公开(公告)号：US20120168211A1

公开(公告)日：2012-07-05

申请号：US13221414

申请日：2011-08-30

Applicant: Chun-An LU ,  Hong-Ching LIN ,  Shih-Ming CHEN ,  Wen-Pin TING

Inventor： Chun-An LU ,  Hong-Ching LIN ,  Shih-Ming CHEN ,  Wen-Pin TING

IPC: H05K1/03 ,  C08F2/48 ,  C08F2/46 ,  B82Y99/00

CPC classification number: H05K3/386 ,  B82Y30/00 ,  H05K1/0393 ,  H05K1/097 ,  H05K2201/0209 ,  H05K2201/0257

Abstract: A substrate assembly containing a conductive film and a fabrication method thereof are provided. The substrate assembly includes a polymer substrate, a surface treatment layer formed on the polymer substrate and a conductive film formed on the surface treatment layer, wherein the conductive film is formed by sintering a metal conductive ink and the surface treatment layer is formed from a composite material of an auxiliary filler and a polymer. The auxiliary filler in the surface treatment layer can deliver energy into the metal conductive ink for sintering the conductive metal ink.

Abstract translation: 提供一种含有导电膜的基板组件及其制造方法。 基板组件包括聚合物基板，形成在聚合物基板上的表面处理层和形成在表面处理层上的导电膜，其中导电膜通过烧结金属导电油墨形成，并且表面处理层由复合材料形成 辅助填料和聚合物的材料。 表面处理层中的辅助填料可将能量输送到用于烧结导电金属油墨的金属导电油墨中。