公开(公告)号：US20080142375A1

公开(公告)日：2008-06-19

申请号：US11864254

申请日：2007-09-28

Applicant: Francois Doniat ,  Matthew L. Fisher ,  Alan D. Zdunek ,  Alexandro A. Barajas ,  Ian Suni ,  Xiangfeng Chu ,  Abhinav Tripathi ,  Yuzhuo Li

Inventor： Francois Doniat ,  Matthew L. Fisher ,  Alan D. Zdunek ,  Alexandro A. Barajas ,  Ian Suni ,  Xiangfeng Chu ,  Abhinav Tripathi ,  Yuzhuo Li

IPC: B23H3/00

CPC classification number: C09G1/02 ,  C25F3/30 ,  H01L21/32125

Abstract: Compositions and methods suitable for the electrochemical mechanical planarization of a conductive material layer on a semiconductor workpiece. Compositions contain a phosphonic acid based electrolyte, a corrosion inhibitor, a chelating agent, a pH adjusting agent, and a solvent as the remainder.

Abstract translation: 适用于半导体工件上导电材料层的电化学机械平面化的组合物和方法。 组合物含有基于膦酸的电解质，腐蚀抑制剂，螯合剂，pH调节剂和作为其余的溶剂。