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公开(公告)号：US08465677B2
公开(公告)日：2013-06-18
申请号：US12813749
申请日：2010-06-11
Applicant: Chun-An Lu , Hong-Ching Lin
Inventor： Chun-An Lu , Hong-Ching Lin
CPC classification number: H01B1/22 , C08K9/04 , C09D5/24 , C09D7/62 , C09D7/70 , C09D11/52 , H01B1/24
Abstract: An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10−3Ω·cm.
Abstract translation: 提供导电组合物及其制造方法。 导电结构包括主要导电材料和分散在主要导电材料周围的能量输送特性的导电填料。 该方法包括将主要导电材料与能量输送特性的导电填料混合以形成混合物，将混合物涂覆在基底上，向混合物施加第二能量源，同时施加第一能量来烧结主导电 材料以形成电阻率小于10×10-3Omega·cm的导电组合物。
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2.发明申请RADIO FREQUENCY IDENTIFICATION TAG AND DIAPER, ABSORBER AND SENSING SYSTEM USING THE SAME 有权无线电频率识别标签和DIAPER，吸收和感应系统公开(公告)号：US20130123726A1
公开(公告)日：2013-05-16
申请号：US13524192
申请日：2012-06-15
Applicant: Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
Inventor： Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
IPC: A61F13/42 , G06K19/077
CPC classification number: H01Q1/2225 , H01Q1/273 , H01Q9/285
Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.
Abstract translation: 提供了包括基板，平面天线，RF芯片，多个信号导体和多个接地导体的射频（RF）识别标签。 RF芯片从平面天线接收RF信号以产生识别码。 信号导体耦合到平面天线。 在信号导体的两个相对侧交织的接地导体和信号导体彼此相邻并且设置在基板上以形成包括阻抗匹配部分和透射部分的共面波导结构。 阻抗匹配部分具有耦合到信号导体的输入端和耦合到接地导体的接地平面。 RF芯片设置在输入端和接地平面之间。 传输部分连接在阻抗匹配部分和平面天线之间。
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3.发明申请METHOD FOR ENHANCING THERMOTOLERANCE OF PLANT AND GENETIC ENGINEERING APPLICATIONS THEREOF 有权提高植物热稳定性及其遗传工程应用的方法公开(公告)号：US20120060237A1
公开(公告)日：2012-03-08
申请号：US13050971
申请日：2011-03-18
Applicant: Shaw-Jye WU , Lian-Chin WANG , Shin-Jye WU , Ching-Hui YEH , Chun-An LU
Inventor： Shaw-Jye WU , Lian-Chin WANG , Shin-Jye WU , Ching-Hui YEH , Chun-An LU
CPC classification number: C12N15/8271
Abstract: A method for providing thermotolerance of a plant and the genetic engineering applications thereof are disclosed. DNA fragment containing a gene encoded EXPORTIN1A is transferred into a plant cell to provide or enhance thermotolerance of the plant. The method can be applied in genetic engineering to select transgenic plant.
Abstract translation: 公开了一种提供植物耐热性的方法及其遗传工程应用。 将含有编码EXPORTIN1A的基因的DNA片段转移到植物细胞中以提供或提高植物的耐热性。 该方法可用于遗传工程中选择转基因植物。
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4.发明申请NANO-METAL SOLUTION, NANO-METAL COMPLEX GRAINS AND MANUFACTURING METHOD OF METAL FILM 审中-公开纳米金属溶液，纳米金属复合颗粒和金属膜的制造方法公开(公告)号：US20100166952A1
公开(公告)日：2010-07-01
申请号：US12651207
申请日：2009-12-31
Applicant: Kuo-Chan Chiou , Hong-Ching Lin , Szu-Po Huang , Chun-An Lu
Inventor： Kuo-Chan Chiou , Hong-Ching Lin , Szu-Po Huang , Chun-An Lu
CPC classification number: C09D7/61 , B22F1/0022 , B22F7/04 , B22F2998/10 , B82Y30/00 , C08K3/08 , C08K9/02 , C09D1/00 , C09D7/62 , C09D7/67 , B22F9/24 , B22F9/305
Abstract: A nano-metal solution, nano-metal complex grains, and a manufacturing method of a metal film are provided. The nano-metal solution includes metal grains having an amount of 0.1˜30 wt %, metallic-organic self-decomposition molecules having an amount of 0.1˜50 wt % and having formula 1, and a solvent having an amount of 20˜99.8 wt %: wherein M represents a metal ion. The metallic-organic self-decomposition molecules and the metal grains are evenly mixed in the solvent, and the metallic-organic self-decomposition molecules are adsorbed on surfaces of the metal grains.
Abstract translation: 提供纳米金属溶液，纳米金属络合物颗粒和金属膜的制造方法。 纳米金属溶液包含0.1〜30重量％的金属颗粒，0.1〜50重量％的金属有机自分解分子，具有式1的溶剂和20〜99.8重量％的溶剂 ％：其中M表示金属离子。 金属有机自分解分子和金属颗粒在溶剂中均匀混合，金属有机自分解分子被吸附在金属颗粒的表面上。
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公开(公告)号：US20110101283A1
公开(公告)日：2011-05-05
申请号：US12813749
申请日：2010-06-11
Applicant: Chun-An Lu , Hong-Ching Lin
Inventor： Chun-An Lu , Hong-Ching Lin
CPC classification number: H01B1/22 , C08K9/04 , C09D5/24 , C09D7/62 , C09D7/70 , C09D11/52 , H01B1/24
Abstract: An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10−3Ω·cm.
Abstract translation: 提供导电组合物及其制造方法。 导电结构包括主要导电材料和分散在主要导电材料周围的能量输送特性的导电填料。 该方法包括将主要导电材料与能量输送特性的导电填料混合以形成混合物，将混合物涂覆在基底上，向混合物施加第二能量源，同时施加第一能量来烧结主导电 材料以形成电阻率小于10×10-3＆OHgr·cm的导电组合物。
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Patent Agency Ranking
公开(公告)号：US08911821B2
公开(公告)日：2014-12-16
申请号：US12563419
申请日：2009-09-21
Applicant: Chun-An Lu , Hong-Ching Lin , Kuo-Chan Chiou , Szu-Po Huang
Inventor： Chun-An Lu , Hong-Ching Lin , Kuo-Chan Chiou , Szu-Po Huang
CPC classification number: B22F9/30 , B22F1/025 , B22F2998/00 , C01G1/02 , C01P2002/72 , C01P2006/40 , C09D11/52 , B22F2301/10 , B22F2301/052 , B22F2301/15 , B22F2301/25 , B22F2301/205 , B22F2301/30 , B22F2301/35
Abstract: A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.
Abstract translation: 提供了形成纳米级点状材料的方法。 该方法包括提供亚微米级材料和金属有机化合物。 亚微米级材料和金属有机化合物在溶剂中混合。 然后，金属有机化合物通过热分解过程分解，并在亚微米级材料上还原形成多个纳米级点状材料，其中亚微米级材料和纳米级点状材料 是异源材料。 然后，使多个纳米级点状材料熔化，使得多个相邻的亚微米级材料彼此连接，以形成亚微米级材料之间的连续界面。
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7.发明授权Radio frequency identification tag and diaper, absorber and sensing system using the same 有权射频识别标签和尿布，吸收器和感应系统使用相同公开(公告)号：US09160054B2
公开(公告)日：2015-10-13
申请号：US13524192
申请日：2012-06-15
Applicant: Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
Inventor： Jiun-Jang Yu , Chiung-Hsiung Chen , Chun-An Lu , Hong-Ching Lin
CPC classification number: H01Q1/2225 , H01Q1/273 , H01Q9/285
Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.
Abstract translation: 提供了包括基板，平面天线，RF芯片，多个信号导体和多个接地导体的射频（RF）识别标签。 RF芯片从平面天线接收RF信号以产生识别码。 信号导体耦合到平面天线。 在信号导体的两个相对侧交织的接地导体和信号导体彼此相邻并且设置在基板上以形成包括阻抗匹配部分和透射部分的共面波导结构。 阻抗匹配部分具有耦合到信号导体的输入端和耦合到接地导体的接地平面。 RF芯片设置在输入端和接地平面之间。 传输部分连接在阻抗匹配部分和平面天线之间。
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8.发明授权Method for enhancing thermotolerance of plant relating to exportin1A and genetic engineering applications thereof 有权提高植物耐热性的方法，涉及出口1A及其遗传工程应用公开(公告)号：US08962919B2
公开(公告)日：2015-02-24
申请号：US13050971
申请日：2011-03-18
Applicant: Shaw-Jye Wu , Lian-Chin Wang , Shin-Jye Wu , Ching-Hui Yeh , Chun-An Lu
Inventor： Shaw-Jye Wu , Lian-Chin Wang , Shin-Jye Wu , Ching-Hui Yeh , Chun-An Lu
IPC: C12N15/82
CPC classification number: C12N15/8271
Abstract: A method for providing thermotolerance of a plant and the genetic engineering applications thereof are disclosed. DNA fragment containing a gene encoding EXPORTIN1A is transferred into a plant cell to provide or enhance thermotolerance of the plant. The method can be applied in genetic engineering to select transgenic plant.
Abstract translation: 公开了一种提供植物耐热性的方法及其遗传工程应用。 将含有编码EXPORTIN1A的基因的DNA片段转移到植物细胞中以提供或增强植物的耐热性。 该方法可用于遗传工程中，以选择转基因植物。
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9.发明申请公开(公告)号：US20120168211A1
公开(公告)日：2012-07-05
申请号：US13221414
申请日：2011-08-30
Applicant: Chun-An LU , Hong-Ching LIN , Shih-Ming CHEN , Wen-Pin TING
Inventor： Chun-An LU , Hong-Ching LIN , Shih-Ming CHEN , Wen-Pin TING
CPC classification number: H05K3/386 , B82Y30/00 , H05K1/0393 , H05K1/097 , H05K2201/0209 , H05K2201/0257
Abstract: A substrate assembly containing a conductive film and a fabrication method thereof are provided. The substrate assembly includes a polymer substrate, a surface treatment layer formed on the polymer substrate and a conductive film formed on the surface treatment layer, wherein the conductive film is formed by sintering a metal conductive ink and the surface treatment layer is formed from a composite material of an auxiliary filler and a polymer. The auxiliary filler in the surface treatment layer can deliver energy into the metal conductive ink for sintering the conductive metal ink.
Abstract translation: 提供一种含有导电膜的基板组件及其制造方法。 基板组件包括聚合物基板，形成在聚合物基板上的表面处理层和形成在表面处理层上的导电膜，其中导电膜通过烧结金属导电油墨形成，并且表面处理层由复合材料形成 辅助填料和聚合物的材料。 表面处理层中的辅助填料可将能量输送到用于烧结导电金属油墨的金属导电油墨中。
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公开(公告)号：US20100270516A1
公开(公告)日：2010-10-28
申请号：US12563419
申请日：2009-09-21
Applicant: Chun-An LU , Hong-Ching LIN , Kuo-Chan CHIOU , Szu-Po HUANG
Inventor： Chun-An LU , Hong-Ching LIN , Kuo-Chan CHIOU , Szu-Po HUANG
IPC: H01B1/12
CPC classification number: B22F9/30 , B22F1/025 , B22F2998/00 , C01G1/02 , C01P2002/72 , C01P2006/40 , C09D11/52 , B22F2301/10 , B22F2301/052 , B22F2301/15 , B22F2301/25 , B22F2301/205 , B22F2301/30 , B22F2301/35
Abstract: A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.
Abstract translation: 提供了形成纳米级点状材料的方法。 该方法包括提供亚微米级材料和金属有机化合物。 亚微米级材料和金属有机化合物在溶剂中混合。 然后，金属有机化合物通过热分解过程分解，并在亚微米级材料上还原形成多个纳米级点状材料，其中亚微米级材料和纳米级点状材料 是异源材料。 然后，使多个纳米级点状材料熔化，使得多个相邻的亚微米级材料彼此连接，以形成亚微米级材料之间的连续界面。
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