利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

13 条记录 (耗时 0.013 秒)

    METALLIC FRAME STRUCTURE AND LED DEVICE HAVING THE SAME
    5.
    发明申请
    METALLIC FRAME STRUCTURE AND LED DEVICE HAVING THE SAME 有权
    金属框架结构和具有该结构的LED器件

    公开(公告)号：US20130256733A1

    公开(公告)日：2013-10-03

    申请号：US13620556

    申请日：2012-09-14

    申请人： CHEN-HSIU LIN ,  YI-CHIEN CHANG

    发明人： CHEN-HSIU LIN ,  YI-CHIEN CHANG

    IPC分类号： H01L33/62 ,  H01L23/495

    CPC分类号： H01L33/62 ,  H01L23/49562 ,  H01L2224/48091 ,  H01L2933/0066 ,  H01L2924/00014

    摘要： The present invention relates to an LED device, which includes a metallic frame, an LED chip, and a packaging body. The metallic frame includes a first lead frame and a second lead frame. The first lead frame has a protruding portion extending toward the second lead frame, while the second lead frame has a notch formed correspondingly to the protruding portion. An electrically insulated region is cooperatively defined by the first and second lead frames. The metallic frame defines at least one blind hole in proximate to the electrically insulated region. The LED chip is electrically connected to the first and second lead frames. The packaging body has a base portion encapsulating the metallic frame and a light-permitting portion arranged above the LED chip.

    摘要翻译： 本发明涉及一种LED器件，其包括金属框架，LED芯片和封装体。 金属框架包括第一引线框架和第二引线框架。 第一引线框架具有朝向第二引线框架延伸的突出部分，而第二引线框架具有对应于突出部分形成的凹口。 电绝缘区域由第一引线框架和第二引线框架协同地限定。 金属框架在电绝缘区域附近限定了至少一个盲孔。 LED芯片电连接到第一和第二引线框架。 包装体具有封装金属框架的基部和布置在LED芯片上方的允许光的部分。

    LIGHT-EMITTING DIODE DEVICE
    6.
    发明申请
    LIGHT-EMITTING DIODE DEVICE 有权
    发光二极管装置

    公开(公告)号：US20130105835A1

    公开(公告)日：2013-05-02

    申请号：US13558557

    申请日：2012-07-26

    申请人： CHIA-HAO WU ,  CHEN-HSIU LIN ,  MING-KUN WENG ,  YI-CHIEN CHANG

    发明人： CHIA-HAO WU ,  CHEN-HSIU LIN ,  MING-KUN WENG ,  YI-CHIEN CHANG

    IPC分类号： H01L33/08

    CPC分类号： H01L25/0753 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/505 ,  H01L33/58 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light-emitting diode device includes: a substrate; an upper metal film disposed on an upper surface of the substrate, and including a chip-mounting region and a plurality of conductive pad regions; two first light-emitting chips and two second light-emitting chips disposed on the chip-mounting region, the first and second light-emitting chips being disposed alternately, two of the first and second light-emitting chips being opposite to each other; a fluorescent layer coated on the first light-emitting chips; and a lens disposed on the substrate to cover the first and second light-emitting chips and the fluorescent layer.

    摘要翻译： 发光二极管装置包括：基板; 上金属膜，其设置在所述基板的上表面上，并且包括芯片安装区域和多个导电焊盘区域; 两个第一发光芯片和设置在芯片安装区域上的两个第二发光芯片，第一和第二发光芯片交替布置，第一和第二发光芯片中的两个彼此相对; 涂覆在第一发光芯片上的荧光层; 以及设置在基板上以覆盖第一和第二发光芯片和荧光层的透镜。