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公开(公告)号:US20080142375A1
公开(公告)日:2008-06-19
申请号:US11864254
申请日:2007-09-28
申请人: Francois Doniat , Matthew L. Fisher , Alan D. Zdunek , Alexandro A. Barajas , Ian Suni , Xiangfeng Chu , Abhinav Tripathi , Yuzhuo Li
发明人: Francois Doniat , Matthew L. Fisher , Alan D. Zdunek , Alexandro A. Barajas , Ian Suni , Xiangfeng Chu , Abhinav Tripathi , Yuzhuo Li
IPC分类号: B23H3/00
CPC分类号: C09G1/02 , C25F3/30 , H01L21/32125
摘要: Compositions and methods suitable for the electrochemical mechanical planarization of a conductive material layer on a semiconductor workpiece. Compositions contain a phosphonic acid based electrolyte, a corrosion inhibitor, a chelating agent, a pH adjusting agent, and a solvent as the remainder.
摘要翻译: 适用于半导体工件上导电材料层的电化学机械平面化的组合物和方法。 组合物含有基于膦酸的电解质,腐蚀抑制剂,螯合剂,pH调节剂和作为其余的溶剂。