Infrared detector with extended spectral response in the visible field
    1.
    发明授权
    Infrared detector with extended spectral response in the visible field 有权
    红外探测器在可见光场中具有延长的光谱响应

    公开(公告)号:US08610171B2

    公开(公告)日:2013-12-17

    申请号:US13139238

    申请日:2009-12-08

    CPC classification number: H01L31/105 H01L31/03046 Y02E10/544 Y02P70/521

    Abstract: A semiconductor-based SWIR infrared detector sensitive to wavelengths shorter than about 2.5 microns comprises a stack of semiconductor layers based on III-V materials forming a PIN photodiode. The stack includes a naked electrical contact, called a lower electrical contact, serving as an optical window; and a detection layer sensitive to said wavelengths. The lower contact comprises at least one layer of indirect-bandgap III-V material(s) doped n-type, pseudomorphic or lattice matched with a substrate intended to serve as a temporary substrate possibly being made of a III-V material such as InP or GaAs or of silicon or germanium.

    Abstract translation: 对于短于约2.5微米的波长敏感的基于半导体的SWIR红外检测器包括基于形成PIN光电二极管的III-V材料的堆叠的半导体层。 堆叠包括用作光学窗口的称为下部电触点的裸电触点; 以及对所述波长敏感的检测层。 下接触包括至少一层掺杂n型,假晶格或晶格匹配的间接带隙III-V材料,该衬底旨在用作可能由III-V材料制成的临时衬底,例如InP 或GaAs或硅或锗。

    INFRARED DETECTOR WITH EXTENDED SPECTRAL RESPONSE IN THE VISIBLE FIELD
    2.
    发明申请
    INFRARED DETECTOR WITH EXTENDED SPECTRAL RESPONSE IN THE VISIBLE FIELD 有权
    红外探测器在可视场中具有扩展的光谱响应

    公开(公告)号:US20110248316A1

    公开(公告)日:2011-10-13

    申请号:US13139238

    申请日:2009-12-08

    CPC classification number: H01L31/105 H01L31/03046 Y02E10/544 Y02P70/521

    Abstract: A semiconductor-based SWIR infrared detector sensitive to wavelengths shorter than about 2.5 microns comprises a stack of semiconductor layers based on III-V materials forming a PIN photodiode. The stack includes a naked electrical contact, called a lower electrical contact, serving as an optical window; and a detection layer sensitive to said wavelengths. The lower contact comprises at least one layer of indirect-bandgap III-V material(s) doped n-type, pseudomorphic or lattice matched with a substrate intended to serve as a temporary substrate possibly being made of a III-V material such as InP or GaAs or of silicon or germanium.

    Abstract translation: 对于短于约2.5微米的波长敏感的基于半导体的SWIR红外检测器包括基于形成PIN光电二极管的III-V材料的堆叠的半导体层。 堆叠包括用作光学窗口的称为下部电触点的裸电触点; 以及对所述波长敏感的检测层。 下接触包括至少一层掺杂n型,假晶格或晶格匹配的间接带隙III-V材料,该衬底旨在用作可能由III-V材料制成的临时衬底,例如InP 或GaAs或硅或锗。

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