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公开(公告)号：US20090095418A1
公开(公告)日：2009-04-16
申请号：US12242453
申请日：2008-09-30
IPC分类号： B29C71/04
CPC分类号： H01L21/67132 , Y10T156/1158 , Y10T156/19
摘要： The ultraviolet ray is applied on the surface of the protective tape from an ultraviolet ray generator. In addition, the ultraviolet ray having intensity higher than that from the ultraviolet ray generator is applied on spot on the wafer edge by an irradiation gun. In this case, the ultraviolet ray intensity and the rotation speed of the holding table are controlled by a controller so that the ultraviolet irradiation amount per unit area of the wafer edge portion becomes equal to that to the joining surface of the protective tape.
摘要翻译： 紫外线从紫外线发生器施加在保护带的表面上。 此外，通过照射枪在晶片边缘上点上施加强度高于紫外线发生器的紫外线。 在这种情况下，通过控制器控制保持台的紫外线强度和旋转速度，使得晶片边缘部的每单位面积的紫外线照射量与保护带的接合面相等。
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2.发明授权公开(公告)号：US07078262B2
公开(公告)日：2006-07-18
申请号：US10303816
申请日：2002-11-26
CPC分类号： H01L21/67748 , H01L21/67132 , H01L21/6838 , Y10S414/135
摘要： A wafer formed thin through a back grinding process is placed on a support table included in an alignment stage. When a faulty suction is caused by a warp of the wafer, a surface of wafer is pressed by a pressing plate to be corrected and held by suction. The wafer held by suction is transported, along with the alignment stage, to a mount frame preparing unit at the next step. The wafer is received while being held by suction by a chuck table contacting the surface of wafer.
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公开(公告)号：US6099675A
公开(公告)日：2000-08-08
申请号：US203497
申请日：1998-12-01
申请人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
发明人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
CPC分类号： B29C63/0013 , Y10S156/922 , Y10T156/11
摘要： An adhesive tape is applied to an article covered with a resist pattern. The article with the adhesive tape applied thereto is rapidly cooled to form cracks in the resist pattern on the surface of the article to weaken the cohesion between the resist pattern and the surface of the article. After the cooling, the adhesive tape is separated from the article, whereby the resist pattern is removed with the adhesive tape from the surface of the article.
摘要翻译： 将粘合带施加到被抗蚀图案覆盖的物品上。 施加有胶粘带的制品被快速冷却以在制品的表面上的抗蚀剂图案中形成裂纹，以削弱抗蚀剂图案和制品的表面之间的内聚力。 冷却后，粘合带与制品分离，由此用胶带从制品的表面除去抗蚀剂图案。
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公开(公告)号：US06235144B1
公开(公告)日：2001-05-22
申请号：US09203263
申请日：1998-12-01
申请人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
发明人： Masayuki Yamamoto , Makoto Namikawa , Eiji Toyoda , Shigeji Kuroda , Saburo Miyamoto , Takao Matsushita
IPC分类号： B32B3500
CPC分类号： H01L21/67132 , B08B7/00 , B08B7/0028 , B08B7/0035 , B29C63/0013 , G03F7/42 , Y10T156/11 , Y10T156/1158 , Y10T156/1189
摘要： A resist removing apparatus for removing an unwanted resist pattern from a surface of wafer W by applying an adhesive tape to the surface of wafer W having the resist patterns formed thereon, and separating the adhesive tape from the surface of wafer W. The apparatus includes an adhesive removing mechanism 13 for treating the surface of wafer W after the adhesive tape is separated therefrom. The adhesive removing mechanism 13 may be effective when constructed to jet ozone to the surface of wafer W heated, to irradiate the surface of wafer W heated, with ultraviolet rays, or to jet ozone to the surface of wafer W heated and irradiate the surface with ultraviolet rays.
摘要翻译： 一种抗蚀剂去除装置，用于通过在其上形成有抗蚀剂图案的晶片W的表面上涂布粘合带，从晶片W的表面除去不需要的抗蚀剂图案，并将粘合带从晶片W的表面分离。该装置包括： 粘合剂去除机构13，用于在粘合带分离之后处理晶片W的表面。 当粘合剂去除机构13被构造成将臭氧喷射到被加热的晶片W的表面上，以紫外线照射加热的晶片W的表面，或者将臭氧喷射到加热并照射表面的晶片W的表面时， 紫外线。
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公开(公告)号：US07789988B2
公开(公告)日：2010-09-07
申请号：US11723239
申请日：2007-03-19
CPC分类号： B29C63/0013 , H01L21/67132 , Y10T156/1089 , Y10T156/1184 , Y10T156/1961
摘要： A peripheral edge of a protective tape joined to a front face of a semiconductor wafer is snagged on a needle having a sharp tip end so as to be partially separated from the front face of the semiconductor wafer; thus, a separated portion is formed. Next, an operation of joining a separating tape to a surface of the protective tape is started from the separated portion, and the protective tape is separated together with the separating tape from the front face of the semiconductor wafer with the separated portion as a starting end.
摘要翻译： 连接到半导体晶片的前表面的保护带的外围边缘被阻塞在具有尖锐尖端的针上，从而与半导体晶片的前表面部分地分离; 因此，形成分离部分。 接下来，从分离部开始将分离带接合到保护带的表面的操作，并且保护带与分离带从半导体晶片的前表面分离，分离部分作为起始端 。
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公开(公告)号：US20070284038A1
公开(公告)日：2007-12-13
申请号：US11723239
申请日：2007-03-19
IPC分类号： B32B37/02
CPC分类号： B29C63/0013 , H01L21/67132 , Y10T156/1089 , Y10T156/1184 , Y10T156/1961
摘要： A peripheral edge of a protective tape joined to a front face of a semiconductor wafer is snagged on a needle having a sharp tip end so as to be partially separated from the front face of the semiconductor wafer; thus, a separated portion is formed. Next, an operation of joining a separating tape to a surface of the protective tape is started from the separated portion, and the protective tape is separated together with the separating tape from the front face of the semiconductor wafer with the separated portion as a starting end.
摘要翻译： 连接到半导体晶片的前表面的保护带的外围边缘被阻塞在具有尖锐尖端的针上，从而与半导体晶片的前表面部分地分离; 因此，形成分离部分。 接下来，从分离部开始将分离带接合到保护带的表面的操作，并且保护带与分离带从半导体晶片的前表面分离，分离部分作为起始端 。
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公开(公告)号：US5759336A
公开(公告)日：1998-06-02
申请号：US746647
申请日：1996-11-13
IPC分类号： B08B7/00 , G03F7/42 , H01L21/027 , H05K3/00 , H01L21/30
CPC分类号： B08B7/0028 , G03F7/427 , H05K3/0079 , Y10T156/1189
摘要： A resist removing apparatus for removing unnecessary resist patterns from articles such as semiconductor substrates efficiently by using adhesive tape. A tape applicator unit is movable horizontally to apply the adhesive tape in strip form to a wafer supported on an applicator table. Then, a set of the tape applicator unit and a tape separator unit and a set of the applicator table and a separator table are moved horizontally relative to each other to shift the separator table under the wafer supported through the adhesive tape. A next wafer is transported to and placed on the applicator table in an unloaded state. The tape applicator unit and tape separator unit are moved horizontally and simultaneously to apply the adhesive tape to the wafer on the applicator table and separate the adhesive tape from the wafer on the separator table at the same time.
摘要翻译： 一种抗蚀剂去除装置，通过使用胶粘带有效地去除了诸如半导体衬底的物品的不必要的抗蚀剂图案。 带施加器单元可水平移动以将带状的粘合带施加到支撑在施加器台上的晶片。 然后，一组带施加器单元和带分离器单元以及一组施加器台和分离器台相对于彼此水平移动，以使分离台在通过胶带支撑的晶片下移动。 下一个晶片在卸载状态下被运送到敷料台上并放置在敷料台上。 带施加器单元和带分离器单元水平地和同时移动，以将粘合带施加到施加器台上的晶片上，同时将胶带与分离器台上的晶片分离。
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公开(公告)号：US6090879A
公开(公告)日：2000-07-18
申请号：US862045
申请日：1997-05-22
申请人： Osamu Takuman , Takao Matsushita
发明人： Osamu Takuman , Takao Matsushita
CPC分类号： C08K9/06
摘要： A silicone rubber composition for application as electrical insulation that cures into a highly water-resistant silicone rubber that has excellent electrical properties and in particular has excellent high-voltage electrical insulation properties. The silicone rubber composition comprises(A) polyorganosiloxane,(B) surface-treated aluminum hydroxide powder surface treated with an organosilane or organosilazane, and(C) curing agent.Also, the composition afforded by the addition of 1 to 200 weight parts (D) microparticulate silica to components (A) to (C).
摘要翻译： 一种用作电绝缘的硅橡胶组合物，其固化成具有优异电性能的高度防水的硅橡胶，特别是具有优异的高压电绝缘性能。 硅橡胶组合物包含（A）聚有机硅氧烷，（B）用有机硅烷或有机硅氮烷处理的表面处理的氢氧化铝粉末表面，和（C）固化剂。 而且，通过向组分（A）至（C）中加入1至200重量份（D）微粒二氧化硅得到的组合物。
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公开(公告)号：US4891393A
公开(公告)日：1990-01-02
申请号：US225324
申请日：1988-07-28
申请人： Kazuo Hirai , Takao Matsushita
发明人： Kazuo Hirai , Takao Matsushita
IPC分类号： C08K3/36 , C08K9/06 , C08L83/04 , C08L83/05 , C08L83/07 , C09J183/00 , C09J183/04
摘要： A thermosetting organopolysiloxane composition made from organopolysiloxane gum, reinforcing silica having at least two weight percent methoxy groups, organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms per molecule, and a curing catalyst, such as organic peroxide or platinum catalyst, exhibit improved adhesion to a variety of substrates such as glasses, metals, and plastics.
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10.发明授权
公开(公告)号：US4448840A
公开(公告)日：1984-05-15
申请号：US503933
申请日：1983-06-13
申请人： Takao Matsushita
发明人： Takao Matsushita
CPC分类号： H01B3/46 , C08L83/04 , C08G77/12 , C08G77/20 , C08G77/24 , C08G77/70 , Y10T428/31612 , Y10T428/31652 , Y10T428/31663 , Y10T442/2107 , Y10T442/2475
摘要： A silicone rubber sheet which is both electrically insulating and thermally radiating is prepared by treating a network insulating material, such as glass fabric, with an alkoxysilane and then coating the resulting network insulating material with a fluid silicone rubber composition of an aliphatically unsaturated polyorganosiloxane, a polyorganohydrogensiloxane, alumina powder, and a platinum-group compound catalyst. The rubber sheets have improved bending resistance.
摘要翻译： 通过用烷氧基硅烷处理诸如玻璃织物的网状绝缘材料，然后用脂族不饱和聚有机硅氧烷的流体硅橡胶组合物涂覆所得的网状绝缘材料，制备电绝缘和热辐射的硅橡胶片， 聚有机氢硅氧烷，氧化铝粉末和铂族化合物催化剂。 橡胶片具有改进的抗弯曲性。
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