公开(公告)号：US20090181542A1

公开(公告)日：2009-07-16

申请号：US11972303

申请日：2008-01-10

申请人： Wen-Shun Lo ,  Chih-Jung Ni ,  Yi-Tung Lin

发明人： Wen-Shun Lo ,  Chih-Jung Ni ,  Yi-Tung Lin

IPC分类号： H01L21/3065

CPC分类号： H01L21/02063 ,  H01L21/02068 ,  H01L21/76805 ,  H01L21/76814 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/04941 ,  H01L2924/14

摘要： A method of forming a bonding pad opening is provided. A passivation layer and a mask layer are sequentially formed on a substrate having a bonding pad formed thereon. Thereafter, the passivation layer is etched to form an opening with use of an anti-reflection coating (ARC) layer of the bonding pad as an etching stop layer. Next, a dry removal process is performed to remove the mask layer. Afterwards, a wet cleaning process is performed to remove the residual mask layer or a polymer produced by previous manufacturing processes. Thereafter, the ARC layer is removed through performing an etching process with use of the passivation layer as a hard mask layer, so as to form the bonding pad opening.

摘要翻译： 提供了形成焊盘开口的方法。 钝化层和掩模层依次形成在其上形成有焊盘的基板上。 此后，使用焊盘的防反射涂层（ARC）层作为蚀刻停止层来蚀刻钝化层以形成开口。 接下来，进行干移除处理以除去掩模层。 之后，进行湿式清洗处理以去除残留的掩模层或由先前的制造工艺生产的聚合物。 此后，通过使用钝化层作为硬掩模层进行蚀刻工艺去除ARC层，以形成焊盘开口。

公开(公告)号：US06772528B2

公开(公告)日：2004-08-10

申请号：US10200497

申请日：2002-07-23

申请人： Ming Fa Tsai ,  Shan Chang Wang ,  Yi-Tung Lin

发明人： Ming Fa Tsai ,  Shan Chang Wang ,  Yi-Tung Lin

IPC分类号： G01B502

CPC分类号： G01B5/0007

摘要： An incremental offset measuring instrument is provided. The incremental offset measuring instrument includes a main base; a specimen seat mounted on the main base for resting a specimen; a measuring tool assembly for measuring the specimen; and a movable assembly mounted on the main base, wherein the movable assembly carries the measuring tool assembly, thereby achieving the goal of measuring the specimen.

公开(公告)号：US07585754B2

公开(公告)日：2009-09-08

申请号：US11972303

申请日：2008-01-10

申请人： Wen-Shun Lo ,  Chih-Jung Ni ,  Yi-Tung Lin

发明人： Wen-Shun Lo ,  Chih-Jung Ni ,  Yi-Tung Lin

IPC分类号： H01L21/00 ,  H01L29/40

CPC分类号： H01L21/02063 ,  H01L21/02068 ,  H01L21/76805 ,  H01L21/76814 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/05624 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/04941 ,  H01L2924/14

摘要： A method of forming a bonding pad opening is provided. A passivation layer and a mask layer are sequentially formed on a substrate having a bonding pad formed thereon. Thereafter, the passivation layer is etched to form an opening with use of an anti-reflection coating (ARC) layer of the bonding pad as an etching stop layer. Next, a dry removal process is performed to remove the mask layer. Afterwards, a wet cleaning process is performed to remove the residual mask layer or a polymer produced by previous manufacturing processes. Thereafter, the ARC layer is removed through performing an etching process with use of the passivation layer as a hard mask layer, so as to form the bonding pad opening.

摘要翻译： 提供了形成焊盘开口的方法。 钝化层和掩模层依次形成在其上形成有焊盘的基板上。 此后，使用焊盘的防反射涂层（ARC）层作为蚀刻停止层来蚀刻钝化层以形成开口。 接下来，进行干移除处理以除去掩模层。 之后，进行湿式清洗处理以去除残留的掩模层或由先前的制造工艺生产的聚合物。 此后，通过使用钝化层作为硬掩模层进行蚀刻工艺去除ARC层，以形成焊盘开口。