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    COPPER ALLOY HAVING HIGH STRENGTH, HIGH ELECTRIC CONDUCTIVITY AND EXCELLENT BENDING WORKABILITY
    1.
    发明申请
    COPPER ALLOY HAVING HIGH STRENGTH, HIGH ELECTRIC CONDUCTIVITY AND EXCELLENT BENDING WORKABILITY 审中-公开
    铜合金具有高强度，高电导率和优异的弯曲工作性能

    公开(公告)号：US20130045130A1

    公开(公告)日：2013-02-21

    申请号：US13491942

    申请日：2012-06-08

    申请人： Yasuhiro ARUGA ,  Akira FUGONO ,  Takeshi KUDO ,  Katsura KAJIHARA

    发明人： Yasuhiro ARUGA ,  Akira FUGONO ,  Takeshi KUDO ,  Katsura KAJIHARA

    IPC分类号： C22C9/06 ,  C22C9/04 ,  C22C9/02 ,  C22C9/10

    CPC分类号： H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

    摘要： The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer.

    摘要翻译： 本发明涉及一种具有高强度，高导电性和优异的弯曲性的铜合金，铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。

    COPPER ALLOY HAVING HIGH STRENGTH, HIGH ELECTRIC CONDUCTIVITY AND EXCELLENT BENDING WORKABILITY
    2.
    发明申请
    COPPER ALLOY HAVING HIGH STRENGTH, HIGH ELECTRIC CONDUCTIVITY AND EXCELLENT BENDING WORKABILITY 有权
    铜合金具有高强度，高电导率和优异的弯曲工作性能

    公开(公告)号：US20120288402A1

    公开(公告)日：2012-11-15

    申请号：US13491911

    申请日：2012-06-08

    申请人： Yasuhiro ARUGA ,  Akira FUGONO ,  Takeshi KUDO ,  Katsura KAJIHARA

    发明人： Yasuhiro ARUGA ,  Akira FUGONO ,  Takeshi KUDO ,  Katsura KAJIHARA

    IPC分类号： C22C9/06 ,  C22C9/02 ,  C22C9/04

    CPC分类号： H01B1/026 ,  C22C1/06 ,  C22C9/00 ,  C22C9/02 ,  C22C9/06 ,  C22C9/10 ,  C22F1/00 ,  C22F1/08 ,  H01H1/025

    摘要： A copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

    摘要翻译： 铜合金具有高强度，高导电性和优异的弯曲性，该铜合金以质量％计含有0.4〜4.0％的Ni; 0.05〜1.0％的Si; 作为元素M，选自0.005〜0.5％的P，0.005〜1.0％的Cr和0.005〜1.0％的Ti，其余为铜和不可避免的杂质，其中原子数比M / 在铜合金的组织中，尺寸为50〜200nm的析出物中含有的元素M和Si的Si平均为0.01〜10，原子数比通过场致发射透射电子显微镜测定，放大率 30,000和能量色散分析仪。 根据本发明，可以提供高强度，高导电性和优异的弯曲性的铜合金。

    COPPER ALLOY HAVING HIGH STRENGTH AND HIGH SOFTENING RESISTANCE
    3.
    发明申请
    COPPER ALLOY HAVING HIGH STRENGTH AND HIGH SOFTENING RESISTANCE 审中-公开
    铜合金具有高强度和高抗电阻性能

    公开(公告)号：US20080025867A1

    公开(公告)日：2008-01-31

    申请号：US11756117

    申请日：2007-05-31

    申请人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Katsura Kajihara

    发明人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Katsura Kajihara

    IPC分类号： C22C9/02

    CPC分类号： C22C9/02 ,  C22C9/00 ,  C22C9/04 ,  C22F1/08 ,  H01L23/49579 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed is a Cu—Fe—P alloy capable of enabling high strength, high electrical conductivity, and excellent softening resistance to coexist. The Cu—Fe—P alloy is suitable for use as a constituent material of a lead frame for a semiconductor device. With the Cu—Fe—P alloy with strength rendered higher by micronizing Fe-containing compounds, when enhancing softening resistance by increasing Sn content so as to exceed 0.5 mass %, at least one element selected from the group consisting of Ni, Mg, Ca, Al, Si, and Cr, in trace amounts, are caused to be additionally contained to thereby check cracking likely to occur at the time of forging and hot rolling in a process of producing the copper alloy, as a result of an increase in the Sn content.

    摘要翻译： 公开了能够实现高强度，高导电性和优异的耐软化性共存的Cu-Fe-P合金。 Cu-Fe-P合金适用于半导体器件的引线框架的构成材料。 对于通过使含Fe化合物微粉化而使强度提高的Cu-Fe-P合金，当通过使Sn含量增加超过0.5质量％来提高耐软化性时，选自Ni，Mg，Ca ，Al，Si和Cr的微量添加，从而可以检测在铜合金的制造过程中在锻造和热轧时容易发生的裂纹，结果是 Sn含量。

    COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PART
    5.
    发明申请
    COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PART 审中-公开
    电力电子部件铜合金板

    公开(公告)号：US20120308429A1

    公开(公告)日：2012-12-06

    申请号：US13585076

    申请日：2012-08-14

    申请人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Yosuke Miwa

    发明人： Yasuhiro ARUGA ,  Ryoichi Ozaki ,  Yosuke Miwa

    IPC分类号： C22C9/02

    CPC分类号： C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22F1/00 ,  C22F1/08 ,  H01L2924/0002 ,  H05K1/09 ,  H05K2201/0355 ,  H01L2924/00

    摘要： A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width β of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.

    摘要翻译： 剪切平面比减小了位错密度，其中通过将半值宽度＆bgr; Cu-Fe-P合金板表面的{311}面的衍射强度的峰值高度H为0.015以上。 另外，具有Fe含量较低的Cu-Fe-P合金板具有（I（200））与（I（200））衍射强度的比（I（200）/ I（220） （220））的衍射强度为0.3以下。 此外，具有Fe含量较低的Cu-Fe-P合金板具有通过FE-SEM使用EBSP的结晶取向分析法测定的黄铜取向的取向分布密度为25％的结构， 更多; 并且片材中的平均粒径为6.0μm以下。

    COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PARTS
    7.
    发明申请
    COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PARTS 审中-公开
    电力电子部件铜合金板

    公开(公告)号：US20120039741A1

    公开(公告)日：2012-02-16

    申请号：US13282823

    申请日：2011-10-27

    申请人： Yasuhiro ARUGA ,  Ryoichi OZAKI ,  Yosuke MIWA

    发明人： Yasuhiro ARUGA ,  Ryoichi OZAKI ,  Yosuke MIWA

    IPC分类号： C22C9/00 ,  C22C9/04 ,  C22C9/02

    CPC分类号： C22C9/04 ,  C22C9/00 ,  C22C9/02 ,  C22F1/08 ,  H01L23/49579 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 μm or less and a maximum height Rmax is 1.5 μm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

    摘要翻译： 提供具有高强度并且具有改善的氧化膜剥离性的Cu-Fe-P合金板，以解决诸如包装裂纹和剥离等问题。 本发明的电气电子部件用铜合金板是含有Fe：0.01〜0.50质量％，P：0.01〜0.15质量％，余量为Cu和不可避免的杂质的铜合金板。 中心线平均粗糙度Ra为0.2μm以下，最大高度Rmax为1.5μm以下，粗糙度曲线的峰值（度峰值）Rku为5.0以下，根据 JIS B0601。