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    Metallic frame structure and LED device having the same
    1.
    发明授权
    Metallic frame structure and LED device having the same 有权
    金属框架结构和具有相同的LED装置

    公开(公告)号：US08829561B2

    公开(公告)日：2014-09-09

    申请号：US13620556

    申请日：2012-09-14

    申请人： Chen-Hsiu Lin ,  Yi-Chien Chang

    发明人： Chen-Hsiu Lin ,  Yi-Chien Chang

    IPC分类号： H01L33/62

    CPC分类号： H01L33/62 ,  H01L23/49562 ,  H01L2224/48091 ,  H01L2933/0066 ,  H01L2924/00014

    摘要： The present invention relates to an LED device, which includes a metallic frame, an LED chip, and a packaging body. The metallic frame includes a first lead frame and a second lead frame. The first lead frame has a protruding portion extending toward the second lead frame, while the second lead frame has a notch formed correspondingly to the protruding portion. An electrically insulated region is cooperatively defined by the first and second lead frames. The metallic frame defines at least one blind hole in proximate to the electrically insulated region. The LED chip is electrically connected to the first and second lead frames. The packaging body has a base portion encapsulating the metallic frame and a light-permitting portion arranged above the LED chip.

    摘要翻译： 本发明涉及一种LED器件，其包括金属框架，LED芯片和封装体。 金属框架包括第一引线框架和第二引线框架。 第一引线框架具有朝向第二引线框架延伸的突出部分，而第二引线框架具有对应于突出部分形成的凹口。 电绝缘区域由第一引线框架和第二引线框架协同地限定。 金属框架在电绝缘区域附近限定至少一个盲孔。 LED芯片电连接到第一和第二引线框架。 包装体具有封装金属框架的基部和布置在LED芯片上方的允许光的部分。

    Light-emitting diode device
    2.
    发明授权
    Light-emitting diode device 有权
    发光二极管装置

    公开(公告)号：US08729586B2

    公开(公告)日：2014-05-20

    申请号：US13558557

    申请日：2012-07-26

    申请人： Chia-Hao Wu ,  Chen-Hsiu Lin ,  Ming-Kun Weng ,  Yi-Chien Chang

    发明人： Chia-Hao Wu ,  Chen-Hsiu Lin ,  Ming-Kun Weng ,  Yi-Chien Chang

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0753 ,  F21Y2113/17 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/505 ,  H01L33/58 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light-emitting diode device includes: a substrate; an upper metal film disposed on an upper surface of the substrate, and including a chip-mounting region and a plurality of conductive pad regions; two first light-emitting chips and two second light-emitting chips disposed on the chip-mounting region, the first and second light-emitting chips being disposed alternately, two of the first and second light-emitting chips being opposite to each other; a fluorescent layer coated on the first light-emitting chips; and a lens disposed on the substrate to cover the first and second light-emitting chips and the fluorescent layer.

    摘要翻译： 发光二极管装置包括：基板; 上金属膜，其设置在所述基板的上表面上，并且包括芯片安装区域和多个导电焊盘区域; 两个第一发光芯片和设置在芯片安装区域上的两个第二发光芯片，第一和第二发光芯片交替布置，第一和第二发光芯片中的两个彼此相对; 涂覆在第一发光芯片上的荧光层; 以及设置在基板上以覆盖第一和第二发光芯片和荧光层的透镜。

    Lead frame unit, package structure and light emitting diode device having the same
    3.
    发明授权
    Lead frame unit, package structure and light emitting diode device having the same 有权
    引线框架单元，封装结构和具有该引线框架单元的发光二极管器件

    公开(公告)号：US08569777B2

    公开(公告)日：2013-10-29

    申请号：US12588601

    申请日：2009-10-21

    申请人： Chen-Hsiu Lin

    发明人： Chen-Hsiu Lin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/45099

    摘要： A package structure is adapted for mounting at least one light emitting diode (LED) die. The package structure includes an insulating housing, and a lead frame unit including two spaced-apart conductive bodies. Each of the conductive bodies has opposite first and second conductive terminals spaced-apart from each other along an axial direction. The first conductive terminals extend into the insulating housing. The second conductive terminals are exposed outwardly of the insulating housing. Each of the conductive bodies further has two side edges spaced-apart from each other along a transverse direction perpendicular to the axial direction, and a concave-convex structure disposed at the side edges and surrounded by the insulating housing.

    摘要翻译： 封装结构适于安装至少一个发光二极管（LED）裸片。 封装结构包括绝缘壳体和包括两个间隔开的导电体的引线框架单元。 每个导电体具有沿轴向方向彼此间隔开的相对的第一和第二导电端子。 第一导电端子延伸到绝缘壳体中。 第二导电端子暴露在绝缘壳体的外部。 每个导电体还具有沿着与轴向垂直的横向方向彼此间隔开的两个侧边缘，以及设置在侧边缘处并被绝缘壳体包围的凹凸结构。

    Lead frame assembly, lead frame and insulating housing combination, and led module having the same
    6.
    发明申请
    Lead frame assembly, lead frame and insulating housing combination, and led module having the same 有权
    引线框架组合，引线框架和绝缘外壳组合，以及具有相同功能的LED模块

    公开(公告)号：US20100072509A1

    公开(公告)日：2010-03-25

    申请号：US12585715

    申请日：2009-09-23

    申请人： Shih-Chung Huang ,  Chen-Hsiu Lin ,  Meng-Sung Chou

    发明人： Shih-Chung Huang ,  Chen-Hsiu Lin ,  Meng-Sung Chou

    IPC分类号： H01L33/00 ,  H01L23/495

    CPC分类号： H01L23/49537 ,  H01L24/48 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A unitary lead frame assembly having a plurality of lead frame sets each comprises a first lead frame unit. The first lead frame unit has a pair of first and second frame portions extending along a first direction and spaced apart from each other along a second direction different from the first direction. The lead frame set further comprises at least two second lead frame units disposed between the first and second frame portions and spaced apart from each other along the second direction. Each of the second lead frame units cooperates with the first lead frame unit to define at least one first die-bonding area therebetween.

    摘要翻译： 具有多个引线框组的单一引线框架组件每个包括第一引线框架单元。 第一引线框架单元具有沿着第一方向延伸并沿着不同于第一方向的第二方向彼此间隔开的一对第一和第二框架部分。 引线框组还包括设置在第一和第二框架部分之间并沿着第二方向彼此间隔开的至少两个第二引线框架单元。 每个第二引线框架单元与第一引线框架单元配合以限定其间的至少一个第一管芯接合区域。

    Semiconductor light-emitting device
    7.
    发明申请
    Semiconductor light-emitting device 有权
    半导体发光装置

    公开(公告)号：US20090242915A1

    公开(公告)日：2009-10-01

    申请号：US12230193

    申请日：2008-08-26

    申请人： Chien-Lin Chang Chien ,  Hung-Yuan Su ,  Chen-Hsiu Lin

    发明人： Chien-Lin Chang Chien ,  Hung-Yuan Su ,  Chen-Hsiu Lin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/507 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A semiconductor light-emitting device includes: a hollow body including a bottom wall and a surrounding wall cooperating with the bottom wall to define an encapsulant-receiving recess, the bottom wall being formed with a through-hole, the surrounding wall having a diffuse surface that surrounds the encapsulant-receiving recess; a heat-dissipating body provided on a bottom side of the bottom wall and covering the through-hole in the bottom wall; a light-emitting chip disposed in the through-hole in the bottom wall; a transparent encapsulant filling the encapsulant-receiving recess and the through-hole; and a wavelength-converting layer covering the transparent encapsulant.

    摘要翻译： 一种半导体发光装置，包括：中空体，其包括与所述底壁配合的底壁和周壁，以限定密封剂容纳凹部，所述底壁形成有通孔，所述周壁具有漫射面 围绕所述密封剂容纳凹部; 散热体，设置在底壁的底侧并覆盖底壁中的通孔; 布置在底壁中的通孔中的发光芯片; 填充所述密封剂容纳凹部和所述通孔的透明密封剂; 以及覆盖透明密封剂的波长转换层。

    METHOD OF MANUFACTURING AN OPTICAL MODULE
    8.
    发明申请
    METHOD OF MANUFACTURING AN OPTICAL MODULE 失效
    制造光学模块的方法

    公开(公告)号：US20070059867A1

    公开(公告)日：2007-03-15

    申请号：US11307102

    申请日：2006-01-24

    申请人： Cheng-Chung Kuo ,  Ho-Feng Chiu ,  Jen-Chun Weng ,  Chen-Hsiu Lin

    发明人： Cheng-Chung Kuo ,  Ho-Feng Chiu ,  Jen-Chun Weng ,  Chen-Hsiu Lin

    IPC分类号： H01L21/82

    CPC分类号： G02B6/43 ,  G02B6/12004 ,  G06F3/0317

    摘要： Manufacturing an optical module includes providing a frame, attaching a light-emitting diode chip and a sensor chip to the frame, and forming overcoats on the light-emitting diode chip and the sensor chip. Each of the overcoats includes a lens. The overcoats can prevent internal chips from being damaged and suffering dust contamination during manufacture.

    摘要翻译： 制造光学模块包括提供框架，将发光二极管芯片和传感器芯片附接到框架，以及在发光二极管芯片和传感器芯片上形成外涂层。 每个大衣包括一个镜头。 大面积可以防止内部芯片在制造过程中受到损坏和灰尘污染。

    Package structure and LED package structure
    9.
    发明授权
    Package structure and LED package structure 有权
    封装结构和LED封装结构

    公开(公告)号：US08729681B2

    公开(公告)日：2014-05-20

    申请号：US12889875

    申请日：2010-09-24

    申请人： Chen-Hsiu Lin ,  Chih-Chiang Kao

    发明人： Chen-Hsiu Lin ,  Chih-Chiang Kao

    IPC分类号： H01L23/495

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： A package structure includes a base unit, a pin unit and a housing unit. The base unit has a carrier member and a through hole penetrating through the carrier member, and at least one annular structure is formed in the through hole. The pin unit has a plurality of conductive pins disposed beside the carrier member. The housing unit has an annular housing encircling the carrier member to envelop one part thereof and connecting to the pin unit, and the annular housing is partially filled into the through hole to cover the annular structure. Therefore, the instant disclosure can increase the bonding force between the carrier member and the annular housing and retard external moisture to permeate through slits between the carrier member and the annular housing to intrude into the chip-mounting region, thus the reliability and the usage life are increased.

    摘要翻译： 封装结构包括基座单元，引脚单元和外壳单元。 基座单元具有承载构件和穿过承载构件的通孔，并且在通孔中形成至少一个环形结构。 销单元具有设置在承载构件旁边的多个导电销。 壳体单元具有围绕载体构件的环形壳体，以包围其一部分并连接到销单元，并且环形壳体部分地填充到通孔中以覆盖环形结构。 因此，本公开可以增加载体构件和环形壳体之间的结合力并且阻止外部水分渗透通过载体构件和环形壳体之间的狭缝以侵入芯片安装区域，从而可靠性和使用寿命 增加了。