公开(公告)号：US08641837B2

公开(公告)日：2014-02-04

申请号：US11469648

申请日：2006-09-01

申请人： Yasuhiro Aruga ,  Katsura Kajihara

发明人： Yasuhiro Aruga ,  Katsura Kajihara

IPC分类号： C22C9/06

CPC分类号： C22C9/02 ,  C22C9/06 ,  C22F1/08

摘要： A Cu—Ni—Sn—P alloy is provided, which is excellent in stress relaxation property in a direction perpendicular to a rolling direction, and has any of high strength, high conductivity, and excellent bendability. A copper alloy contains 0.1 to 3.0% of Ni, 0.1 to 3.0% of Sn, and 0.01 to 0.3% of P in mass percent respectively, and includes copper and inevitable impurities as the remainder; wherein in a radial distribution function around a Ni atom according to a XAFS analysis method, a first peak position is within a range of 2.16 to 2.35 Å, the position indicating a distance between a Ni atom in Cu and an atom nearest to the Ni atom. Thus, distances to atoms around the Ni atom in Cu are comparatively increased, so that the stress relaxation property in a direction perpendicular to the rolling direction of the copper alloy is improved.

摘要翻译： 提供了一种Cu-Ni-Sn-P合金，其在与轧制方向垂直的方向上的应力松弛性优异，并且具有高强度，高导电性和优异的弯曲性。 铜合金分别含有0.1〜3.0％的Ni，0.1〜3.0％的Sn和0.01〜0.3％的P，以及其余的铜和不可避免的杂质; 其中，根据XAFS分析方法在围绕Ni原子的径向分布函数中，第一峰位置在2.16〜2.35的范围内，该位置表示Cu中的Ni原子和最接近Ni原子的原子之间的距离 。 因此，Cu中的Ni原子周围的原子的距离相对增加，从而提高了与铜合金的轧制方向垂直的方向上的应力松弛性。

公开(公告)号：US08444777B2

公开(公告)日：2013-05-21

申请号：US12529030

申请日：2008-02-20

申请人： Hideo Hata ,  Katsura Kajihara ,  Shigenobu Namba ,  Hiroyuki Takeda ,  Mamoru Nagao

发明人： Hideo Hata ,  Katsura Kajihara ,  Shigenobu Namba ,  Hiroyuki Takeda ,  Mamoru Nagao

IPC分类号： C22C21/10 ,  B22D23/00

CPC分类号： B22D21/007 ,  C22C1/0416 ,  C22C21/10 ,  C22F1/002 ,  C22F1/053

摘要： An object of the present invention is to provide an Al—Zn—Mg—Cu 7000-series Al alloy having high ductility as well as having high strength. For attaining this purpose, an Al alloy having a structure in which an inclusion is not included is produced by reducing an amount of oxygen contained in an Al alloy that is obtained by solidifying a preform resulting from rapid solidification by preferably spray forming a molten metal of an Al—Zn—Mg—Cu 7000-series Al alloy with an inert gas. This Al alloy has, as mechanical properties at an ordinary temperature, a tensile strength of 600 MPa or more, and an elongation of 15% or more when the tensile strength is from 600 MPa or more and less than 800 MPa or an elongation of 10% or more when the tensile strength is 800 MPa or more, and is excellent in cold workability such as rollability.

摘要翻译： 本发明的目的是提供具有高延展性和高强度的Al-Zn-Mg-Cu 7000系Al合金。 为了达到这个目的，通过减少Al合金中所含的氧的量，通过使由快速凝固而形成的预成型体固化而得到的氧的量优选地喷射形成熔融金属 具有惰性气体的Al-Zn-Mg-Cu 7000系Al合金。 当该拉伸强度为600MPa以上且小于800MPa时，拉伸强度为600MPa以上，伸长率为15％以上时，作为常温下的机械特性， 拉伸强度为800MPa以上时的％以上，冷加工性，例如滚动性优异。

公开(公告)号：US20090116996A1

公开(公告)日：2009-05-07

申请号：US11916730

申请日：2006-06-08

申请人： Yasuhiro Aruga ,  Koya Nomura ,  Katsura Kajihara ,  Yukio Sugishita ,  Hiroshi Sakamoto

发明人： Yasuhiro Aruga ,  Koya Nomura ,  Katsura Kajihara ,  Yukio Sugishita ,  Hiroshi Sakamoto

IPC分类号： C22C9/02 ,  C22C9/06

CPC分类号： C22C9/06 ,  C22C9/02 ,  C22F1/08

摘要： A copper alloy with an excellent stress relaxation resistance including Ni: 0.1 through 3.0 mass %, Sn: 0.01 through 3.0 mass %, P: 0.01 through 0.3 mass % and remainder copper and inevitable impurities, and the Ni content in extracted residues separated and left on a filter having filter mesh size of 0.1 μm by using an extracted residues method accounting for 40 mass % or less of the Ni content in the copper alloy, wherein the extracted residues method requires that 10 g of the copper alloy is immersed in 300 ml of a methanol solution which contains 10 mass % of ammonium acetate, and using the copper alloy as the anode and platinum as the cathode, constant-current electrolysis is performed at the current density of 10 mA/cm2, and the solution in which the copper alloy is thus dissolved is subjected to suction filtration using a membrane filter of polycarbonate whose filter mesh size is 0.1 μm, thereby separating and extracting undissolved residues on said filter, and the Ni content in the extracted residues is identified through analysis by ICP after dissolving said undissolved residues separated and left on said filter into a solution prepared by mixing aqua regia and water at the ratio of 1:1.

摘要翻译： 具有Ni：0.1〜3.0质量％，Sn：0.01〜3.0质量％，P：0.01〜0.3质量％，Cu和不可避免的杂质的余量为好的耐应力松弛性的铜合金，残渣分离残留的Ni含量 通过使用在铜合金中的Ni含量为40质量％以下的提取残渣法，在筛网尺寸为0.1μm的过滤器上，其中提取的残渣法要求将10g铜合金浸渍在300ml 的含有10质量％的乙酸铵的甲醇溶液，使用铜合金作为阳极，将铂作为阴极，以10mA / cm 2的电流密度进行恒流电解，将其中的铜 溶解的合金使用过滤网尺寸为0.1μm的聚碳酸酯膜过滤器进行抽滤，由此分离和提取所述过滤器上的未溶解残余物，并且Ni含量 在将所分离的未溶解的残留物溶解在所述过滤器上后，通过ICP分析鉴定提取的残留物，使其以1:1的比例混合王水和水混合制成的溶液。

公开(公告)号：US07125515B2

公开(公告)日：2006-10-24

申请号：US10413158

申请日：2003-04-15

申请人： Yasuhiro Aruga ,  Katsura Kajihara ,  Yasuaki Sugizaki

发明人： Yasuhiro Aruga ,  Katsura Kajihara ,  Yasuaki Sugizaki

IPC分类号： B22D30/00 ,  C22F1/04

CPC分类号： C22C21/00 ,  C22C1/026 ,  C22C32/0073 ,  G21C19/40 ,  G21F1/08

摘要： A aluminum base alloy containing boron and manufacturing method thereof, said alloy exhibiting good mechanical properties (such as high-temperature strength and creep strength) over a long period of time and also having a neutron absorbing capacity owing to boron present therein in the form of a compound without segregation. The alloy contains 0.5–10 mass % of boron with an isotopic element satisfying a relation of 10B/(10B +11B)≦30%. said boron being present in the form of a boron compound which is 300 μm or below in size. The alloy is obtained by melting at a temperature in excess of 950° C. and cast at a temperature in the range of 800° C. to 950° C., in such a way that the molten metal is kept for 60–180° seconds until it cools from 950° C. to the casting temperature.

摘要翻译： 一种含硼的铝基合金及其制造方法，所述合金长时间表现出良好的机械性能（如高温强度和蠕变强度），并且由于其中存在硼的形式的中子吸收能力 没有分离的化合物。 该合金含有0.5-10质量％的硼，其同位素元素满足关系为 ^{10 B /（ 10 B + 11 B） = 30％。 所述硼以硼化合物的形式存在，其尺寸为300μm或更小。 该合金通过在超过950℃的温度下熔融而获得，并且在800℃至950℃的温度范围内铸造，使得熔融金属保持在60-180℃ 秒，直到其从950℃冷却至铸造温度。}

公开(公告)号：US20050161126A1

公开(公告)日：2005-07-28

申请号：US11022785

申请日：2004-12-28

申请人： Yasuhiro Aruga ,  Katsura Kajihara

发明人： Yasuhiro Aruga ,  Katsura Kajihara

IPC分类号： C22C9/00 ,  C22C9/02

CPC分类号： C22C9/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed is a copper alloy containing Fe of 0.01 to 0.5% and P of 0.01 to 0.3% in mass with the balance consisting of copper and unavoidable impurities, wherein the mass content ratio of Fe to P, namely Fe/P, is in the range from 0.5 to 6.0 and the volume fraction and the number of dispersoids of 1 to 20 nm in average particle diameter in the microstructure of the copper alloy are 1.0% or more and 300 pieces/μm2 or more, respectively. The Cu—Fe—P alloy can secure a high strength and a high conductivity simultaneously.

摘要翻译： 公开了含有0.01〜0.5％的Fe和0.01〜0.3质量％的P的铜合金，余量由铜和不可避免的杂质构成，Fe与P的质量含量比Fe / P为 0.5〜6.0，铜合金的组织中的平均粒径为1〜20nm的分散体的体积分数和数量分别为1.0％以上且300个/μm2以上， 分别。 Cu-Fe-P合金可以同时确保高强度和高导电性。

公开(公告)号：US08357248B2

公开(公告)日：2013-01-22

申请号：US13491911

申请日：2012-06-08

申请人： Yasuhiro Aruga ,  Akira Fugono ,  Takeshi Kudo ,  Katsura Kajihara

发明人： Yasuhiro Aruga ,  Akira Fugono ,  Takeshi Kudo ,  Katsura Kajihara

IPC分类号： C22C9/02 ,  C22C9/04 ,  C22C9/06

CPC分类号： H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

摘要： A copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

摘要翻译： 铜合金具有高强度，高导电性和优异的弯曲性，该铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。 根据本发明，可以提供高强度，高导电性和优异的弯曲性的铜合金。

公开(公告)号：US20120288402A1

公开(公告)日：2012-11-15

申请号：US13491911

申请日：2012-06-08

申请人： Yasuhiro ARUGA ,  Akira FUGONO ,  Takeshi KUDO ,  Katsura KAJIHARA

发明人： Yasuhiro ARUGA ,  Akira FUGONO ,  Takeshi KUDO ,  Katsura KAJIHARA

IPC分类号： C22C9/06 ,  C22C9/02 ,  C22C9/04

CPC分类号： H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

摘要： A copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

摘要翻译： 铜合金具有高强度，高导电性和优异的弯曲性，该铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。 根据本发明，可以提供高强度，高导电性和优异的弯曲性的铜合金。

公开(公告)号：US20120175026A1

公开(公告)日：2012-07-12

申请号：US13428013

申请日：2012-03-23

申请人： Yasuhiro AGRUGA ,  Katsura Kajihara ,  Takeshi Kudo

发明人： Yasuhiro AGRUGA ,  Katsura Kajihara ,  Takeshi Kudo

IPC分类号： C22F1/08 ,  C22C9/01 ,  C22C9/04 ,  C22C9/02 ,  C22C9/00 ,  C22C9/06

CPC分类号： C22F1/08 ,  B21B2003/005 ,  B22D11/004 ,  B22D21/025 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/06

摘要： The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability.

摘要翻译： 本发明提供一种具有高强度，高导电性和优异的弯曲加工性的Cu-Fe-P合金。 铜合金含有0.01〜1.0％的Fe，0.01〜0.4％的P，0.1〜1.0％的Mg，余量为Cu和不可避免的杂质。 控制铜合金中包含Mg的氧化物和析出物的大小，使得通过规定的提取残渣法，通过规定的测定方法测定的Mg量与所述铜合金中的Mg含量之比为60％ 以下，从而赋予合金高强度和优异的弯曲加工性。

公开(公告)号：US20100101748A1

公开(公告)日：2010-04-29

申请号：US12529030

申请日：2008-02-20

申请人： Hideo Hata ,  Katsura Kajihara ,  Shigenobu Namba ,  Hiroyuki Takeda ,  Mamoru Nagao

发明人： Hideo Hata ,  Katsura Kajihara ,  Shigenobu Namba ,  Hiroyuki Takeda ,  Mamoru Nagao

IPC分类号： B22D23/00 ,  C22C21/10

CPC分类号： B22D21/007 ,  C22C1/0416 ,  C22C21/10 ,  C22F1/002 ,  C22F1/053

摘要： An object of the present invention is to provide an Al—Zn—Mg—Cu 7000-series Al alloy having high ductility as well as having high strength. For attaining this purpose, an Al alloy having a structure in which an inclusion is not included is produced by reducing an amount of oxygen contained in an Al alloy that is obtained by solidifying a preform resulting from rapid solidification by preferably spray forming a molten metal of an Al—Zn—Mg—Cu 7000-series Al alloy with an inert gas. This Al alloy has, as mechanical properties at an ordinary temperature, a tensile strength of 600 MPa or more, and an elongation of 15% or more when the tensile strength is from 600 MPa or more and less than 800 MPa or an elongation of 10% or more when the tensile strength is 800 MPa or more, and is excellent in cold workability such as rollability.

摘要翻译： 本发明的目的是提供具有高延展性和高强度的Al-Zn-Mg-Cu 7000系Al合金。 为了达到这个目的，通过减少Al合金中所含的氧的量，通过使由快速凝固而形成的预成型体固化而得到的氧的量优选地喷射形成熔融金属 具有惰性气体的Al-Zn-Mg-Cu 7000系Al合金。 当该拉伸强度为600MPa以上且小于800MPa时，拉伸强度为600MPa以上，伸长率为15％以上时，作为常温下的机械特性， 拉伸强度为800MPa以上时的％以上，冷加工性，例如滚动性优异。

公开(公告)号：US20090101243A1

公开(公告)日：2009-04-23

申请号：US12297069

申请日：2007-05-23

申请人： Yasuhiro Aruga ,  Akira Fugono ,  Takeshi Kudo ,  Katsura Kajihara

发明人： Yasuhiro Aruga ,  Akira Fugono ,  Takeshi Kudo ,  Katsura Kajihara

IPC分类号： C22C9/02 ,  C22C9/06 ,  C22C9/04

CPC分类号： H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

摘要翻译： 本发明涉及一种具有高强度，高导电性和优异的弯曲性的铜合金，铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。 根据本发明，可以提供高强度，高导电性和优异的弯曲性的铜合金。