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公开(公告)号：US06747784B2
公开(公告)日：2004-06-08
申请号：US10126972
申请日：2002-04-22
IPC分类号： G02B2600
CPC分类号： B81B3/0021 , A61K38/00 , A61K39/08 , B81B2201/047 , B81B2203/053 , B81B2203/058 , C07K14/33 , C07K2319/00 , G02B6/3572 , G02B6/358 , G02B6/3584 , G02B6/3656 , G02B6/3692 , G02B6/4226 , G02B26/001 , G02B26/02 , G02B26/0841 , G02B2006/12104
摘要： The present invention provides a compliant mechanism that can be used to make a variety of devices, such as tunable optical devices, that are more reliable, more cost effective, and/or exhibit better performance than prior art devices. In one embodiment, the complaint mechanism includes an island that is suspended from a frame using a compliant member that is attached to the frame and the island. Individual actuators and/or sensor elements may be placed on the island, so that each island may be individually actuated or sensed.
摘要翻译： 本发明提供了一种柔性机构，其可用于制造比现有技术装置更可靠，更具成本效益和/或表现出更好性能的各种装置，例如可调光学装置。 在一个实施例中，投诉机构包括使用附接到框架和岛屿的顺应构件从框架悬挂的岛。 单独的致动器和/或传感器元件可以被放置在岛上，使得每个岛可以被单独地致动或感测。
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公开(公告)号：US6012336A
公开(公告)日：2000-01-11
申请号：US206693
申请日：1998-12-07
CPC分类号： G01L9/0073 , B81C1/00246 , B81B2201/0264 , B81C2203/0728
摘要： A microelectromechanical (MEM) capacitance pressure sensor integrated with electronic circuitry on a common substrate and a method for forming such a device are disclosed. The MEM capacitance pressure sensor includes a capacitance pressure sensor formed at least partially in a cavity etched below the surface of a silicon substrate and adjacent circuitry (CMOS, BiCMOS, or bipolar circuitry) formed on the substrate. By forming the capacitance pressure sensor in the cavity, the substrate can be planarized (e.g. by chemical-mechanical polishing) so that a standard set of integrated circuit processing steps can be used to form the electronic circuitry (e.g. using an aluminum or aluminum-alloy interconnect metallization).
摘要翻译： 公开了一种与公共衬底上的电子电路集成的微机电（MEM）电容压力传感器和用于形成这种器件的方法。 MEM电容压力传感器包括至少部分地形成在蚀刻在硅衬底的表面下方的空腔中的电容压力传感器和形成在衬底上的相邻电路（CMOS，BiCMOS或双极电路）。 通过在空腔中形成电容压力传感器，衬底可以被平坦化（例如通过化学机械抛光），使得可以使用标准的集成电路处理步骤来形成电子电路（例如使用铝或铝合金 互连金属化）。
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3.发明授权Methods of making mechanisms in which relative locations of elements are maintained during manufacturing 失效制造机构的方法，其中在制造期间保持元件的相对位置公开(公告)号：US06678084B2
公开(公告)日：2004-01-13
申请号：US10124716
申请日：2002-04-18
IPC分类号： G02B2600
CPC分类号： B81B3/0021 , B81B2201/047 , B81B2203/053 , B81B2203/058 , B81C99/008 , G02B6/3512 , G02B6/3522 , G02B6/3526 , G02B6/3528 , G02B6/3534 , G02B6/357 , G02B6/3572 , G02B6/3574 , G02B6/358 , G02B6/3584 , G02B6/362 , G02B6/3692 , G02B6/4226 , G02B26/001 , G02B26/02 , G02B26/0841 , G02B2006/12104
摘要： The present invention provides method of making mechanisms in which the relative locations of elements are maintained during manufacturing. The methods according to the present invention can be used to make a variety of devices, including tunable optical devices. The methods include displaceably attaching an island (support) to a frame with a non-rigid material.
摘要翻译： 本发明提供了制造机构的方法，其中在制造期间保持元件的相对位置。 根据本发明的方法可以用于制造包括可调光学装置在内的各种装置。 这些方法包括用非刚性材料可移动地将岛（支撑件）附接到框架。
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公开(公告)号：US06665109B2
公开(公告)日：2003-12-16
申请号：US10085143
申请日：2002-03-01
IPC分类号： G02B2600
CPC分类号： G02B26/0841 , B81B3/0021 , B81B2201/047 , B81B2203/053 , B81B2203/058 , G02B6/3512 , G02B6/3522 , G02B6/3526 , G02B6/3528 , G02B6/3534 , G02B6/357 , G02B6/3572 , G02B6/3574 , G02B6/358 , G02B6/3584 , G02B6/4226 , G02B26/001 , G02B26/02 , G02B2006/12104
摘要： The present invention provides a compliant mechanism that can be used to make a variety of devices, such as tunable optical devices that are more reliable, more cost effective and/or exhibit better performance than prior art devices.
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