公开(公告)号：US06886060B2

公开(公告)日：2005-04-26

申请号：US10392819

申请日：2003-03-21

Applicant: Wei-Jen Wang ,  Ping-Hui Shu ,  Wen-Che Liu ,  Long-Tai Chen ,  Ya-Wen Wu

Inventor： Wei-Jen Wang ,  Ping-Hui Shu ,  Wen-Che Liu ,  Long-Tai Chen ,  Ya-Wen Wu

IPC: B60K35/00 ,  B60R16/023 ,  G06F3/00 ,  G06F13/00 ,  G06F13/12 ,  G07C5/08

CPC classification number: B60K35/00 ,  B60K2350/945 ,  B60R16/0231 ,  G07C5/0858

Abstract: A computer system for integrating several car electronic devices is proposed. The computer system is installed in a housing, which is of the standard DIN size to be installed in a car dashboard. A computer host is disposed in the housing, and can run at least an operating system or at least a software program. At least an external electronic device is connected to the computer host through a plurality of connection ports disposed on the computer host. A control panel is disposed at the front end of the housing to control the computer host. A display for displaying text or picture information is also connected to the computer host. A touch panel adhering to the display is also provided. Data can be input through contacting the touch panel. The connection ports can connect all electronic devices in a car for integrating and controlling them.

Abstract translation: 提出了一种用于集成多个汽车电子设备的计算机系统。 计算机系统安装在标准DIN尺寸的外壳中，安装在汽车仪表板中。 计算机主机设置在壳体中，并且可以运行至少一个操作系统或至少一个软件程序。 至少外部电子设备通过设置在计算机主机上的多个连接端口连接到计算机主机。 控制面板设置在壳体的前端以控制计算机主机。 用于显示文本或图片信息的显示器也连接到计算机主机。 还提供了附着在显示器上的触摸面板。 数据可以通过触摸面板进行输入。 连接端口可以连接汽车中的所有电子设备，用于集成和控制它们。

公开(公告)号：US08592297B2

公开(公告)日：2013-11-26

申请号：US13328346

申请日：2011-12-16

Applicant: Tung-Ti Yeh ,  Wu-Chang Lin ,  Chung-Yi Huang ,  Ya Wen Wu ,  Hui-Mei Jao ,  Ting-Chun Wang ,  Chia-Hung Chung

Inventor： Tung-Ti Yeh ,  Wu-Chang Lin ,  Chung-Yi Huang ,  Ya Wen Wu ,  Hui-Mei Jao ,  Ting-Chun Wang ,  Chia-Hung Chung

IPC: H01L21/44

CPC classification number: H01L21/02087 ,  H01L21/76802 ,  H01L21/76883

Abstract: A wafer including a substrate, a dielectric layer over the substrate, and a conductive layer over the dielectric layer is disclosed. The substrate has a main portion. A periphery of the dielectric layer and the periphery of the main portion of the substrate are separated by a first distance. A periphery of the conductive layer and the periphery of the main portion of the substrate are separated by a second distance. The second distance ranges from about a value that is 0.5% of a diameter of the substrate less than the first distance to about a value that is 0.5% of the diameter greater than the first distance.

Abstract translation: 公开了一种包括衬底，在衬底上的电介质层和介电层上的导电层的晶片。 基板具有主要部分。 电介质层的周边和基板的主要部分的周边分开第一距离。 导电层的周边和基板的主要部分的周边分开第二距离。 所述第二距离的范围从小于所述第一距离的所述基板的直径的0.5％的值的大约为大于所述第一距离的直径的0.5％的值。

公开(公告)号：US07007118B2

公开(公告)日：2006-02-28

申请号：US10882255

申请日：2004-07-02

Applicant: Ping-Hui Shu ,  Wen-Che Liu ,  Ya-Wen Wu

Inventor： Ping-Hui Shu ,  Wen-Che Liu ,  Ya-Wen Wu

IPC: G06F13/00

CPC classification number: B60K35/00 ,  B60K2350/945 ,  B60R16/0231 ,  G07C5/0858

Abstract: A computer system for integrating several car electronic devices is proposed. The computer system is installed in a housing, which is of the standard DIN size to be installed in a car dashboard. A computer host is disposed in the housing, and can run at least an operating system or at least a software program. At least an external electronic device is connected to the computer host through a plurality of connection ports disposed on the computer host. A control panel is disposed at the front end of the housing to control the computer host. A display for displaying text or picture information is also connected to the computer host. A touch panel adhering to the display is also provided. Data can be input through contacting the touch panel. The connection ports can connect all electronic devices in a car for integrating and controlling them.

Abstract translation: 提出了一种用于集成多个汽车电子设备的计算机系统。 计算机系统安装在标准DIN尺寸的外壳中，安装在汽车仪表板中。 计算机主机设置在壳体中，并且可以运行至少一个操作系统或至少一个软件程序。 至少外部电子设备通过设置在计算机主机上的多个连接端口连接到计算机主机。 控制面板设置在壳体的前端以控制计算机主机。 用于显示文本或图片信息的显示器也连接到计算机主机。 还提供了附着在显示器上的触摸面板。 数据可以通过触摸面板进行输入。 连接端口可以连接汽车中的所有电子设备，用于集成和控制它们。

公开(公告)号：US08993983B2

公开(公告)日：2015-03-31

申请号：US12779779

申请日：2010-05-13

Applicant: Yu-Jen Li ,  Kuo-Chang Cheng ,  Ya-Wen Wu ,  Pei-Chen Yang

Inventor： Yu-Jen Li ,  Kuo-Chang Cheng ,  Ya-Wen Wu ,  Pei-Chen Yang

IPC: G21K5/08 ,  A45D29/00 ,  F26B9/00 ,  F26B3/28

CPC classification number: F26B3/28 ,  A45D29/00 ,  F21V7/00 ,  F21V23/009 ,  F21V23/04 ,  F21V29/61 ,  F26B9/003 ,  G21K5/08

Abstract: Nail gel curing devices emitting ultraviolet light, as well as methods of their making and use are disclosed. The devices are useful for curing, inter alia, acrylic compositions, more particularly, acrylic nail gel compositions, and typically employ ultraviolet and/or visible light emitting diodes (“LED”) to cure such ultraviolet and/or visible light curable nail gel resins.

Abstract translation: 公开了发射紫外光的指甲凝胶固化装置及其制造和使用方法。 这些装置尤其用于丙烯酸组合物，尤其是丙烯酸指甲凝胶组合物的固化，并且通常使用紫外线和/或可见光发光二极管（“LED”）来固化这种紫外线和/或可见光可固化的指甲凝胶树脂 。

公开(公告)号：US08748885B2

公开(公告)日：2014-06-10

申请号：US13371198

申请日：2012-02-10

Applicant: Tung-Ti Yeh ,  Chung-Yi Huang ,  Ya Wen Wu ,  Hui Mei Jao ,  Ting-Chun Wang ,  Shiu-Ko JangJian ,  Chia-Hung Chung

Inventor： Tung-Ti Yeh ,  Chung-Yi Huang ,  Ya Wen Wu ,  Hui Mei Jao ,  Ting-Chun Wang ,  Shiu-Ko JangJian ,  Chia-Hung Chung

IPC: H01L29/12

CPC classification number: H01L21/2007 ,  H01L21/67092 ,  H01L27/1464

Abstract: A semiconductor device including a first wafer assembly having a first substrate and a first oxide layer over the first substrate. The semiconductor device further includes a second wafer assembly having a second substrate and a second oxide layer over the second substrate. The first oxide layer and the second oxide layer are bonded together by van der Waals bonds or covalent bonds. A method of bonding a first wafer assembly and a second wafer assembly including forming a first oxide layer over a first substrate. The method further includes forming a second oxide layer over a second wafer assembly. The method further includes forming van der Waals bonds or covalent bonds between the first oxide layer and the second oxide layer.

Abstract translation: 一种半导体器件，包括具有第一衬底和第一衬底上的第一氧化物层的第一晶片组件。 半导体器件还包括第二晶片组件，其具有第二衬底和在第二衬底上的第二氧化物层。 第一氧化物层和第二氧化物层通过范德华力键或共价键键合在一起。 一种接合第一晶片组件和第二晶片组件的方法，包括在第一衬底上形成第一氧化物层。 该方法还包括在第二晶片组件上形成第二氧化物层。 该方法还包括在第一氧化物层和第二氧化物层之间形成范德华氏键或共价键。

公开(公告)号：US20130207098A1

公开(公告)日：2013-08-15

申请号：US13371198

申请日：2012-02-10

Applicant: Tung-Ti YEH ,  Chung-Yi HUANG ,  Ya Wen WU ,  Hui-Mei JAO ,  Ting-Chun WANG ,  Shiu-Ko JiangJian ,  Chia-Hung CHUNG

Inventor： Tung-Ti YEH ,  Chung-Yi HUANG ,  Ya Wen WU ,  Hui-Mei JAO ,  Ting-Chun WANG ,  Shiu-Ko JiangJian ,  Chia-Hung CHUNG

IPC: H01L29/12

CPC classification number: H01L21/2007 ,  H01L21/67092 ,  H01L27/1464

Abstract: A semiconductor device including a first wafer assembly having a first substrate and a first oxide layer over the first substrate. The semiconductor device further includes a second wafer assembly having a second substrate and a second oxide layer over the second substrate. The first oxide layer and the second oxide layer are bonded together by van der Waals bonds or covalent bonds. A method of bonding a first wafer assembly and a second wafer assembly including forming a first oxide layer over a first substrate. The method further includes forming a second oxide layer over a second wafer assembly. The method further includes forming van der Waals bonds or covalent bonds between the first oxide layer and the second oxide layer.

Abstract translation: 一种半导体器件，包括具有第一衬底和第一衬底上的第一氧化物层的第一晶片组件。 半导体器件还包括第二晶片组件，其具有第二衬底和在第二衬底上的第二氧化物层。 第一氧化物层和第二氧化物层通过范德华力键或共价键键合在一起。 一种接合第一晶片组件和第二晶片组件的方法，包括在第一衬底上形成第一氧化物层。 该方法还包括在第二晶片组件上形成第二氧化物层。 该方法还包括在第一氧化物层和第二氧化物层之间形成范德华氏键或共价键。

公开(公告)号：US20130154060A1

公开(公告)日：2013-06-20

申请号：US13328346

申请日：2011-12-16

Applicant: Tung-Ti YEH ,  Wu-Chang LIN ,  Chung-Yi HUANG ,  Ya Wen WU ,  Hui-Mei JAO ,  Ting-Chun WANG ,  Chia-Hung CHUNG

Inventor： Tung-Ti YEH ,  Wu-Chang LIN ,  Chung-Yi HUANG ,  Ya Wen WU ,  Hui-Mei JAO ,  Ting-Chun WANG ,  Chia-Hung CHUNG

IPC: H01L29/06 ,  H01L21/44

CPC classification number: H01L21/02087 ,  H01L21/76802 ,  H01L21/76883

Abstract: A wafer including a substrate, a dielectric layer over the substrate, and a conductive layer over the dielectric layer is disclosed. The substrate has a main portion. A periphery of the dielectric layer and the periphery of the main portion of the substrate are separated by a first distance. A periphery of the conductive layer and the periphery of the main portion of the substrate are separated by a second distance. The second distance ranges from about a value that is 0.5% of a diameter of the substrate less than the first distance to about a value that is 0.5% of the diameter greater than the first distance.

Abstract translation: 公开了一种包括衬底，在衬底上的电介质层和介电层上的导电层的晶片。 基板具有主要部分。 电介质层的周边和基板的主要部分的周边分开第一距离。 导电层的周边和基板的主要部分的周边分开第二距离。 所述第二距离的范围从小于所述第一距离的所述基板的直径的0.5％的值的大约为大于所述第一距离的直径的0.5％的值。

公开(公告)号：US20110277338A1

公开(公告)日：2011-11-17

申请号：US12779779

申请日：2010-05-13

Applicant: Yu-Jen Li ,  Kuo-Chang Cheng ,  Ya-Wen Wu ,  Pei-Chen Yang

Inventor： Yu-Jen Li ,  Kuo-Chang Cheng ,  Ya-Wen Wu ,  Pei-Chen Yang

IPC: F26B3/34

CPC classification number: F26B3/28 ,  A45D29/00 ,  F21V7/00 ,  F21V23/009 ,  F21V23/04 ,  F21V29/61 ,  F26B9/003 ,  G21K5/08

Abstract: The present invention is related to an UV LED curing apparatus, and more particularly, to an UV LED curing apparatus with improved housing and switch controller. The UV LED curing apparatus of the present invention is preferably provided for curing UV hardening gel applied onto the nails of multiple fingers or toes all at once and with automatic controls; the UV LED curing apparatus comprises a light reflective inner casing enclosing a curing chamber having a front opening, an outer casing detachably attached to the inner casing and an UV LED light source disposed on the inner casing and capable of providing an illumination covering a large space in the curing chamber. The automatic controls of the apparatus may be achieved by a switch controller having a photo interrupter, timer and current regulator such that the UV light from the UV LED light source is triggered to an on-state by the sensor of the photo interrupter and switched to an off-state by the timer and current regulator with reference to a preset curing time automatically. The UV LED light source is preferably to be of a wavelength between 360 nm and 460 nm. The light reflective inner casing is preferably provided as an effective UV light reflector and as a supporting substrate of the UV LED light source while being capable of transmitting heat from the UV LED light source away for further heat dissipation to the ambient by the outer casing. The outer casing is detachably attached to the inner casing and allows a greater user interaction for decorative and entertainment purposes while also being a protective and heat dissipation means.

Abstract translation: 本发明涉及一种UV LED固化装置，更具体地说，涉及具有改进的壳体和开关控制器的UV LED固化设备。 本发明的UV LED固化装置优选地用于固化一次施加到多个手指或脚趾的指甲上并具有自动控制的UV硬化凝胶; UV LED固化装置包括一个光反射内壳，其包围具有前开口的固化室，可拆卸地附接到内壳的外壳和设置在内壳上的UV LED光源，并且能够提供覆盖大空间的照明 在固化室中。 设备的自动控制可以通过具有光电断路器，定时器和电流调节器的开关控制器来实现，使得来自UV LED光源的UV光被光断续器的传感器触发到导通状态，并切换到 参考自动预设的固化时间，定时器和电流调节器关闭状态。 UV LED光源优选为360nm至460nm之间的波长。 光反射内壳优选地设置为有效的UV光反射器，并且作为UV LED光源的支撑基板，同时能够从UV LED光源传输热量，用于通过外壳进一步散热到环境。 外壳可拆卸地附接到内壳，并且为了装饰和娱乐目的而允许更大的用户交互，同时也是保护和散热装置。

公开(公告)号：USD637352S1

公开(公告)日：2011-05-03

申请号：US29361276

申请日：2010-05-08

Applicant: Yu-Jen Li ,  Kuo-Chang Chang ,  Fu-Ju Sheu ,  Szu-Hua Wu ,  Pei-Chen Yang ,  Ya-Wen Wu

Designer： Yu-Jen Li ,  Kuo-Chang Chang ,  Fu-Ju Sheu ,  Szu-Hua Wu ,  Pei-Chen Yang ,  Ya-Wen Wu