Apparatus for removing an insulating layer from a portion of a conductor
    2.
    发明授权
    Apparatus for removing an insulating layer from a portion of a conductor 有权
    用于从导体的一部分去除绝缘层的装置

    公开(公告)号:US06326587B1

    公开(公告)日:2001-12-04

    申请号:US09365353

    申请日:1999-07-30

    IPC分类号: B23K2636

    摘要: An apparatus for using a laser beam to remove or ablate an insulating coating from a desired segment of an insulating coating from a desired segment of an insulated conductor (wire) without damaging or causing mechanical stress to the wire. A lens can be used to focus the laser beam at a focal point and a support to locate the insulated conductor in a position between the lens and the focal point in a path of the laser bean. A reflector can be aligned with the opening so as to reflect the laser beam portion back toward the conductor. The support can include a generally planar coil guide such as a Y-shaped groove.

    摘要翻译: 一种用于使用激光束从绝缘导体(导线)的期望部分去除或消除绝缘涂层的期望部分的绝缘涂层的装置,而不损坏或导致对所述导线的机械应力。 可以使用透镜将激光束聚焦在焦点和支撑件上,以将绝缘导体定位在激光束的路径中的透镜和焦点之间的位置。 反射器可以与开口对准,以便将激光束部分反射回导体。 支撑件可以包括大致平面的线圈引导件,例如Y形槽。

    Method of making implantable lead including laser wire stripping
    3.
    发明授权
    Method of making implantable lead including laser wire stripping 失效
    制造可植入铅的方法,包括激光剥线

    公开(公告)号:US5935465A

    公开(公告)日:1999-08-10

    申请号:US744239

    申请日:1996-11-05

    IPC分类号: H02G1/12 B23K26/00

    摘要: An apparatus and method are disclosed by which a laser beam is used to remove or ablate the insulating coating from a desired segment of an insulated conductor without damaging or causing mechanical stress to the wire, so that the wire can be used to transmit electrical signals to an electrode in a implantable medical device. The invention can be applied to one or more conductors that are coiled coaxially and can be used to expose separate portions of two or more conductors if the insulating coatings thereon are differentiated in a way that causes the separate insulating coatings to respond differently to contact with a laser beam.

    摘要翻译: 公开了一种装置和方法,通过该装置和方法,使用激光束从绝缘导体的期望部分去除或消除绝缘涂层,而不会损伤或引起对导线的机械应力,使得导线可用于将电信号传输到 可植入医疗装置中的电极。 本发明可以应用于一个或多个同轴线圈的导体,并且如果其上的绝缘涂层以使得分离的绝缘涂层不同地响应于与 激光束。

    Method of making implantable lead including laser wire stripping
    4.
    发明授权
    Method of making implantable lead including laser wire stripping 有权
    制造可植入铅的方法,包括激光剥线

    公开(公告)号:US06265691B1

    公开(公告)日:2001-07-24

    申请号:US09346841

    申请日:1999-07-02

    IPC分类号: B23K2600

    摘要: An apparatus and method are disclosed by which a laser beam is used to remove or ablate the insulating coating from a desired segment of an insulated conductor without damaging or causing mechanical stress to the wire, so that the wire can be used to transmit electrical signals to an electrode in a implantable medical device. The invention can be applied to one or more conductors that are coiled coaxially and can be used to expose separate portions of two or more conductors if the insulating coatings thereon are differentiated in a way that causes the separate insulating coatings to respond differently to contact with a laser beam.

    摘要翻译: 公开了一种装置和方法,通过该装置和方法,使用激光束从绝缘导体的期望部分去除或消除绝缘涂层,而不会损伤或引起对导线的机械应力,使得导线可用于将电信号传输到 可植入医疗装置中的电极。 本发明可以应用于一个或多个同轴线圈的导体,并且如果其上的绝缘涂层以使得分离的绝缘涂层不同地响应于与 激光束。