公开(公告)号：US06313413B1

公开(公告)日：2001-11-06

申请号：US09414584

申请日：1999-10-08

申请人： Kun-Ching Chen ,  Yire-Zine Lee ,  Yung-I Yeh ,  Su Tao

发明人： Kun-Ching Chen ,  Yire-Zine Lee ,  Yung-I Yeh ,  Su Tao

IPC分类号： H05K111

CPC分类号： H01L23/49838 ,  H01L23/13 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The substrate of the present invention mainly includes a plurality of bonding pads, a plurality of ball pads, a plurality of traces, a plurality of holes, a first wire and a second wire. The bonding pads and ball pads are located on a first surface of the substrate and are connected to one another by the traces. The first wire is arranged at the edge of the first surface of the substrate, the second wire is arranged at a slot area of a second surface of the substrate which is adhesively covered by a solder mask and further has two ends connecting to the first wire. The holes connect the first surface to the second surface. The traces are connected the bonding pads and ball pads of the first surface by passing through the corresponding holes and a slot area to the second wire of the second surface to form closed loops. In the slot area, the solder mask adhesively covers the traces. During the slot sawing processes of the slot area, some parts of the traces in the slot area and the second wire are cut to form an opened loop. Then the ends of the traces at the edge of the slot area have little lateral malleability. Thus the adjacent ends of traces cannot be connected to one another; so the substrate of the present invention can use the socket of the test machine to increase efficiency.

摘要翻译： 本发明的基板主要包括多个接合焊盘，多个焊盘，多个焊盘，多个孔，第一焊丝和第二焊丝。 接合焊盘和焊盘位于衬底的第一表面上，并通过迹线彼此连接。 第一线布置在基板的第一表面的边缘处，第二布线布置在基板的第二表面的狭缝区域，该第二表面被焊接掩模粘合，并且还具有连接到第一布线的两个端部 。 孔将第一表面连接到第二表面。 迹线通过穿过对应的孔和槽区域连接到第一表面的接合焊盘和球焊盘到第二表面的第二线，以形成闭环。 在插槽区域，焊接掩模粘合地覆盖迹线。 在缝隙区域的槽锯工艺过程中，槽区域中的迹线的一些部分和第二线被切割以形成开环。 然后在狭槽区域的边缘处的迹线的端部具有很小的侧向延展性。 因此，迹线的相邻端不能彼此连接; 因此本发明的基板可以使用试验机的插座来提高效率。

公开(公告)号：US06204559B1

公开(公告)日：2001-03-20

申请号：US09444365

申请日：1999-11-22

申请人： Chun Hung Lin ,  Yire Zine Lee ,  Su Tao ,  Jian Wen Chen

发明人： Chun Hung Lin ,  Yire Zine Lee ,  Su Tao ,  Jian Wen Chen

IPC分类号： H01L2352

CPC分类号： H01L23/4985 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： This invention moves at least one outer via outwardly to a location under the edge of the chip so as to form an offset via. Since the via is made of copper, the offset via provides sufficient supporting strength for the chip edge during molding process. Further, this invention also disposes a copper mesh on the substrate at the area without vias and traces so as to enhance the substrate strength for supporting the chip. According to another aspect of this invention, dummy via holes are provided for the substrate at the area under the chip edge for supporting the chip. Since the copper mesh, offset via, the dummy via hole are made of copper having sufficient supporting strength for the chip, the crack problem during molding process can be eliminated.

摘要翻译： 本发明将至少一个外部通孔向外移动到芯片边缘下方的位置，以形成偏移通孔。 由于通孔由铜制成，偏移通孔在成型过程中为芯片边缘提供足够的支撑强度。 此外，本发明还在没有通孔和迹线的区域上在基板上配置铜网，以增强用于支撑芯片的基板强度。 根据本发明的另一方面，在用于支撑芯片的芯片边缘下方的区域处为基板设置虚设通孔。 由于铜网，偏移通孔，虚拟通孔由具有足够的支撑强度的铜制成，因此可以消除模制过程中的裂纹问题。