to transversely join the panels that form the flat heat pipes or the flat vapor chambers.

    摘要翻译: 提供了几乎等温的热管散热器。 散热器包括使用导管和热管连接到一个或多个平坦蒸气室的扁平热管。 连接的平的热管和平坦的蒸气室形成一个共同的蒸汽区。 翅片附着在平坦的热管和平坦的蒸气室的外表面上。 还提供了各种毛细结构用于制造扁平热管。 还提供了一种用于制造扁平热管或平坦蒸气室的镶板焊接工艺。 镶板焊接工艺使用摩擦搅拌焊接(FSW)或等离子束焊接来横向连接形成平坦热管或平坦蒸气室的面板。

    Lidless chip package effectively having co-planar frame and semiconductor die surfaces
    10.
    发明授权
    Lidless chip package effectively having co-planar frame and semiconductor die surfaces 有权
    无盖芯片封装有效地具有共面框架和半导体管芯表面

    公开(公告)号:US07030484B1

    公开(公告)日:2006-04-18

    申请号:US10824455

    申请日:2004-04-14

    IPC分类号: H01L23/34

    摘要: A “lidless” integrated circuit package includes a support member that is arranged to support at least part of a load placed on the integrated circuit package. The support member has or is connected to a flexible support device that is in supportive contact with the load and that is designed to flex dependent on a position of the support member. The flexible support device substantially ensures that a plane of the surface of the flexible support device and a plane of a surface of a semiconductor die of the integrated circuit package are co-planar, thereby leading to a desirable load distribution within the integrated circuit package.

    摘要翻译: “无盖”集成电路封装包括支撑构件,其被布置成支撑放置在集成电路封装上的负载的至少一部分。 支撑构件具有或者连接到与负载支撑接触的柔性支撑装置,并且被设计成取决于支撑构件的位置而弯曲。 柔性支撑装置基本上确保柔性支撑装置的表面的平面和集成电路封装的半导体芯片的表面的平面是共面的,从而导致集成电路封装内的期望的负载分布。