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公开(公告)号：US08911821B2
公开(公告)日：2014-12-16
申请号：US12563419
申请日：2009-09-21
Applicant: Chun-An Lu , Hong-Ching Lin , Kuo-Chan Chiou , Szu-Po Huang
Inventor： Chun-An Lu , Hong-Ching Lin , Kuo-Chan Chiou , Szu-Po Huang
CPC classification number: B22F9/30 , B22F1/025 , B22F2998/00 , C01G1/02 , C01P2002/72 , C01P2006/40 , C09D11/52 , B22F2301/10 , B22F2301/052 , B22F2301/15 , B22F2301/25 , B22F2301/205 , B22F2301/30 , B22F2301/35
Abstract: A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.
Abstract translation: 提供了形成纳米级点状材料的方法。 该方法包括提供亚微米级材料和金属有机化合物。 亚微米级材料和金属有机化合物在溶剂中混合。 然后，金属有机化合物通过热分解过程分解，并在亚微米级材料上还原形成多个纳米级点状材料，其中亚微米级材料和纳米级点状材料 是异源材料。 然后，使多个纳米级点状材料熔化，使得多个相邻的亚微米级材料彼此连接，以形成亚微米级材料之间的连续界面。
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2.发明授权Radio frequency identification tag and diaper, absorber and sensing system using the same 有权射频识别标签和尿布，吸收器和感应系统使用相同公开(公告)号：US09160054B2
公开(公告)日：2015-10-13
申请号：US13524192
申请日：2012-06-15
Applicant: Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
Inventor： Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
CPC classification number: H01Q1/2225 , H01Q1/273 , H01Q9/285
Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.
Abstract translation: 提供了包括基板，平面天线，RF芯片，多个信号导体和多个接地导体的射频（RF）识别标签。 RF芯片从平面天线接收RF信号以产生识别码。 信号导体耦合到平面天线。 在信号导体的两个相对侧交织的接地导体和信号导体彼此相邻并且设置在基板上以形成包括阻抗匹配部分和透射部分的共面波导结构。 阻抗匹配部分具有耦合到信号导体的输入端和耦合到接地导体的接地平面。 RF芯片设置在输入端和接地平面之间。 传输部分连接在阻抗匹配部分和平面天线之间。
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公开(公告)号：US09019678B2
公开(公告)日：2015-04-28
申请号：US13587005
申请日：2012-08-16
Applicant: Hsin-Hsien Yeh , Hong-Ching Lin , Tsung-Wen Chen , Wen-Hao Deng
Inventor： Hsin-Hsien Yeh , Hong-Ching Lin , Tsung-Wen Chen , Wen-Hao Deng
IPC: H02H5/04 , H02H3/20 , H02H7/18 , H01H85/00 , H01M10/44 , H01M10/48 , H02H3/08 , H02H9/02 , H01H85/10 , H01H85/12
CPC classification number: H02H3/202 , H01H85/0039 , H01H85/10 , H01H85/12 , H01M10/446 , H01M10/486 , H02H7/18
Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.
Abstract translation: 保护部件包括：封装基板; 布置在所述封装衬底中的第一熔丝单元，具有第一熔化区域; 设置在所述封装基板中的第二熔丝单元，具有靠近所述第一熔融区域的第二熔融区域; 以及设置在与第一和第二熔融区域相对应的封装衬底中的第一掩埋洞穴。 当第一熔融区域和第二熔融区域中的一个被吹出时，第一掩埋洞穴帮助熔丝熔化的能量破坏第一和第二熔融区域中的另一个。
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公开(公告)号：US08582307B2
公开(公告)日：2013-11-12
申请号：US12948280
申请日：2010-11-17
Applicant: Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin
Inventor： Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin
IPC: H05K1/14
CPC classification number: H01Q1/22
Abstract: A wireless communication apparatus in one embodiment includes a bag body and a radio frequency device. The bag body has at least a first slot, which extends to an edge of the bag body. The radio frequency device including a wireless integrated circuit chip is for radio-frequency signal transmission or receiving, and is disposed across a portion of the first slot and coupled to two connection ends of the bag body so that the bag body between the two connection ends serves as an inductance circuit. The inductance circuit of the two connection ends of the bag body is based on metallic material. An impedance of the inductance circuit is for conjugate matching with that of the radio frequency device and is determined according to a plurality of geometric parameters including: a distance from the edge to the wireless integrated circuit chip, and size of the first slot.
Abstract translation: 一个实施例中的无线通信装置包括袋体和射频装置。 袋体具有至少第一槽，其延伸到袋体的边缘。 包括无线集成电路芯片的无线电频率设备用于射频信号传输或接收，并且布置在第一槽的一部分上并且耦合到袋体的两个连接端，使得袋体在两个连接端之间 用作电感电路。 袋体的两个连接端的电感电路基于金属材料。 电感电路的阻抗用于与射频设备的共轭匹配，并且根据多个几何参数来确定，包括：从边缘到无线集成电路芯片的距离以及第一时隙的大小。
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5.发明申请公开(公告)号：US20120168211A1
公开(公告)日：2012-07-05
申请号：US13221414
申请日：2011-08-30
Applicant: Chun-An LU , Hong-Ching LIN , Shih-Ming CHEN , Wen-Pin TING
Inventor： Chun-An LU , Hong-Ching LIN , Shih-Ming CHEN , Wen-Pin TING
CPC classification number: H05K3/386 , B82Y30/00 , H05K1/0393 , H05K1/097 , H05K2201/0209 , H05K2201/0257
Abstract: A substrate assembly containing a conductive film and a fabrication method thereof are provided. The substrate assembly includes a polymer substrate, a surface treatment layer formed on the polymer substrate and a conductive film formed on the surface treatment layer, wherein the conductive film is formed by sintering a metal conductive ink and the surface treatment layer is formed from a composite material of an auxiliary filler and a polymer. The auxiliary filler in the surface treatment layer can deliver energy into the metal conductive ink for sintering the conductive metal ink.
Abstract translation: 提供一种含有导电膜的基板组件及其制造方法。 基板组件包括聚合物基板，形成在聚合物基板上的表面处理层和形成在表面处理层上的导电膜，其中导电膜通过烧结金属导电油墨形成，并且表面处理层由复合材料形成 辅助填料和聚合物的材料。 表面处理层中的辅助填料可将能量输送到用于烧结导电金属油墨的金属导电油墨中。
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Patent Agency Ranking
公开(公告)号：US08042744B2
公开(公告)日：2011-10-25
申请号：US12506367
申请日：2009-07-21
Applicant: Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin , Chiung-Hsiung Chen
Inventor： Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin , Chiung-Hsiung Chen
CPC classification number: G06K19/07749 , G06K19/0775
Abstract: A radio frequency identification (RFID) tag including a substrate, an RFID chip, a chip contact part, a folding circuit and a radiation part is provided. The chip contact part is formed on the substrate and electrically coupled to the RFID chip. The folding circuit is formed on the substrate and electrically coupled to the chip contact part. The folding circuit has a winding part, which forms a hollow region, for compensating the antenna electric length. The radiation part is formed on the substrate and electrically coupled to the folding circuit, wherein one terminal of the winding part of the folding circuit is open, and the other terminal is electrically coupled to the radiation part. At least one of the folding circuit and the radiation part is asymmetric to the chip contact part.
Abstract translation: 提供了包括基板，RFID芯片，芯片接触部件，折叠电路和辐射部件的射频识别（RFID）标签。 芯片接触部分形成在基板上并电耦合到RFID芯片。 折叠电路形成在基板上并电耦合到芯片接触部分。 折叠电路具有绕组部分，其形成中空区域，用于补偿天线电长度。 辐射部分形成在基板上并电耦合到折叠电路，其中折叠电路的绕组部分的一个端子是开放的，另一个端子电耦合到辐射部分。 折叠电路和辐射部分中的至少一个与芯片接触部分不对称。
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公开(公告)号：US20110134622A1
公开(公告)日：2011-06-09
申请号：US12948280
申请日：2010-11-17
Applicant: Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin
Inventor： Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin
IPC: H05K5/02
CPC classification number: H01Q1/22
Abstract: A wireless communication apparatus in one embodiment includes a bag body and a radio frequency device. The bag body has at least a first slot, which extends to an edge of the bag body. The radio frequency device including a wireless integrated circuit chip is for radio-frequency signal transmission or receiving, and is disposed across a portion of the first slot and coupled to two connection ends of the bag body so that the bag body between the two connection ends serves as an inductance circuit. The inductance circuit of the two connection ends of the bag body is based on metallic material. An impedance of the inductance circuit is for conjugate matching with that of the radio frequency device and is determined according to a plurality of geometric parameters including: a distance from the edge to the wireless integrated circuit chip, and size of the first slot.
Abstract translation: 一个实施例中的无线通信装置包括袋体和射频装置。 袋体具有至少第一槽，其延伸到袋体的边缘。 包括无线集成电路芯片的无线电频率设备用于射频信号传输或接收，并且布置在第一槽的一部分上并且耦合到袋体的两个连接端，使得袋体在两个连接端之间 用作电感电路。 袋体的两个连接端的电感电路基于金属材料。 电感电路的阻抗用于与射频设备的共轭匹配，并且根据多个几何参数来确定，包括：从边缘到无线集成电路芯片的距离以及第一时隙的大小。
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公开(公告)号：US20080183407A1
公开(公告)日：2008-07-31
申请号：US11964647
申请日：2007-12-26
Applicant: Hsin-Hsien Yeh , Ying-Chang Hung , Hong-Ching Lin
Inventor： Hsin-Hsien Yeh , Ying-Chang Hung , Hong-Ching Lin
CPC classification number: G06K7/0008 , G06K7/10217
Abstract: The invention provides a system and method for testing the power intensity of RFID tags. The method is applicable to the system for testing power intensity, which comprises a RFID reading device, a signal transmitting device electrically coupled to the RFID reading device, a signal separating device electrically coupled to the signal transmitting device and a control analysis device electrically coupled to the signal separating device. The system is applicable to a RFID tag or a test object attached with a RFID tag in a non-shielded or shielded room.
Abstract translation: 本发明提供了一种用于测试RFID标签的功率强度的系统和方法。 该方法适用于用于测试功率强度的系统，其包括RFID读取装置，电耦合到RFID读取装置的信号发送装置，电耦合到信号发送装置的信号分离装置和电耦合到 信号分离装置。 该系统适用于在非屏蔽或屏蔽的房间中附着有RFID标签的RFID标签或测试对象。
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公开(公告)号：US07135394B2
公开(公告)日：2006-11-14
申请号：US11002509
申请日：2004-12-02
Applicant: Ying-Chang Houng , Hong-Ching Lin , Chi-Jen Shih , Shao-Ju Shih
Inventor： Ying-Chang Houng , Hong-Ching Lin , Chi-Jen Shih , Shao-Ju Shih
IPC: H01L21/44
CPC classification number: C23C18/06 , C23C18/08 , H05K1/097 , H05K3/105 , Y10T428/256
Abstract: Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (
Abstract translation: 形成导电层的方法。 将金属复合材料层施加在基板上，包括多个金属薄片，多个纳米金属球体和多个混合金属前体。 多种混合金属前体包括无机盐和有机酸性盐的混合物。 金属复合材料层被固化以引起放热反应，从而在相对低的温度（<200℃）下在基板上形成导电层，
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公开(公告)号：US08465677B2
公开(公告)日：2013-06-18
申请号：US12813749
申请日：2010-06-11
Applicant: Chun-An Lu , Hong-Ching Lin
Inventor： Chun-An Lu , Hong-Ching Lin
CPC classification number: H01B1/22 , C08K9/04 , C09D5/24 , C09D7/62 , C09D7/70 , C09D11/52 , H01B1/24
Abstract: An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10−3Ω·cm.
Abstract translation: 提供导电组合物及其制造方法。 导电结构包括主要导电材料和分散在主要导电材料周围的能量输送特性的导电填料。 该方法包括将主要导电材料与能量输送特性的导电填料混合以形成混合物，将混合物涂覆在基底上，向混合物施加第二能量源，同时施加第一能量来烧结主导电 材料以形成电阻率小于10×10-3Omega·cm的导电组合物。
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